Abstract: A lead frame includes a base, a substantially rectangular device hole formed in the base, an island formed in the device hole and offset a predetermined distance from the base, a plurality of inner leads arranged at predetermined intervals to extend toward a pair of opposing edges of the island, and suspension pins formed to extend toward a pair of edges of the island not opposing the end portions of the inner leads. The island is used to mount a semiconductor chip, and the suspension pins connect the island and the base. A pair of dummy leads extended from the base toward the island is formed on the both sides of at least one suspension pin. The distance from the side edge of the suspension pin to the side edge of the dummy lead is equal to or smaller than the distance from the end portions of the inner leads to the side edge of the island.