Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, and which includes a polymeric compound having a structural unit represented by general formula (a0-1) (wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; Va0 represents a divalent hydrocarbon group; na0 represents an integer of 0 to 2; Ra00 represents an acid dissociable group represented by general formula (a0-r1-1); Ra01 and Ra02 represents a hydrocarbon group; Ra01 and Ra02 may be mutually bonded to form a ring; Ya0 represents a quaternary carbon atom; Ra031, Ra032 and Ra033 each independently represents a hydrocarbon group, provided that at least one of Ra031, Ra032 and Ra033 is a hydrocarbon group having a polar group).

Abstract: A resist composition which generates an acid upon exposure and whose solubility in a developing solution is changed due to an action of the acid, the resist composition including a base material component whose solubility in a developing solution is changed due to the action of an acid; and a compound represented by Formula (d1) in which Rb1 and Rb2 each independently represents —COO?, —COOH, or a hydroxyl group, where at least one of Rb1 and Rb2 represents —COO?, Rb3, Rb4, and Rb5 each independently represents a hydroxyl group or a halogen atom, Rb6 to Rb8 each independently represents an alkyl group, nb3 represents an integer of 0 to 4, nb4 and nb5 each independently represents an integer of 0 to 2, nb6 to nb8 each independently represents an integer of 0 to 5, m represents 1 or 2, and q represents an integer of 0 to 3.

Abstract: A resist composition which generates an acid when exposed and whose solubility in a developer is changed by an action of an acid, the resist composition including: a base material component (A) whose solubility in a developer is changed by an action of an acid, in which the base material component (A) comprises a polymer compound (A1) having a constitutional unit (a01) represented by Formula (a0-1), a constitutional unit (a02) represented by Formula (a0-2), and a constitutional unit (a03) which is represented by Formula (a0-3) and has a structure different from the constitutional unit (a02).

Abstract: A resist composition including a resin component (A1) which exhibits changed solubility in a developing solution under action of acid, the resin component (A1) including a structural unit (a0) represented by general formula (a0-1) shown below (wherein Ya01 and Ya02 each independently represents a single bond or an alkylene group of 1 to 3 carbon atoms, provided that the total number of carbon atoms of Ya01 and Ya02 is 3 or less; Ra01 and Ra02 each independently represents a hydrogen atom or an alkyl group of 1 to 4 carbon atoms, provided that the total number of carbon atoms of Ra01 and Ra02 is 2 to 6; A? represents an alkylene group of 1 to 5 carbon atoms).

Abstract: A resist composition which generates an acid when exposed and whose solubility in a developer is changed by an action of an acid, the resist composition including: a base material component (A) whose solubility in a developer is changed by an action of an acid, in which the base material component (A) comprises a polymer compound (A1) having a constitutional unit (a01) represented by Formula (a0-1) and a constitutional unit (a1) which comprises an acid-decomposable group whose polarity is increased due to an action of an acid, and the constitutional unit (a1) comprises a constitutional unit containing an acid-dissociable group represented by Formula (a1-r-1) and a constitutional unit containing an acid-dissociable group represented by Formula (a1-r-2).

Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid includes a base component which exhibits changed solubility in a developing solution under action of acid, and a compound represented by general formula (D0-1) below, in which Ya01 represents an arylene group, an alkylene group, an alkenylene group or a divalent alicyclic group, provided that the divalent alicyclic group may contain a hetero atom in the alicyclic structure; R01 represents a linear or branched alkyl group. n01 represents 0 or 1.

Abstract: A resist composition including a base component which exhibits changed solubility in a developing solution under action of acid, and an amine compound represented by general formula (d0), and a carboxylic acid compound represented by general formula (e0), or a salt thereof, wherein Rd01, Rd02 and Rd03 each independently represents an aliphatic hydrocarbon group; Re01 represents an aliphatic hydrocarbon group having a fluorine atom; Ye01 represents a divalent linking group or a single bond.

Abstract: A resist composition which generates an acid upon exposure, and whose solubility in a developing solution is changed due to an action of the acid, the resist composition including a base material component whose solubility in the developing solution is changed due to the action of the acid, and an acid generator component which generates the acid upon exposure, in which the acid generator component contains two kinds of compounds.

Abstract: A method of recovering a defect portion of a resist pattern formed on a substrate including applying a shrinking agent composition so as to cover the resist pattern having the defect portion; forming a developing solution-insoluble region on the surface of the resist pattern; and developing the covered resist pattern, the shrinking agent composition including a polymeric compound (X) which is a homopolymer or a random copolymer.

Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, and which includes a polymeric compound having a structural unit represented by general formula (a0-1) (wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; Va0 represents a divalent hydrocarbon group; na0 represents an integer of 0 to 2; Ra00 represents an acid dissociable group represented by general formula (a0-r1-1); Ra01 and Ra02 represents a hydrocarbon group; Ra01 and Ra02 may be mutually bonded to form a ring; Ya0 represents a quaternary carbon atom; Ra031, Ra032 and Ra033 each independently represents a hydrocarbon group, provided that at least one of Ra031, Ra032 and Ra033 is a hydrocarbon group having a polar group).

Abstract: A resist composition which generates an acid upon exposure and whose solubility in a developing solution is changed due to an action of the acid, the resist composition including a base material component whose solubility in a developing solution is changed due to the action of an acid; and a compound represented by Formula (d1) in which Rb1 and Rb2 each independently represents —COO?, —COOH, or a hydroxyl group, where at least one of Rb1 and Rb2 represents —COO?, Rb3, Rb4, and Rb5 each independently represents a hydroxyl group or a halogen atom, Rb6 to Rb8 each independently represents an alkyl group, nb3 represents an integer of 0 to 4, nb4 and nb5 each independently represents an integer of 0 to 2, nb6 to nb8 each independently represents an integer of 0 to 5, m represents 1 or 2, and q represents an integer of 0 to 3.

Abstract: A resist composition which generates an acid when exposed and whose solubility in a developer is changed by an action of an acid, the resist composition including: a base material component (A) whose solubility in a developer is changed by an action of an acid, in which the base material component (A) comprises a polymer compound (A1) having a constitutional unit (a01) represented by Formula (a0-1), a constitutional unit (a02) represented by Formula (a0-2), and a constitutional unit (a03) which is represented by Formula (a0-3) and has a structure different from the constitutional unit (a02).

Abstract: A resist composition which generates an acid when exposed and whose solubility in a developer is changed by an action of an acid, the resist composition including: a base material component (A) whose solubility in a developer is changed by an action of an acid, in which the base material component (A) comprises a polymer compound (A1) having a constitutional unit (a01) represented by Formula (a0-1) and a constitutional unit (a1) which comprises an acid-decomposable group whose polarity is increased due to an action of an acid, and the constitutional unit (a1) comprises a constitutional unit containing an acid-dissociable group represented by Formula (a1-r-1) and a constitutional unit containing an acid-dissociable group represented by Formula (a1-r-2).

Abstract: A method of recovering a defect portion of a resist pattern formed on a substrate including applying a shrinking agent composition so as to cover the resist pattern having the defect portion; forming a developing solution-insoluble region on the surface of the resist pattern; and developing the covered resist pattern, the shrinking agent composition including a polymeric compound (X) which is a homopolymer or a random copolymer.