Abstract: A conductive adhesive composition is obtained by mixing a binder resin with 30-98 wt % based on the adhesive composition of a silver powder as a conductive agent. The silver powder contains a silver powder consisting of flat primary particles and having a massive agglomerate structure and a tap density of 0.1-1.5 g/cm3 in an amount of 30-98 wt % based on the adhesive composition. The conductive adhesive composition cures into a product having improved conductivity, adhesion, heat resistance, moisture resistance, ease of working and heat transfer.

Abstract: In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.

Abstract: A conductive resin composition primarily comprising (A) 100 parts by weight of a thermosetting or thermoplastic resin, (B) 5–2,000 parts by weight of a conductive filler, and (C) 0.1–300 parts by weight of organic resin or rubber particulates has a low volume resistivity and stability thereof, and is effectively adherent. When applied to semiconductor packages, the composition can prevent the semiconductor chips from warpage or cracking due to thermal stresses in the semiconductor packages, ensuring the fabrication of semiconductor devices with high reliability.

Abstract: A silicon composition as described below, which is suitable for sealing semiconductors, is provided. The silicone composition comprises (A) a diorganopolysiloxane with at least two alkenyl groups bonded to silicon atoms, (B) an organohydrogenpolysiloxane with at least two hydrogen atoms bonded to silicon atoms, (C) an adhesion imparting constituent, (D) a platinum group metal based catalyst, and (E) a compound represented by a general formula (1): (wherein, R1 represents a monovalent hydrocarbon group of at least 10 carbon atoms, which may contain a hydroxyl group or an ether linkage). The silicon composition displays excellent adhesion to semiconductor chips, and enables the production of a semiconductor device with superior resistance to moisture permeation.

Abstract: A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a phenolic hydroxyl radical. The polyimide resin and a composition comprising the polyimide resin, an epoxy resin and a curing agent are suited for use as varnish, adhesive and adhesive film for which adhesion and heat resistance are required.

Abstract: A potting composition comprising (A) an organopolysiloxane having a vinyl group at an end of its molecular chain, (B) an organohydrogenpolysiloxane, (C) a platinum group metal catalyst, and optionally, (D) an organosilicon compound having a silicon atom-bonded alkoxy group. The cured product of the composition has a refractive index of 1.41-1.56 at 25° C. and 589 nm (sodium D line). The composition is suited for the embedment and protection of light-emitting semiconductor members. A package in which a light-emitting semiconductor member is embedded and protected with the potting composition undergoes little discoloration and maintains a high emission efficiency in heating tests, thus offering a light-emitting semiconductor device featuring a long life and energy saving.

Abstract: A potting composition comprising (A) an organopolysiloxane having a vinyl group at an end of its molecular chain, (B) an organohydrogenpolysiloxane, (C) a platinum group metal catalyst, and optionally, (D) an organosilicon compound having a silicon atom-bonded alkoxy group. The cured product of the composition has a refractive index of 1.41-1.56 at 25° C. and 589 nm (sodium D line). The composition is suited for the embedment and protection of light-emitting semiconductor members. A package in which a light-emitting semiconductor member is embedded and protected with the potting composition undergoes little discoloration and maintains a high emission efficiency in heating tests, thus offering a light-emitting semiconductor device featuring a long life and energy saving.

Abstract: In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.

Abstract: A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a phenolic hydroxyl radical. The polyimide resin and a composition comprising the polyimide resin, an epoxy resin and a curing agent are suited for use as varnish, adhesive and adhesive film for which adhesion and heat resistance are required.

Abstract: A conductive resin composition primarily comprising (A) 100 parts by weight of a thermosetting or thermoplastic resin, (B) 5-2,000 parts by weight of a conductive filler, and (C) 0.1-300 parts by weight of organic resin or rubber particulates has a low volume resistivity and stability thereof, and is effectively adherent. When applied to semiconductor packages, the composition can prevent the semiconductor chips from warpage or cracking due to thermal stresses in the semiconductor packages, ensuring the fabrication of semiconductor devices with high reliability.

Abstract: A silicone composition of a composition described below which is suitable for sealing semiconductors is provided.

Abstract: Semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a phenolic resin curing agent, a fire retardant comprising zinc molybdate carried on spherical silica having a mean particle diameter of 0.2-20 &mgr;m and a specific surface of 1-20 m2/g, and an inorganic filler are able to provide cured products having excellent fire retardance. The compositions have good flow and curing properties and excellent reliability and do not pose a hazard to human health or the environment.

Abstract: Semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a phenolic resin curing agent, a fire retardant comprising zinc molybdate carried on spherical silica having a mean particle diameter of 0.2-20 &mgr;m and a specific surface of 1-20 m2/g, and an inorganic filler are able to provide cured products having excellent fire retardance. The compositions have good flow and curing properties and excellent reliability and do not pose a hazard to human health or the environment.

Abstract: A corrosion-resistant copper material has a surface layer of a copper alloy containing 10-50 at % (i.e. % by atom) of silicon and of 10-1,000 .ANG. thick. It is produced simply by annealing a copper material containing 0.01-5 at % of silicon at 100-600.degree. C. in a hydrogen-containing gas. Because of its excellent resistance to surface corrosion due to heat and aging, the resulting copper material lends itself well to automotive and electrical applications requiring heat resistance, and is also suitable for use in electrical wire and in leadframes for semiconductor devices.

Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, there are blended a salt of trimellitic anhydride with 1,8-diazabicyclo(5.4.0)undecene-7 as a curing accelerator and a mercapto-containing silane coupling agent. The composition is shelf stable and smoothly flowing and cures into a product having improved adhesion, moisture resistance and electrical properties. The composition is suitable for the encapsulation of semiconductor devices.

Abstract: A silicone rubber composition is prepared by mixing 100 parts by weight of an alkenyl-containing organopolysiloxane having a degree of polymerization of at least 3,000 and 5 to 30 parts by weight of finely divided silica having a specific surface of at least 50 m.sup.2 /g with 0.5 to 10 parts by weight of an organopolysiloxane resin having a weight average molecular weight of 500 to 50,000, a OH group content of 0.0001 to 0.01 mol/g, and a liquefying temperature of 50.degree. to 150.degree. C., at a temperature above the liquefying temperature of the resin. The composition has high plasticity in an uncured base compound form and is effective for extrusion molding. The composition cures into silicone rubber having low hardness, good flexibility and excellent physical properties, finding a variety of applications.

Abstract: A curable silicone rubber composition contains (A) an organopolysiloxane raw rubber containing 0.01-1% by weight of vinyl and having a viscosity of 10.sup.3 -10.sup.6 poise at 25.degree. C., (B) an organopolysiloxane oil containing 0.1-10% by weight of vinyl and having a viscosity of 0.05-100 poise at 25.degree. C., (C) an organopolysiloxane copolymer composed mainly of a triorganosiloxy unit (M) and SiO.sub.2 unit (Q) in a molar ratio (M/Q) between 0.6 and 1.2 and containing 0.1-10% by weight of vinyl, (D) an organohydrogensiloxane containing at least three silylidyne groups, (E) a platinum catalyst, and (F) finely divided silica as essential components. The composition is hot air vulcanizable into a silicone rubber which is improved in hardness, modulus, tear strength and compression set.

Abstract: A impression composition comprising:(A) a polyether polymer having at least two alkenyl groups in its molecule,(B) a polyorganohydrogensiloxane having at least three silicon-bonded hydrogen atoms in its molecule,(C) a platinum catalyst,(D) an inorganic filler, and(E) an antioxidant.This composition of has hydrophilic nature and a small cure shrinkage; hence it enables precise impression in a wet environment like in a mouth.

Abstract: Silicone rubber compositions which comprise (A) an organopolysiloxane, which possesses at least one triorganosilyl-amine group expressed by the following equation (1) at its molecular end and a degree of polymerization which is at least 2000, and the silicone rubber compositions which further comprise (B) a fine powdered silica whose specific surface area is at least 50 m.sup.2 /g, ##STR1## wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4 and R.sup.5 are each a substituted or unsubstituted monovalent hydrocarbon group, each of which can be the same or different. The silicone rubber compositions are a non-fluidity type; therefore, they offer superior workability and formability. Further, silicone rubber obtained by the curing of the said compositions possess superior physical properties, extremely low hardness, flexibility, and good rubber elasticity, thus they are useful as raw materials of various products.

Abstract: A silicone rubber composition comprises:(A) an organopolysiloxane R.sub.a SiO.sub.(4-a)/2 having an average degree of polymerization of 3000 or greater, wherein R is a substituted or unsubstituted monovalent hydrocarbon group, and 0.0001-0.05 mol % of R is alkenyl; a is 1.95-2.05; and(B) a fine powder of hydrophobic silica, wherein the specific surface area is 50 m.sup.2 /g or greater, the silica surface includes hydrophobic groups f MesiO.sub.3/2 and Me.sub.2 SiO in a weight ratio (MeSiO.sub.3/2)/(Me.sub.2 SiO) or 5/95-95/5, and the total carbon content contained in the MeSiO.sub.3/2 and Me.sub.2 SiO groups account for 0.5 wt % of greater of the silica. A material obtained by hardening this rubber composition has desirable resistance to steam and LLC.