Patents by Inventor Masafumi Hatsushika

Masafumi Hatsushika has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ceramic circuit board with heat sink
    Patent number: 6033787
    Abstract: A ceramic circuit board with a heat sink which has a long life under heat cycles. First and second aluminum plates are laminated and bonded onto both sides of a ceramic substrate through Al--Si-based brazing solders, respectively. A heat sink formed of an AlSiC-based composite material is laminated and bonded onto a surface of the first aluminum plate. The ceramic substrate is formed of AlN, Si.sub.3 N.sub.4 or Al.sub.2 O.sub.3. An Al alloy in the heat sink has an Al purity of 80-99% by weight, and the first or second aluminum plate has an Al purity not less than 99.98% by weight. The heat sink is laminated and bonded onto the first aluminum plate through the Al alloy in the heat sink.
    Type: Grant
    Filed: August 22, 1997
    Date of Patent: March 7, 2000
    Assignee: Mitsubishi Materials Corporation
    Inventors: Toshiyuki Nagase, Yoshirou Kuromitsu, Kunio Sugamura, Yoshio Kanda, Masafumi Hatsushika, Masato Otsuki
  • Highly heat-radiating ceramic package
    Patent number: 5675474
    Abstract: Highly heat-radiating ceramic packages comprising a multi-layer ceramic wiring board 11 to one surface of which is bonded a heat-radiating ceramic base plate 13 with first and second aluminum plates 31 and 32 bonded to both surfaces thereof, via the first aluminum plate 31 are free from warping and cracking, and have improved heat-radiation performance and lower weight and manufacturing cost. The ceramic base plate 13 and the multi-layer ceramic wiring board 11 may be constructed with the same or different types of ceramic which are selected from the group consisting of alumina, glass ceramic, aluminum nitride, mullite, and silicon carbide. The two aluminum plates 31 and 32 are bonded to the ceramic base plate 13 with an Al-Si brazing material. Improved levels of heat radiation performance are accomplished by bonding a heat-radiating ceramic base plate with an aluminum plate bonded thereto, to a multi-layer wiring board prepared even by low-temperature sintering.
    Type: Grant
    Filed: July 17, 1995
    Date of Patent: October 7, 1997
    Assignee: Mitsubishi Materials Corporation
    Inventors: Toshiyuki Nagase, Yoshio Kanda, Yoshiro Kuromitu, Masafumi Hatsushika, Hirokazu Tanaka
  • Copper-base shape-memory alloys
    Patent number: 4472213
    Abstract: A copper-base shape-memory alloy having high resistance to fatigue failure as well as high ductility and, in particular, high deformability in the martensite phase is disclosed. The alloy consists essentially of 10-45% Zn, 1-10% Al, 0.05-2% Ti, 0.05-2% of one of Fe and Ni, the balance being Cu and incidental impurities, the percent being by weight.
    Type: Grant
    Filed: July 20, 1983
    Date of Patent: September 18, 1984
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Kazuhiko Tabei, Masafumi Hatsushika