Patents by Inventor Masafumi Hori

Masafumi Hori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10950438
    Abstract: A method for selectively modifying a base material surface, includes applying a composition on a surface of a base material to form a coating film. The coating film is heated. The base material includes a surface layer which includes a first region including a metal. The composition includes a first polymer and a solvent. The first polymer includes at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with the metal. It is preferred that the base material further includes a second region comprising substantially only a non-metal, and the method further includes, after the heating, removing with a rinse agent a portion formed on the second region, of the coating film. The metal is preferably a constituent of a metal substance, an alloy, an oxide, an electrically conductive nitride or a silicide.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: March 16, 2021
    Assignee: JSR CORPORATION
    Inventors: Hiroyuki Komatsu, Tomohiro Oda, Hitoshi Osaki, Masafumi Hori, Takehiko Naruoka
  • Publication number: 20200357633
    Abstract: A pattern-forming method includes: forming a pattern on an upper face side of a substrate; applying a first composition to a sidewall of the pattern; forming a resin layer by applying a second composition to an inner face side of the sidewall of the pattern coated with the first composition; allowing the resin layer to separate into a plurality of phases; and removing at least one of the plurality of phases. The first composition contains a first polymer. The second composition contains a second polymer. The second polymer includes a first block having a first structural unit and a second block having a second structural unit. The polarity of the second structural unit is higher than the polarity of the first structural unit. Immediately before forming of the resin layer, a static contact angle ? (°) of water on the sidewall of the pattern satisfies inequality (1).
    Type: Application
    Filed: July 28, 2020
    Publication date: November 12, 2020
    Applicant: JSR CORPORATION
    Inventors: Hiroyuki KOMATSU, Tomohiro ODA, Masafumi HORI, Takehiko NARUOKA, Tomoki NAGAI
  • Patent number: 10691019
    Abstract: A pattern-forming method includes forming a base pattern having recessed portions on a front face side of a substrate directly or via other layer. The recessed portions of the base pattern are filled with a first composition to form a filler layer. Phase separation of the filler layer is allowed to form a plurality of phases of the filler layer. A part of the plurality of phases of the filler layer is removed to form a miniaturized pattern. The forming of the base pattern includes: forming a resist pattern on the front face side of the substrate; forming a layer of a second polymer on lateral faces of the resist pattern; and forming a layer of a third polymer that differs from the second polymer on a surface of the substrate or on a surface of the other layer.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: June 23, 2020
    Assignee: JSR CORPORATION
    Inventors: Hiroyuki Komatsu, Takehiko Naruoka, Masafumi Hori, Hitoshi Osaki, Tomohiro Oda
  • Publication number: 20190233561
    Abstract: A composition for film formation includes a polymer and a solvent. The polymer includes a first repeating unit, a second repeating unit, a third repeating unit, and a structural unit on at least one end of a main chain of the polymer. The first repeating unit includes a crosslinkable group. The second repeating unit differs from the first repeating unit. The third repeating unit differs from the first repeating unit and has higher polarity than polarity of the second repeating unit. The structural unit includes an interacting group capable of interacting with Si—OH, Si—H or Si—N.
    Type: Application
    Filed: January 4, 2019
    Publication date: August 1, 2019
    Applicant: JSR CORPORATION
    Inventors: Hiroyuki KOMATSU, Tomohiro Oda, Hitoshi Osaki, Masafumi Hori, Takehiko Naruoka
  • Publication number: 20190235386
    Abstract: A pattern-forming method includes forming a base pattern having recessed portions on a front face side of a substrate directly or via other layer. The recessed portions of the base pattern are filled with a first composition to form a filler layer. Phase separation of the filler layer is allowed to form a plurality of phases of the filler layer. A part of the plurality of phases of the filler layer is removed to form a miniaturized pattern. The forming of the base pattern includes: forming a resist pattern on the front face side of the substrate; forming a layer of a second polymer on lateral faces of the resist pattern; and forming a layer of a third polymer that differs from the second polymer on a surface of the substrate or on a surface of the other layer.
    Type: Application
    Filed: April 5, 2019
    Publication date: August 1, 2019
    Applicant: JSR Corporation
    Inventors: Hiroyuki Komatsu, Takehiko Naruoka, Masafumi Hori, Hitoshi Osaki, Tomohiro Oda
  • Publication number: 20190194365
    Abstract: A composition includes a first polymer and a solvent. The first polymer includes a first structural unit including a fluorine atom, and a group including a first functional group at an end of a main chain or a side chain of the first polymer. The first functional group is capable of forming a bond with a metal or a metalloid. The first structural unit preferably includes a fluorinated hydrocarbon group. The first structural unit is preferably derived from a (meth)acrylic ester containing a fluorine atom, or a styrene compound containing a fluorine atom. The first structural unit preferably contains 6 or more fluorine atoms.
    Type: Application
    Filed: March 1, 2019
    Publication date: June 27, 2019
    Applicant: JSR CORPORATION
    Inventors: Hiroyuki KOMATSU, Tomohiro ODA, Masafumi HORI, Hitoshi OSAKI, Takehiko NARUOKA
  • Publication number: 20190198316
    Abstract: A method for selectively modifying a base material surface, includes applying a composition on a surface of a base material to form a coating film. The coating film is heated. The base material includes a surface layer which includes a first region including a metal. The composition includes a first polymer and a solvent. The first polymer includes at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with the metal. It is preferred that the base material further includes a second region comprising substantially only a non-metal, and the method further includes, after the heating, removing with a rinse agent a portion formed on the second region, of the coating film. The metal is preferably a constituent of a metal substance, an alloy, an oxide, an electrically conductive nitride or a silicide.
    Type: Application
    Filed: February 28, 2019
    Publication date: June 27, 2019
    Applicant: JSR CORPORATION
    Inventors: Hiroyuki KOMATSU, Tomohiro ODA, Hitoshi OSAKI, Masafumi HORI, Takehiko NARUOKA
  • Publication number: 20190198317
    Abstract: A method for selectively modifying a base material surface, includes applying a composition on a surface of a base material to form a coating film. The coating film is heated. The base material includes a surface layer which includes a first region including silicon. The composition includes a first polymer and a solvent. The first polymer includes at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with the silicon. The first region preferably contains a silicon oxide, a silicon nitride, or a silicon oxynitride. The base material preferably further includes a second region that is other than the first region and that contains a metal; and the method preferably further includes, after the heating, removing with a rinse agent a portion formed on the second region, of the coating film.
    Type: Application
    Filed: February 28, 2019
    Publication date: June 27, 2019
    Applicant: JSR CORPORATION
    Inventors: Hiroyuki KOMATSU, Tomohiro Oda, Hitoshi Osaki, Masafumi Hori, Takehiko Naruoka
  • Publication number: 20190135967
    Abstract: A composition for pattern formation includes a first polymer, a second polymer and a solvent. The first polymer includes: a first block including a first structural unit derived from a substituted or unsubstituted styrene; and a second block including a second structural unit other than the first structural unit. The second polymer includes: the first structural unit; and a group bonding to at least one end of a main chain thereof and including a polar group. The polar group is preferably a hydroxy group or a carboxyl group. A number average molecular weight of the second polymer is preferably no greater than 6,000. A mass ratio of the second polymer to the first polymer is preferably no less than 0.15 and no greater than 0.4. The solvent preferably comprises a compound comprising a hydroxyl group and an alkyl ester group.
    Type: Application
    Filed: January 4, 2019
    Publication date: May 9, 2019
    Applicant: JSR Corporation
    Inventors: Masafumi HORI, Hiroyuki Komatsu, Tomohiro Oda, Hitoshi Osaki, Takehiko Naruoka
  • Publication number: 20180342387
    Abstract: A pattern-forming method includes: forming a pattern on an upper face side of a substrate; applying a first composition to a sidewall of the pattern; forming a resin layer by applying a second composition to an inner face side of the sidewall of the pattern coated with the first composition; allowing the resin layer to separate into a plurality of phases; and removing at least one of the plurality of phases. The first composition contains a first polymer. The second composition contains a second polymer. The second polymer includes a first block having a first structural unit and a second block having a second structural unit. The polarity of the second structural unit is higher than the polarity of the first structural unit. Immediately before forming of the resin layer, a static contact angle ? (°) of water on the sidewall of the pattern satisfies inequality (1).
    Type: Application
    Filed: August 7, 2018
    Publication date: November 29, 2018
    Applicant: JSR CORPORATION
    Inventors: Hiroyuki Komatsu, Tomohiro Oda, Masafumi Hori, Takehiko Naruoka, Tomoki Nagai
  • Patent number: 10048586
    Abstract: A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R1 represents an alkali-labile group. A represents an oxygen atom, —NR?—, —CO—O—# or —SO2—O—##, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R? represents a hydrogen atom or an alkali-labile group, and “#” and “##” each indicate a bonding hand bonded to R1. -A-R1??(x).
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: August 14, 2018
    Assignee: JSR CORPORATION
    Inventors: Yuusuke Asano, Mitsuo Sato, Hiromitsu Nakashima, Kazuki Kasahara, Yoshifumi Oizumi, Masafumi Hori, Takanori Kawakami, Yasuhiko Matsuda, Kazuo Nakahara
  • Patent number: 9760004
    Abstract: The present invention relates to a radiation-sensitive resin composition that contains: a compound that has a structure represented by the following formula (1); a first polymer that includes a fluorine atom; and a solvent. In the following formula (1), X represents a carbonyl group, a sulfonyl group or a single bond. Y+ represents a monovalent radiation-degradable onium cation. The first polymer preferably has at least one selected from the group consisting of a structural unit represented by the following formula (2a) and a structural unit represented by the following formula (2b). The first polymer preferably includes an alkali-labile group. The first polymer preferably includes an acid-labile group. It is preferred that a radiation-sensitive acid generator is further contained.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: September 12, 2017
    Assignee: JSR CORPORATION
    Inventors: Hiromu Miyata, Hayato Namai, Masafumi Hori
  • Patent number: 9513548
    Abstract: A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R1 represents an alkali-labile group. A represents an oxygen atom, —NR?—, —CO—O—# or —SO2—O—##, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R? represents a hydrogen atom or an alkali-labile group, and “#” and “##” each indicate a bonding hand bonded to R1.
    Type: Grant
    Filed: April 2, 2014
    Date of Patent: December 6, 2016
    Assignee: JSR CORPORATION
    Inventors: Yuusuke Asano, Mitsuo Satou, Hiromitsu Nakashima, Kazuki Kasahara, Yoshifumi Oizumi, Masafumi Hori, Takanori Kawakami, Yasuhiko Matsuda, Kazuo Nakahara
  • Publication number: 20160179003
    Abstract: A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R1 represents an alkali-labile group. A represents an oxygen atom, —NR?—, —CO—O—# or —SO2—O—##, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R? represents a hydrogen atom or an alkali-labile group, and “#” and “##” each indicate a bonding hand bonded to R1.
    Type: Application
    Filed: February 29, 2016
    Publication date: June 23, 2016
    Applicant: JSR Corporation
    Inventors: Yuusuke ASANO, Mitsuo Sato, Hiromitsu Nakashima, Kazuki Kasahara, Yoshifumi Oizumi, Masafumi Hori, Takanori Kawakami, Yasuhiko Matsuda, Kazuo Nakahara
  • Patent number: 9335630
    Abstract: A pattern-forming method includes providing a resist film on a substrate using a radiation-sensitive composition. The resist film is exposed. The exposed resist film is developed using a developer solution. The developer solution includes no less than 80% by mass of an organic solvent. The radiation-sensitive composition includes at least two components including a first polymer and a radiation-sensitive acid generator. The first polymer includes a structural unit having an acid-labile group. One or more components of the radiation-sensitive composition have a group represented by a formula (1). A? represents —N?—SO2—RD, —COO?, —O? or —SO3?. —SO3? does not directly bond to a carbon atom having a fluorine atom. RD represents a linear or branched monovalent hydrocarbon group, or the like. X+ represents an onium cation.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: May 10, 2016
    Assignee: JSR CORPORATION
    Inventors: Hirokazu Sakakibara, Masafumi Hori, Taiichi Furukawa, Koji Ito
  • Patent number: 9298090
    Abstract: A pattern-forming method includes providing a resist film on a substrate using a radiation-sensitive composition. The resist film is exposed. The exposed resist film is developed using a developer solution. The developer solution includes no less than 80% by mass of an organic solvent. The radiation-sensitive composition includes at least two components including a first polymer and a radiation-sensitive acid generator. The first polymer includes a structural unit having an acid-labile group. One or more components of the radiation-sensitive composition have a group represented by a formula (1). A? represents —N?—SO2—RD, —COO?, —O? or —SO3?. —SO3? does not directly bond to a carbon atom having a fluorine atom. RD represents a linear or branched monovalent hydrocarbon group, or the like. X+ represents an onium cation.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: March 29, 2016
    Assignee: JSR CORPORATION
    Inventors: Hirokazu Sakakibara, Masafumi Hori, Taiichi Furukawa, Koji Ito
  • Patent number: 9223207
    Abstract: A resist pattern-forming method includes forming a resist coating film using a radiation-sensitive resin composition. The resist coating film is exposed and developed using a developer solution containing no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a polymer component including a polymer having an acid-labile group, and a radiation-sensitive acid generator. The polymer component includes, in an identical polymer or different polymers, a first structural unit having a first hydrocarbon group, and a second structural unit having a second hydrocarbon group. The first hydrocarbon group is an unsubstituted or substituted branched chain group, or the like. The second hydrocarbon group has an adamantane skeleton. A molar ratio of the second hydrocarbon group to the first hydrocarbon group is less than 1. A proportion of a structural unit having a hydroxyl group in the polymer component is less than 5 mol %.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: December 29, 2015
    Assignee: JSR CORPORATION
    Inventors: Hirokazu Sakakibara, Taiichi Furukawa, Masafumi Hori, Koji Ito, Hiromu Miyata
  • Patent number: 9170488
    Abstract: A resist pattern-forming method includes coating a radiation-sensitive resin composition on a substrate to provide a resist film. The resist film is exposed. The exposed resist film is developed using a developer solution including no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a polymer, a radiation-sensitive acid generator, and an acid diffusion controller which includes a compound having an amide group. The polymer has a weight average molecular weight in terms of the polystyrene equivalent of greater than 6,000 and includes a first structural unit that includes an acid-labile group. The polymer includes less than 5 mol % or 0 mol % of a second structural unit that includes a hydroxyl group.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: October 27, 2015
    Assignee: JSR CORPORATION
    Inventors: Hirokazu Sakakibara, Taiichi Furukawa, Reiko Kimura, Masafumi Hori
  • Patent number: 9164387
    Abstract: A pattern-forming method includes coating a radiation-sensitive resin composition on a substrate to provide a resist film. The resist film is exposed. The exposed resist film is developed. A developer solution used in developing the exposed resist film includes no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a first polymer and a radiation-sensitive acid generator. The first polymer includes a first structural unit having an acid-labile group and an alicyclic group. The alicyclic group is capable of avoiding dissociation from a molecular chain by an action of an acid.
    Type: Grant
    Filed: April 3, 2013
    Date of Patent: October 20, 2015
    Assignee: JSR CORPORATION
    Inventors: Hirokazu Sakakibara, Masafumi Hori, Koji Ito, Reiko Kimura, Taiichi Furukawa
  • Patent number: 9158196
    Abstract: A radiation-sensitive resin composition for forming a resist film includes a polymer including a first structural unit represented by a formula (1) and a second structural unit represented by a formula (2). The first structural unit and the second structural unit are included in an identical polymer molecule or different polymer molecules. R1 represents a hydrogen atom or a methyl group. Q represents a divalent linking group having 1 to 4 carbon atoms. X represents a monovalent lactone group. A part or all of hydrogen atoms included in the monovalent lactone group represented by X are not substituted or substituted. R2 represents a hydrogen atom or a methyl group. Y represents a monovalent lactone group. A part or all of hydrogen atoms included in the monovalent lactone group represented by Y are not substituted or substituted.
    Type: Grant
    Filed: March 27, 2013
    Date of Patent: October 13, 2015
    Assignee: JSR CORPORATION
    Inventors: Kazuki Kasahara, Hiromitsu Nakashima, Masafumi Hori, Masafumi Yoshida