Patents by Inventor Masae Ueda

Masae Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Organic inorganic composite material and utilization thereof
    Patent number: 8507630
    Abstract: The invention has an object to obtain an organic inorganic composite material having high activity and high selectivity, and suitable as a catalyst material having small elution of an active metal from a carrier, and further to obtain an organosilicon compound suitable for the preparation of the composite material. The composite material is an organic inorganic composite material comprising an organosilicon compound having at least two groups containing reactive silicon at a molecular end, bonded to one silicon atom constituting the organosilicon compound, and an inorganic oxide material, the organosilicon compound and the inorganic oxide material being bonded to each other through a plurality of groups containing reactive silicon of the organosilicon compound. The organosilicon compound is represented by the following general formula (1) or (2).
    Type: Grant
    Filed: March 5, 2009
    Date of Patent: August 13, 2013
    Assignees: National Institute of Advanced Industrial Science and Technology, N.E. Chemcat Corporation
    Inventors: Shun-ya Onozawa, Norihisa Fukaya, Kaori Saitou, Toshiyasu Sakakura, Hiroyuki Yasuda, Yukio Takagi, Masae Ueda
  • ORGANIC INORGANIC COMPOSITE MATERIAL AND UTILIZATION THEREOF
    Publication number: 20110004010
    Abstract: The invention has an object to obtain an organic inorganic composite material having high activity and high selectivity, and suitable as a catalyst material having small elution of an active metal from a carrier, and further to obtain an organosilicon compound suitable for the preparation of the composite material. The composite material is an organic inorganic composite material comprising an organosilicon compound having at least two groups containing reactive silicon at a molecular end, bonded to one silicon atom constituting the organosilicon compound, and an inorganic oxide material, the organosilicon compound and the inorganic oxide material being bonded to each other through a plurality of groups containing reactive silicon of the organosilicon compound. The organosilicon compound is represented by the following general formula (1) or (2). Formula (1) wherein symbols are the same as defined in claim 17. Formula (2) wherein symbols are the same as defined in claim 18.
    Type: Application
    Filed: March 5, 2008
    Publication date: January 6, 2011
    Applicants: National Instit of Advanced Indust Sci and Tech, N.E. Chemcat Corporation
    Inventors: Shun-ya Onozawa, Norihisa Fukaya, Kaori Saitou, Toshiyasu Sakakura, Hiroyuki Yasuda, Yukio Takagi, Masae Ueda