Patents by Inventor Masafumi Akagawa

Masafumi Akagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and fabrication process thereof
    Patent number: 7557029
    Abstract: A semiconductor device includes a conductive layer with a plurality of wires, and a bonding pad formed in a region overlapping with the plurality of wires of the conductive layer. One of the wires is connected to the bonding pad, and an insulating protective film is formed between the remaining wires and the bonding pad. The protective film is bridged between adjacent wires at least in a region overlapping with the bonding pad. As a result, the protective film on the wires forms a bridge structure, which is effective in preventing cracking at a lower portion of the protective film. Further, a void formed underneath the bridged portion serves as an air spring to prevent damage to the structural elements, such as the wires, formed under the protective film. Further, because a polyimide film, which serves as a shock absorber, is not required, working efficiency can be improved and chip cost can be reduced.
    Type: Grant
    Filed: October 17, 2005
    Date of Patent: July 7, 2009
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Masafumi Akagawa, Masahiro Horio
  • Semiconductor device and fabrication process thereof
    Publication number: 20060057834
    Abstract: A semiconductor device includes a conductive layer with a plurality of wires, and a bonding pad formed in a region overlapping with the plurality of wires of the conductive layer. One of the wires is connected to the bonding pad, and an insulating protective film is formed between the remaining wires and the bonding pad. The protective film is bridged between adjacent wires at least in a region overlapping with the bonding pad. As a result, the protective film on the wires forms a bridge structure, which is effective in preventing cracking at a lower portion of the protective film. Further, a void formed underneath the bridged portion serves as an air spring to prevent damage to the structural elements, such as the wires, formed under the protective film. Further, because a polyimide film, which serves as a shock absorber, is not required, working efficiency can be improved and chip cost can be reduced.
    Type: Application
    Filed: October 17, 2005
    Publication date: March 16, 2006
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Masafumi Akagawa, Masahiro Horio
  • Semiconductor device structure
    Patent number: 6977442
    Abstract: A semiconductor device includes a conductive layer with a plurality of wires, and a bonding pad formed in a region overlapping with the plurality of wires of the conductive layer. One of the wires is connected to the bonding pad, and an insulating protective film is formed between the remaining wires and the bonding pad. The protective film is bridged between adjacent wires at least in a region overlapping with the bonding pad. As a result, the protective film on the wires forms a bridge structure, which is effective in preventing cracking at a lower portion of the protective film. Further, a void formed underneath the bridged portion serves as an air spring to prevent damage to the structural elements, such as the wires, formed under the protective film. Further, because a polyimide film, which serves as a shock absorber, is not required, working efficiency can be improved and chip cost can be reduced.
    Type: Grant
    Filed: November 12, 2003
    Date of Patent: December 20, 2005
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Masafumi Akagawa, Masahiro Horio
  • Semiconductor device and fabrication process thereof
    Publication number: 20040256723
    Abstract: A semiconductor device includes a conductive layer with a plurality of wires, and a bonding pad formed in a region overlapping with the plurality of wires of the conductive layer. One of the wires is connected to the bonding pad, and an insulating protective film is formed between the remaining wires and the bonding pad. The protective film is bridged between adjacent wires at least in a region overlapping with the bonding pad. As a result, the protective film on the wires forms a bridge structure, which is effective in preventing cracking at a lower portion of the protective film. Further, a void formed underneath the bridged portion serves as an air spring to prevent damage to the structural elements, such as the wires, formed under the protective film. Further, because a polyimide film, which serves as a shock absorber, is not required, working efficiency can be improved and chip cost can be reduced.
    Type: Application
    Filed: November 12, 2003
    Publication date: December 23, 2004
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Masafumi Akagawa, Masahiro Horio