Abstract: An indoor unit of an air conditioning apparatus includes a casing, a heat exchanger, a fan, a first airflow direction adjusting plate adjusting a direction of airflow blown out from an air outlet by rotation about a first axial direction, a plurality of second airflow direction adjusting plates adjusting the direction of the airflow blown out from the air outlet by rotation about a second direction substantially perpendicular to the first direction, and a support member rotatably supporting the first airflow direction adjusting plate in the air outlet other than at both end portions. The second airflow direction adjusting plates include a third airflow direction adjusting plate and a fourth airflow direction adjusting plate placed in a location such that a distance to the support member from the fourth airflow direction adjusting plate is smaller than a distance to the support member from the third airflow direction adjusting plate.

Abstract: Characteristics of a circuit element are predicted accurately by taking account not only of the temperature variation due to self-heating of the element but also of temperature variation due to heat transmission from an adjoining heater element.

Abstract: An indoor unit of an air conditioning apparatus includes a casing, a heat exchanger, a fan, a first airflow direction adjusting plate adjusting a direction of airflow blown out from an air outlet by rotation about a first axial direction, a plurality of second airflow direction adjusting plates adjusting the direction of the airflow blown out from the air outlet by rotation about a second direction substantially perpendicular to the first direction, and a support member rotatably supporting the first airflow direction adjusting plate in the air outlet other than at both end portions. The second airflow direction adjusting plates include a third airflow direction adjusting plate and a fourth airflow direction adjusting plate placed in a location such that a distance to the support member from the fourth airflow direction adjusting plate is smaller than a distance to the support member from the third airflow direction adjusting plate.

Abstract: A semiconductor device which can actively dissipate heat in response to operation is provided. A Seebeck element 310 is buried as a thermoelectric conversion element. The Seebeck element 310 is provided inside a semiconductor element, and has one end disposed proximal to a heat generation part of the semiconductor element and the other end disposed in a distal side of the heat generation part. In addition, a Peltier element 320 is buried as a heat dissipation element. A Peltier element 320 has one end disposed proximal to the heat generation part and the other end disposed in a distal to the heat generation part, and the other end disposed in a distal end side of the heat generation part. A current according to the thermoelectromotive force generated by the Seebeck element 310 is applied to the Peltier element 320.

Abstract: Characteristics of a circuit element are predicted accurately by taking account not only of the temperature variation due to self-heating of the element but also of temperature variation due to heat transmission from an adjoining heater element.

Abstract: A heterostructure bipolar transistor is formed by a process of steps of holding an N-type gallium arsenide body using as an emitter region in a high vacuum of 10.sup.-9 torr to 10.sup.-13 torr at a first temperature of 400.degree. C. to 1,000.degree. C. where arsenic on a surface of the gallium arsenide body drifts away, lowering the first temperature to a second temperature of 300.degree. C. to 400.degree. C. to start a molecular beam epitaxial growth of a germanium, and forming an N-type germanium layer using as a collector region.