Abstract: A method for forming a conductor layer, including subjecting a surface of a polyimide film where a polyimide layer (a) is formed to polyimide etching treatment, to remove at least part of the polyimide layer (a), the polyimide film having the polyimide layer (a) formed on one surface or both surfaces of a polyimide layer (b); and then forming a conductor layer on the surface, such that the polyimide etching treatment time T (min), which is represented using t (min) defined by the formula as described below, is within the range of 0.2t?T?5t.

Abstract: A method for forming a conductor layer, including subjecting a surface of a polyimide film where a polyimide layer (a) is formed to polyimide etching treatment, to remove at least part of the polyimide layer (a), the polyimide film having the polyimide layer (a) formed on one surface or both surfaces of a polyimide layer (b); and then forming a conductor layer on the surface, such that the polyimide etching treatment time T (min), which is represented using t (min) defined by the formula as described below, is within the range of 0.2t?T?5t.

Abstract: A polyimide film, which is produced by the reaction of a tetracarboxylic acid component comprising 3,3?,4,4?-biphenyltetracarboxylic dianhydride as the main component and a diamine component comprising p-phenylenediamine as the main component, is heated at a temperature of from 460° C. to 550° C., and then water or an alkaline aqueous solution is sprayed on a surface of the polyimide film for surface treatment, thereby improving adhesiveness, while maintaining the excellent properties inherent in the polyimide film.

Abstract: Disclosed is a polyimide foam made of an aromatic polyimide composed of a tetracarboxylic acid component, which is composed of 0 to 90% by mole of a 3,3?,4,4?-biphenyltetracarboxylic acid component and 100 to 10% by mole of a 3,3?,4,4?-benzophenone tetracarboxylic acid component and/or a 2,3,3?,4?-biphenyltetracarboxylic acid component, and a diamine component, which is composed of 50 to 97% by mole of m-phenylenediamine and 50 to 3% by mole of 4,4?-methylenedianiline. The polyimide foam can be produced easily, has uniform and fine cells, and has the mechanical properties required for practical use as a foam, such as flexibility that prevents the foam from cracking easily even when deformed and excellent cushioning properties, as well as heat resistance that can resist use at high temperatures.

Abstract: A polyimide wherein a tetracarboxylic dianhydride including 3,3?,4,4?-phenyltetracarboxylic dianhydride as the essential component is the starting tetracarboxylic dianhydride component, and an amine comprising between 0.5 and 30 mole percent of a diamine represented by the following general formula is the starting diamine component. (wherein A is a direct bond or a crosslinking group, and R1-R4 each represent a substituent). It is possible to obtain a polyimide, a polyimide film and a laminated body with an improved adhesion property and an improved moisture permeation rate, even without surface treatment, comprising, as the essential tetracarboxylic dianhydride, 3,3?,4,4?-biphenyltetracarboxylic dianhydride which has conventionally only yielded polyimides with low adhesive strength.

Abstract: Disclosed is a novel co-polyimide precursor for producing a polyimide having high transparency.

Abstract: Disclosed is a polyimide film having improved adhesiveness to an adhesive and/or adherence to a metal layer. The polyimide film has at least a polyimide layer (b) and a polyimide layer (a) formed contacting the polyimide layer (b), wherein the polyimide layer (a) is a polyimide formed from a tetracarboxylic dianhydride component and a diamine component containing a diamine compound represented by general formula (1): wherein R1 denotes a hydrogen atom, an alkyl group having 1 to 12 carbon atoms or an aryl group, and R2 denotes an alkyl group having 1 to 12 carbon atoms or an aryl group.

Abstract: A polyimide film, which is produced by the reaction of a tetracarboxylic acid component comprising 3,3?,4,4?-biphenyltetracarboxylic dianhydride as the main component and a diamine component comprising p-phenylenediamine as the main component, is heated at a temperature of from 460° C. to 550° C., and then water or an alkaline aqueous solution is sprayed on a surface of the polyimide film for surface treatment, thereby improving adhesiveness, while maintaining the excellent properties inherent in the polyimide film.

Abstract: Disclosed is a polyimide foam made of an aromatic polyimide composed of a tetracarboxylic acid component, which is composed of 0 to 90% by mole of a 3,3?,4,4?-biphenyltetracarboxylic acid component and 100 to 10% by mole of a 3,3?,4,4?-benzophenone tetracarboxylic acid component and/or a 2,3,3?,4?-biphenyltetracarboxylic acid component, and a diamine component, which is composed of 50 to 97% by mole of m-phenylenediamine and 50 to 3% by mole of 4,4?-methylenedianiline. The polyimide foam can be produced easily, has uniform and fine cells, and has the mechanical properties required for practical use as a foam, such as flexibility that prevents the foam from cracking easily even when deformed and excellent cushioning properties, as well as heat resistance that can resist use at high temperatures.

Abstract: Disclosed is a polyimide film produced by heating a self-supporting film of a polyimide precursor solution onto which a solution containing an aluminum chelate compound and, optionally, a nonionic surfactant and/or an aluminum alcoholate compound having at least one alkoxy group is applied to effect imidization.

Abstract: Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component consisting essentially of 3,3?,4,4?-biphenyltetracarboxylic dianhydride and an aromatic diamine component consisting essentially of not less than 65 mol phenylenediamine % but less than 97 mol % of p-phenylenediamine and not less than 3 mol % but less than 35 mol % of 2,4-toluenediamine.

Abstract: A laminated body obtained by forming a metal-deposited layer onto one or both adhesion-improved sides of a polyimide film with improved adhesion obtained by coating and spraying an organic polar solvent solution containing a polybenzimidazole onto one or both sides of a self-supporting film prepared by casting and drying a dope, which is an organic polar solvent solution of a polyimide precursor which may contain an imidization catalyst, onto a support and then heat treating the film to form a multilayer polyimide film of a base polyimide layer and one or two polybenzimidazole layers, by vapor deposition or sputtering, and then plating with metal to form a metal layer onto the metal-deposited layer.

Abstract: A polyimide wherein a tetracarboxylic dianhydride including 3,3?,4,4?-biphenyltetracarboxylic dianhydride as the essential component is the starting tetracarboxylic dianhydride component, and an amine comprising between 0.5 and 30 mole percent of a diamine represented by the following general formula is the starting diamine component. (wherein A is a direct bond or a crosslinking group, and R1-R4 each represent a substituent). It is possible to obtain a polyimide, a polyimide film and a laminated body with an improved adhesion property and an improved moisture permeation rate, even without surface treatment, comprising, as the essential tetracarboxylic dianhydride, 3,3?,4,4?-biphenyltetracarboxylic dianhydride which has conventionally only yielded polyimides with low adhesive strength.

Abstract: A polyimide film with improved adhesion obtained by forming a thin polybenzimidazole layer on one or both sides of a polyimide film, a process for fabrication of a polyimide film with improved adhesion whereby an organic polar solvent solution containing a polybenzimidazole is coated or sprayed onto one or both sides of a self-supporting film prepared by casting and drying a dope, which is an organic polar solvent solution of a polyimide precursor which may contain an imidization catalyst, onto a support, and the film is then thoroughly heat treated, a cover lay film obtained by laminating a cover lay film adhesive onto the polyimide film with improved adhesion, and a laminated body employing the polyimide film with improved adhesion. The polyimide film exhibits the excellent characteristics of aromatic polyimide films including thermal properties, physical properties and electrical properties, while also having satisfactory adhesion.

Abstract: An atomic oxygen-resistant film comprising an atomic oxygen-resistant film formed on a polyimide film, wherein the mass reduction rate thereof is no greater than 1.0% when irradiated with atomic oxygen at an irradiation dose of appromixately 3×1020 atoms/cm2 at a speed of about 8 km/sec.

Abstract: A solventless non-filler underfill material for COF mounting comprising an organic material, which is used to fill the gap between an FPC having a polyimide film substrate and a copper circuit layer having a thickness of 9 &mgr;m or smaller and an IC chip mounted on the FPC, exhibits such adhesion as to destroy a silicon wafer in a polyimide film/silicon wafer adhesion test, and provides a cured film having a tensile modulus of 150 kg/mm2 or less.

Abstract: An atomic oxygen-resistant film comprising an atomic oxygen-resistant film formed on a polyimide film, wherein the mass reduction rate thereof is no greater than 1.0% when irradiated with atomic oxygen at an irradiation dose of appromixately 3×1020 atoms/cm2 at a speed of about 8 km/sec.

Abstract: A one-pack type epoxy resin composition is desclosed. The composition comprises a low-viscosity epoxy resin and an acid anhydride hardener, and has a viscosity of 250 P or less at 25° C. The hardener is an imide oligomer comprising an imide unit and having an acid anhydride group at the terminal thereof. The imide unit is represented by formula I: wherein A represents an asymmetric aromatic tetracarboxylic dianhydride residue or alicyclic tetracarboxylic dianhydride residue; and B represents a diaminopolysiloxane residue.

Abstract: A solventless non-filler underfill material for COF mounting comprising an organic material, which is used to fill the gap between an FPC having a polyimide film substrate and a copper circuit layer having a thickness of 9 &mgr;m or smaller and an IC chip mounted on the FPC, exhibits such adhesion as to destroy a silicon wafer in a polyimide film/silicon wafer adhesion test, and provides a cured film having a tensile modulus of 150 kg/mm2 or less.

Abstract: A one-pack type epoxy resin composition is desclosed. The composition comprises a low-viscosity epoxy resin and an acid anhydride hardener, and has a viscosity of 250 P or less at 25° C. The hardener is an imide oligomer comprising an imide unit and having an acid anhydride group at the terminal thereof.