Patents by Inventor Masafumi Niwa

Masafumi Niwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring board with built-in electronic component
    Patent number: 9220168
    Abstract: A wiring board with a built-in electronic component includes a core substrate having the thickness not exceeding 300 ?m and having a cavity having an opening on a surface of the core substrate, an electronic component having the thickness not exceeding 300 ?m and accommodated in the cavity of the core substrate, and a laminated structure formed on the surface of the core substrate and including an insulation resin layer and a wiring layer such that the laminated structure is covering the opening of the cavity of the core substrate and the electronic component accommodated in the cavity of the core substrate. The electronic component has an insulation material body and an electrode formed on a surface of the insulation material body, and the wiring layer of the laminated structure is formed such that the thickness of the wiring layer is set smaller than the thickness of the electrode.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: December 22, 2015
    Assignee: IBIDEN CO., LTD.
    Inventors: Masahiro Zanma, Masafumi Niwa, Toshiki Furutani
  • WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT
    Publication number: 20140216800
    Abstract: A wiring board with a built-in electronic component includes a core substrate having the thickness not exceeding 300 ?m and having a cavity having an opening on a surface of the core substrate, an electronic component having the thickness not exceeding 300 ?m and accommodated in the cavity of the core substrate, and a laminated structure formed on the surface of the core substrate and including an insulation resin layer and a wiring layer such that the laminated structure is covering the opening of the cavity of the core substrate and the electronic component accommodated in the cavity of the core substrate. The electronic component has an insulation material body and an electrode formed on a surface of the insulation material body, and the wiring layer of the laminated structure is formed such that the thickness of the wiring layer is set smaller than the thickness of the electrode.
    Type: Application
    Filed: January 30, 2014
    Publication date: August 7, 2014
    Applicant: Ibiden Co., Ltd.
    Inventors: Masahiro ZANMA, Masafumi Niwa, Toshiki Furutani