Abstract: A component placement machine which picks up a component supplied by a tape feeder and installs the component on a board, includes a block part that includes a fitting hole to which a protrusion extending to a rear side from the tape feeder is fitted and a connection member that is provided in the block part, and connects the protrusion to the block part by elastically pressing a side surface of the protrusion fitted to the fitting hole.

Abstract: A bonding device is for bonding an object to be bonded under pressure to a surface to be bonded by allowing a load and vibration to act on the object to be bonded. The bonding device includes a bonding tool 14 abutting on the object to be bonded, and a pressing unit pressing the bonding tool to the object to be bonded. The bonding tool includes a transversely elongated horn, a vibrator 17 applying a longitudinal vibration to the horn 15 in a first direction along the longitudinal direction of the horn a protruding part 30 protruding from the horn in a second direction substantially perpendicular to the first direction, a bonding operation part 31 provided in the end part of the protruding part 30 to abut on the object to be bonded, and a heating unit inserted into a mounting hole provided in the horn. The heating unit is mounted into the mounting hole with a space maintained from the inner surface of the mounting hole.

Abstract: A bonding device is for bonding an object to be bonded under pressure to a surface to be bonded by allowing a load and vibration to act on the object to be bonded. The bonding device includes a bonding tool 14 abutting on the object to be bonded, and a pressing unit pressing the bonding tool to the object to be bonded. The bonding tool includes a traverse elongated horn, a vibrator 17 applying a longitudinal vibration to the horn 15 in a first direction along the longitudinal direction of the horn a protruding part 30 protruding from the horn in a second direction substantially perpendicular to the first direction, a bonding operation part 31 provided in the end part of the protruding part 30 to abut on the object to be bonded, and a heating unit inserted into a mounting hole provided in the horn. The heating unit is mounted into the mounting hole with a space maintained from the inner surface of the mounting hole.

Abstract: A bonding tool for bonding electronic components by ultrasonic vibration. The bonding tool includes a horn supported by two ribs from both sides, and a transducer is attached to an end of this horn. A protrusion protruding downward from the center between the ribs is provided on the horn, and a tip of the protrusion is a bonding portion which contacts the electronic component. The transducer is driven to apply vertical vibration to the horn. A phase of vertical expansion and compression vibration on the horn generated by this vertical vibration is set to have the same phase as that of bending vibration on the protrusion. Accordingly, displacement by expansion and vertical vibration at side ends of the bonding portion is canceled out by displacement caused by bending vibration.

Abstract: A bonding tool for bonding electronic components by ultrasonic vibration. The bonding tool includes a horn supported by two ribs from both sides, and a transducer is attached to an end of this horn. A protrusion protruding downward from the center between the ribs is provided on the horn, and a tip of the protrusion is a bonding portion which contacts the electronic component. The transducer is driven to apply vertical vibration to the horn. A phase of vertical expansion and compression vibration on the horn generated by this vertical vibration is set to have the same phase as that of bending vibration on the protrusion. Accordingly, displacement by expansion and vertical vibration at side ends of the bonding portion is canceled out by displacement caused by bending vibration.