Abstract: An electrostatic chuck 10 includes a dielectric substrate 100, a base plate 200 which supports the dielectric substrate 100, and a joining layer 300 which joins the dielectric substrate 100 and the base plate 200. A value of a dielectric tangent of the joining layer 300 when a temperature of the joining layer 300 is 20° C. is set as a reference value. In the electrostatic chuck 10, when the temperature of the joining layer 300 has changed from 20° C. to ?60° C., a range in which the value of the dielectric tangent of the joining layer 300 fluctuates falls within a range from 50% to 200% of the reference value.

Abstract: An electrostatic chuck (10) includes a dielectric substrate (100), a base plate (200) formed of a metal material, and a bonding layer (300) bonding the dielectric substrate (100) and the base plate (200). At least a portion of the base plate (200) facing the bonding layer (300) is covered with a ceramic film (231), and a surface of the ceramic film (231) is a bonded surface (S). The bonded surface (S) satisfies at least one of a first condition: arithmetic average height (Sa)?1.5 ?m or a second condition: root mean square height (Sq)?2.0 ?m, and at least one of a third condition: maximum valley depth (Sv)?20.0 ?m or a fourth condition: maximum height (Sz)?20.0 ?m.

Abstract: An electrostatic chuck 10 includes a dielectric substrate 100 in which through-holes 140 are formed, a base plate 200 formed of a metal material, and a bonding layer 300 that bonds the dielectric substrate 100 and the base plate 200. When a Young's modulus of the bonding layer 300 is E (MPa), and a distance between a central axis AX0 of the dielectric substrate 100 and a central axis AX1 of each of the through-holes 140 is X (mm), with respect to the through-holes 140 at a position farthest from the central axis AX0, E?0.2063×X2?59.3887×X+4278.8065 is established.

Abstract: An electrostatic chuck 10 includes a dielectric substrate 100, a base plate 200, and a joining layer 300 which joins the dielectric substrate 100 and the base plate 200. The joining layer 300 is obtained by containing a plurality of particulate filler materials 320 inside resin 310. The content of the filler materials 320 in the joining layer 300 is equal to or lower than 70% by weight.

Abstract: An electrostatic chuck 10 includes: a dielectric substrate 100; a base plate 200 formed of a metal material; and a joining layer 300 which is provided between the dielectric substrate 100 and the base plate 200. When a thickness of the joining layer 300 is T (?m) and a Young's modulus of the joining layer 300 at ?100° C. is E (MPa), a condition expressed as E?0.04×T?0.04 is satisfied.

Abstract: An electrostatic chuck includes: a dielectric substrate in which a through hole is formed; an RF electrode which is embedded inside the dielectric substrate; and an attracting electrode which is embedded inside the dielectric substrate at a position that is closer to a placement surface than the RF electrode. When viewed from a direction perpendicular to the placement surface, a circular first opening which is concentric with the through hole and which includes the through hole is formed in the attracting electrode and a circular second opening which is concentric with the through hole and which includes the through hole is formed in the RF electrode. A radius of the second opening is larger than a radius of the first opening.

Abstract: An electrostatic chuck includes a ceramic dielectric substrate and a base plate. The base plate includes a communicating path configured to allow a coolant to pass. The communicating path includes a first flow path part having a pair of side surfaces along a first direction. The first direction is along a flow of the coolant. When viewed along a stacking direction, one side surface of the pair of side surfaces includes a plurality of convex portions and a plurality of concave portions. The plurality of convex portions is convex in a second direction. The second direction is perpendicular to the first direction. The second direction is from the other side surface toward the one side surface of the pair of side surfaces. The plurality of concave portions is convex in an opposite direction of the second direction.

Abstract: An electrostatic chuck includes a base plate and a ceramic dielectric substrate. The ceramic dielectric substrate has a first major surface. The first major surface includes at least a first region and a second region. At least one first gas introduction hole connected to at least one of multiple first grooves. The first grooves include a first boundary groove, and at least one first in-region groove. Multiple second grooves and at least one second gas introduction hole are provided in the second region. The second grooves are include a second boundary groove extending along the first boundary and are provided to be most proximal to the first boundary. A groove end portion-end portion distance between the first boundary groove and the second boundary groove is smaller than a groove end portion-end portion distance between the first boundary groove and the first in-region groove.

Abstract: An electrostatic chuck includes a base plate and a ceramic dielectric substrate. The ceramic dielectric substrate has a first major surface. The first major surface includes at least a first region and a second region. At least one first gas introduction hole connected to at least one of multiple first grooves. The first grooves include a first boundary groove, and at least one first in-region groove. Multiple second grooves and at least one second gas introduction hole are provided in the second region. The second grooves are include a second boundary groove extending along the first boundary and are provided to be most proximal to the first boundary. A groove end portion-end portion distance between the first boundary groove and the second boundary groove is smaller than a groove end portion-end portion distance between the first boundary groove and the first in-region groove.

Abstract: An electrostatic chuck includes a base plate and a ceramic dielectric substrate. The ceramic dielectric substrate has a first major surface. The first major surface includes at least a first region and a second region. At least one first gas introduction hole is connected to at least one of multiple first grooves. At least one second groove are provided in the first region. The multiple first grooves have substantially circular planar configurations and are provided concentrically. The second groove is connected to at least two of the first grooves. When projected onto a plane perpendicular to a first direction from the base plate toward the ceramic dielectric substrate, at least a portion of the first gas introduction hole overlaps at least one of the first groove or the second groove at a portion where the first groove and the second groove are connected.

Abstract: An electrostatic chuck includes a base plate and a ceramic dielectric substrate. The ceramic dielectric substrate has a first major surface. The first major surface includes at least a first region and a second region. At least one first gas introduction hole is connected to at least one of multiple first grooves. At least one second groove are provided in the first region. The multiple first grooves have substantially circular planar configurations and are provided concentrically. The second groove is connected to at least two of the first grooves. When projected onto a plane perpendicular to a first direction from the base plate toward the ceramic dielectric substrate, at least a portion of the first gas introduction hole overlaps at least one of the first groove or the second groove at a portion where the first groove and the second groove are connected.

Abstract: An electrostatic chuck includes a base plate and a ceramic dielectric substrate. The ceramic dielectric substrate has a first major surface. The first major surface includes at least a first region and a second region. At least one first gas introduction hole connected to at least one of multiple first grooves. The first grooves include a first boundary groove, and at least one first in-region groove. Multiple second grooves and at least one second gas introduction hole are provided in the second region. The second grooves are include a second boundary groove extending along the first boundary and are provided to be most proximal to the first boundary. A groove end portion-end portion distance between the first boundary groove and the second boundary groove is smaller than a groove end portion-end portion distance between the first boundary groove and the first in-region groove.