Abstract: A user device for implementing error handling is provided. The user device comprises a control unit that establishes, in a Protocol Data Unit (PDU) session establishment procedure using a Local Area Data Network (LADN) Data Network Name (DNN), a PDU session for the LADN; and a transceiver unit that prohibits transmission of a PDU session modification request message for the PDU session, in a PDU session modification procedure, based on reception of a specific cause value, wherein the LADN DNN is provided by the user device in the PDU session establishment procedure.

Abstract: A User Equipment (UE) includes transmission and reception circuitry, and a controller, wherein while one or more Tsor-cm timers are running, and upon receiving a new Steering of roaming connected mode control information (SOR-CMCI), the controller sets a Tsor-cm timer value for an associated PDU session or service to a timer value in the new SOR-CMCI.

Abstract: An insulating adhesive by having a plateable layer which is comprised of a plateable layer-use resin composition which contains a polar group-containing alicyclic olefin polymer (A1) and a curing agent (A2) and an adhesive layer which is comprised of an adhesive layer-use resin composition which contains a polar group-containing alicyclic olefin polymer (B1), a curing agent (B2), and an inorganic filler (B3), wherein a ratio of content of the polar group-containing alicyclic olefin polymer (A1) to the solid content as a whole which is contained in the plateable layer is 50 to 90 wt %, and a ratio of content of the polar group-containing alicyclic olefin polymer (B1) to the solid content as a whole which is contained in the adhesive layer is 1 to 30 wt % and a ratio of content of the inorganic filler (B3) is 50 to 90 wt % is provided.

Abstract: A curable resin composition containing an epoxy compound (A), active ester compound (B), filler (C), and alicyclic olefin polymer (D) containing an aromatic ring and/or hetero atom and not having reactivity to an epoxy group, wherein a ratio of content of said alicyclic olefin polymer (D) with respect to 100 parts by weight of said epoxy compound (A) is 1 to 50 parts by weight, is provided.

Abstract: A curable resin composition which contains an epoxy compound (A1), active ester compound (A2), filler (A3), and alicyclic olefin polymer (A4) containing groups which have reactivity with respect to epoxy groups, wherein a ratio of content of the alicyclic olefin polymer (A4) to 100 parts by weight of said epoxy compound (A1) is 2 to 50 parts by weight is provided. According to the present invention, a curable resin composition which is excellent in resin fluidity and which can give a cured article which is low in linear expansion and is excellent in wire embedding flatness, electrical characteristics, and heat resistance can be provided.

Abstract: An insulating adhesive by having a plateable layer which is comprised of a plateable layer-use resin composition which contains a polar group-containing alicyclic olefin polymer (A1) and a curing agent (A2) and an adhesive layer which is comprised of an adhesive layer-use resin composition which contains a polar group-containing alicyclic olefin polymer (B1), a curing agent (B2), and an inorganic filler (B3), wherein a ratio of content of the polar group-containing alicyclic olefin polymer (A1) to the solid content as a whole which is contained in the plateable layer is 50 to 90 wt %, and a ratio of content of the polar group-containing alicyclic olefin polymer (B1) to the solid content as a whole which is contained in the adhesive layer is 1 to 30 wt % and a ratio of content of the inorganic filler (B3) is 50 to 90 wt % is provided.

Abstract: The invention provides a varnish that contains an insulting resin, a curing agent, a flame retardant, and an organic solvent. The flame retardant comprises flame retardant particles surface treated with at least one surface treatment agent selected from the group consisting of a phosphorus compound soluble in an organic solvent, an organosilicon compound and a dispersant having a carboxyl group. A formed material is obtained by applying and drying the varnish on a substrate. A multilayer structure is obtained by forming on a substrate having a conductor circuit layer an electrical insulation layer obtained by curing the formed material obtained from the varnish.

Abstract: A circuit board having high adhessiveness contact between electrically insulating layers and having a low interlayer electric resistance is provided. A circuit board is provided with a first conductive layer formed on a core (1) and a first electrically insulating layer formed thereon. In the circuit board, a first conductor layer has a surface roughness Ra of 0.1 nm or more but less than 100 nm, and a first primer layer having a thiol compound as a main material is provided between the first conductive layer and the first electrically insulating layer. Thus, the circuit board which has excellent adhesiveness between the first conductor layer and the first electrically insulating layer and is also applicable to high frequency signal is provided.

Abstract: The invention provides a varnish that contains an insulting resin, a curing agent, a flame retardant, and an organic solvent. The flame retardant comprises flame retardant particles surface treated with at least one surface treatment agent selected from the group consisting of a phosphorus compound soluble in an organic solvent, an organosilicon compound and a dispersant having a carboxyl group. A formed material is obtained by applying and drying the varnish on a substrate. A multilayer structure is obtained by forming on a substrate having a conductor circuit layer an electrical insulation layer obtained by curing the formed material obtained from the varnish.