Patents by Inventor Masafumi Hori
Masafumi Hori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11705331Abstract: A composition for use in selective modification of a base material surface includes a polymer having, at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with a metal, and a solvent.Type: GrantFiled: January 14, 2021Date of Patent: July 18, 2023Assignee: JSR CORPORATIONInventors: Hiroyuki Komatsu, Tomohiro Oda, Hitoshi Osaki, Masafumi Hori, Takehiko Naruoka
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Patent number: 11460767Abstract: A composition for film formation includes a polymer and a solvent. The polymer includes a first repeating unit, a second repeating unit, a third repeating unit, and a structural unit on at least one end of a main chain of the polymer. The first repeating unit includes a crosslinkable group. The second repeating unit differs from the first repeating unit. The third repeating unit differs from the first repeating unit and has higher polarity than polarity of the second repeating unit. The structural unit includes an interacting group capable of interacting with Si—OH, Si—H or Si—N.Type: GrantFiled: January 4, 2019Date of Patent: October 4, 2022Assignee: JSR CORPORATIONInventors: Hiroyuki Komatsu, Tomohiro Oda, Hitoshi Osaki, Masafumi Hori, Takehiko Naruoka
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Patent number: 11370872Abstract: A composition for pattern formation includes a first polymer, a second polymer and a solvent. The first polymer includes: a first block including a first structural unit derived from a substituted or unsubstituted styrene; and a second block including a second structural unit other than the first structural unit. The second polymer includes: the first structural unit; and a group bonding to at least one end of a main chain thereof and including a polar group. The polar group is preferably a hydroxy group or a carboxyl group. A number average molecular weight of the second polymer is preferably no greater than 6,000. A mass ratio of the second polymer to the first polymer is preferably no less than 0.15 and no greater than 0.4. The solvent preferably comprises a compound comprising a hydroxyl group and an alkyl ester group.Type: GrantFiled: January 4, 2019Date of Patent: June 28, 2022Assignee: JSR CorporationInventors: Masafumi Hori, Hiroyuki Komatsu, Tomohiro Oda, Hitoshi Osaki, Takehiko Naruoka
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Patent number: 11335559Abstract: A pattern-forming method includes: forming a pattern on an upper face side of a substrate; applying a first composition to a sidewall of the pattern; forming a resin layer by applying a second composition to an inner face side of the sidewall of the pattern coated with the first composition; allowing the resin layer to separate into a plurality of phases; and removing at least one of the plurality of phases. The first composition contains a first polymer. The second composition contains a second polymer. The second polymer includes a first block having a first structural unit and a second block having a second structural unit. The polarity of the second structural unit is higher than the polarity of the first structural unit. Immediately before forming of the resin layer, a static contact angle ? (°) of water on the sidewall of the pattern satisfies inequality (1).Type: GrantFiled: July 28, 2020Date of Patent: May 17, 2022Assignee: JSR CORPORATIONInventors: Hiroyuki Komatsu, Tomohiro Oda, Masafumi Hori, Takehiko Naruoka, Tomoki Nagai
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Patent number: 11211246Abstract: A method for selectively modifying a base material surface, includes applying a composition on a surface of a base material to form a coating film. The coating film is heated. The base material includes a surface layer which includes a first region including silicon. The composition includes a first polymer and a solvent. The first polymer includes at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with the silicon. The first region preferably contains a silicon oxide, a silicon nitride, or a silicon oxynitride. The base material preferably further includes a second region that is other than the first region and that contains a metal; and the method preferably further includes, after the heating, removing with a rinse agent a portion formed on the second region, of the coating film.Type: GrantFiled: February 28, 2019Date of Patent: December 28, 2021Assignee: JSR CORPORATIONInventors: Hiroyuki Komatsu, Tomohiro Oda, Hitoshi Osaki, Masafumi Hori, Takehiko Naruoka
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Publication number: 20210166935Abstract: A composition for use in selective modification of a base material surface includes a polymer having, at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with a metal, and a solvent.Type: ApplicationFiled: January 14, 2021Publication date: June 3, 2021Applicant: JSR CORPORATIONInventors: Hiroyuki KOMATSU, Tomohiro ODA, Hitoshi OSAKI, Masafumi HORI, Takehiko NARUOKA
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Patent number: 10950438Abstract: A method for selectively modifying a base material surface, includes applying a composition on a surface of a base material to form a coating film. The coating film is heated. The base material includes a surface layer which includes a first region including a metal. The composition includes a first polymer and a solvent. The first polymer includes at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with the metal. It is preferred that the base material further includes a second region comprising substantially only a non-metal, and the method further includes, after the heating, removing with a rinse agent a portion formed on the second region, of the coating film. The metal is preferably a constituent of a metal substance, an alloy, an oxide, an electrically conductive nitride or a silicide.Type: GrantFiled: February 28, 2019Date of Patent: March 16, 2021Assignee: JSR CORPORATIONInventors: Hiroyuki Komatsu, Tomohiro Oda, Hitoshi Osaki, Masafumi Hori, Takehiko Naruoka
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Publication number: 20200357633Abstract: A pattern-forming method includes: forming a pattern on an upper face side of a substrate; applying a first composition to a sidewall of the pattern; forming a resin layer by applying a second composition to an inner face side of the sidewall of the pattern coated with the first composition; allowing the resin layer to separate into a plurality of phases; and removing at least one of the plurality of phases. The first composition contains a first polymer. The second composition contains a second polymer. The second polymer includes a first block having a first structural unit and a second block having a second structural unit. The polarity of the second structural unit is higher than the polarity of the first structural unit. Immediately before forming of the resin layer, a static contact angle ? (°) of water on the sidewall of the pattern satisfies inequality (1).Type: ApplicationFiled: July 28, 2020Publication date: November 12, 2020Applicant: JSR CORPORATIONInventors: Hiroyuki KOMATSU, Tomohiro ODA, Masafumi HORI, Takehiko NARUOKA, Tomoki NAGAI
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Patent number: 10691019Abstract: A pattern-forming method includes forming a base pattern having recessed portions on a front face side of a substrate directly or via other layer. The recessed portions of the base pattern are filled with a first composition to form a filler layer. Phase separation of the filler layer is allowed to form a plurality of phases of the filler layer. A part of the plurality of phases of the filler layer is removed to form a miniaturized pattern. The forming of the base pattern includes: forming a resist pattern on the front face side of the substrate; forming a layer of a second polymer on lateral faces of the resist pattern; and forming a layer of a third polymer that differs from the second polymer on a surface of the substrate or on a surface of the other layer.Type: GrantFiled: April 5, 2019Date of Patent: June 23, 2020Assignee: JSR CORPORATIONInventors: Hiroyuki Komatsu, Takehiko Naruoka, Masafumi Hori, Hitoshi Osaki, Tomohiro Oda
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Publication number: 20190235386Abstract: A pattern-forming method includes forming a base pattern having recessed portions on a front face side of a substrate directly or via other layer. The recessed portions of the base pattern are filled with a first composition to form a filler layer. Phase separation of the filler layer is allowed to form a plurality of phases of the filler layer. A part of the plurality of phases of the filler layer is removed to form a miniaturized pattern. The forming of the base pattern includes: forming a resist pattern on the front face side of the substrate; forming a layer of a second polymer on lateral faces of the resist pattern; and forming a layer of a third polymer that differs from the second polymer on a surface of the substrate or on a surface of the other layer.Type: ApplicationFiled: April 5, 2019Publication date: August 1, 2019Applicant: JSR CorporationInventors: Hiroyuki Komatsu, Takehiko Naruoka, Masafumi Hori, Hitoshi Osaki, Tomohiro Oda
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Publication number: 20190233561Abstract: A composition for film formation includes a polymer and a solvent. The polymer includes a first repeating unit, a second repeating unit, a third repeating unit, and a structural unit on at least one end of a main chain of the polymer. The first repeating unit includes a crosslinkable group. The second repeating unit differs from the first repeating unit. The third repeating unit differs from the first repeating unit and has higher polarity than polarity of the second repeating unit. The structural unit includes an interacting group capable of interacting with Si—OH, Si—H or Si—N.Type: ApplicationFiled: January 4, 2019Publication date: August 1, 2019Applicant: JSR CORPORATIONInventors: Hiroyuki KOMATSU, Tomohiro Oda, Hitoshi Osaki, Masafumi Hori, Takehiko Naruoka
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Publication number: 20190198317Abstract: A method for selectively modifying a base material surface, includes applying a composition on a surface of a base material to form a coating film. The coating film is heated. The base material includes a surface layer which includes a first region including silicon. The composition includes a first polymer and a solvent. The first polymer includes at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with the silicon. The first region preferably contains a silicon oxide, a silicon nitride, or a silicon oxynitride. The base material preferably further includes a second region that is other than the first region and that contains a metal; and the method preferably further includes, after the heating, removing with a rinse agent a portion formed on the second region, of the coating film.Type: ApplicationFiled: February 28, 2019Publication date: June 27, 2019Applicant: JSR CORPORATIONInventors: Hiroyuki KOMATSU, Tomohiro Oda, Hitoshi Osaki, Masafumi Hori, Takehiko Naruoka
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Publication number: 20190194365Abstract: A composition includes a first polymer and a solvent. The first polymer includes a first structural unit including a fluorine atom, and a group including a first functional group at an end of a main chain or a side chain of the first polymer. The first functional group is capable of forming a bond with a metal or a metalloid. The first structural unit preferably includes a fluorinated hydrocarbon group. The first structural unit is preferably derived from a (meth)acrylic ester containing a fluorine atom, or a styrene compound containing a fluorine atom. The first structural unit preferably contains 6 or more fluorine atoms.Type: ApplicationFiled: March 1, 2019Publication date: June 27, 2019Applicant: JSR CORPORATIONInventors: Hiroyuki KOMATSU, Tomohiro ODA, Masafumi HORI, Hitoshi OSAKI, Takehiko NARUOKA
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Publication number: 20190198316Abstract: A method for selectively modifying a base material surface, includes applying a composition on a surface of a base material to form a coating film. The coating film is heated. The base material includes a surface layer which includes a first region including a metal. The composition includes a first polymer and a solvent. The first polymer includes at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with the metal. It is preferred that the base material further includes a second region comprising substantially only a non-metal, and the method further includes, after the heating, removing with a rinse agent a portion formed on the second region, of the coating film. The metal is preferably a constituent of a metal substance, an alloy, an oxide, an electrically conductive nitride or a silicide.Type: ApplicationFiled: February 28, 2019Publication date: June 27, 2019Applicant: JSR CORPORATIONInventors: Hiroyuki KOMATSU, Tomohiro ODA, Hitoshi OSAKI, Masafumi HORI, Takehiko NARUOKA
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Publication number: 20190135967Abstract: A composition for pattern formation includes a first polymer, a second polymer and a solvent. The first polymer includes: a first block including a first structural unit derived from a substituted or unsubstituted styrene; and a second block including a second structural unit other than the first structural unit. The second polymer includes: the first structural unit; and a group bonding to at least one end of a main chain thereof and including a polar group. The polar group is preferably a hydroxy group or a carboxyl group. A number average molecular weight of the second polymer is preferably no greater than 6,000. A mass ratio of the second polymer to the first polymer is preferably no less than 0.15 and no greater than 0.4. The solvent preferably comprises a compound comprising a hydroxyl group and an alkyl ester group.Type: ApplicationFiled: January 4, 2019Publication date: May 9, 2019Applicant: JSR CorporationInventors: Masafumi HORI, Hiroyuki Komatsu, Tomohiro Oda, Hitoshi Osaki, Takehiko Naruoka
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Publication number: 20180342387Abstract: A pattern-forming method includes: forming a pattern on an upper face side of a substrate; applying a first composition to a sidewall of the pattern; forming a resin layer by applying a second composition to an inner face side of the sidewall of the pattern coated with the first composition; allowing the resin layer to separate into a plurality of phases; and removing at least one of the plurality of phases. The first composition contains a first polymer. The second composition contains a second polymer. The second polymer includes a first block having a first structural unit and a second block having a second structural unit. The polarity of the second structural unit is higher than the polarity of the first structural unit. Immediately before forming of the resin layer, a static contact angle ? (°) of water on the sidewall of the pattern satisfies inequality (1).Type: ApplicationFiled: August 7, 2018Publication date: November 29, 2018Applicant: JSR CORPORATIONInventors: Hiroyuki Komatsu, Tomohiro Oda, Masafumi Hori, Takehiko Naruoka, Tomoki Nagai
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Patent number: 10048586Abstract: A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R1 represents an alkali-labile group. A represents an oxygen atom, —NR?—, —CO—O—# or —SO2—O—##, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R? represents a hydrogen atom or an alkali-labile group, and “#” and “##” each indicate a bonding hand bonded to R1. -A-R1??(x).Type: GrantFiled: February 29, 2016Date of Patent: August 14, 2018Assignee: JSR CORPORATIONInventors: Yuusuke Asano, Mitsuo Sato, Hiromitsu Nakashima, Kazuki Kasahara, Yoshifumi Oizumi, Masafumi Hori, Takanori Kawakami, Yasuhiko Matsuda, Kazuo Nakahara
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Patent number: 9760004Abstract: The present invention relates to a radiation-sensitive resin composition that contains: a compound that has a structure represented by the following formula (1); a first polymer that includes a fluorine atom; and a solvent. In the following formula (1), X represents a carbonyl group, a sulfonyl group or a single bond. Y+ represents a monovalent radiation-degradable onium cation. The first polymer preferably has at least one selected from the group consisting of a structural unit represented by the following formula (2a) and a structural unit represented by the following formula (2b). The first polymer preferably includes an alkali-labile group. The first polymer preferably includes an acid-labile group. It is preferred that a radiation-sensitive acid generator is further contained.Type: GrantFiled: September 30, 2014Date of Patent: September 12, 2017Assignee: JSR CORPORATIONInventors: Hiromu Miyata, Hayato Namai, Masafumi Hori
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Patent number: 9513548Abstract: A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R1 represents an alkali-labile group. A represents an oxygen atom, —NR?—, —CO—O—# or —SO2—O—##, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R? represents a hydrogen atom or an alkali-labile group, and “#” and “##” each indicate a bonding hand bonded to R1.Type: GrantFiled: April 2, 2014Date of Patent: December 6, 2016Assignee: JSR CORPORATIONInventors: Yuusuke Asano, Mitsuo Satou, Hiromitsu Nakashima, Kazuki Kasahara, Yoshifumi Oizumi, Masafumi Hori, Takanori Kawakami, Yasuhiko Matsuda, Kazuo Nakahara
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Publication number: 20160179003Abstract: A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R1 represents an alkali-labile group. A represents an oxygen atom, —NR?—, —CO—O—# or —SO2—O—##, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R? represents a hydrogen atom or an alkali-labile group, and “#” and “##” each indicate a bonding hand bonded to R1.Type: ApplicationFiled: February 29, 2016Publication date: June 23, 2016Applicant: JSR CorporationInventors: Yuusuke ASANO, Mitsuo Sato, Hiromitsu Nakashima, Kazuki Kasahara, Yoshifumi Oizumi, Masafumi Hori, Takanori Kawakami, Yasuhiko Matsuda, Kazuo Nakahara