Abstract: A rechargeable metal halide battery with an optimized active cathode electrolyte solution has high energy density and does not require charging following fabrication. The optimized active cathode electrolyte solution includes (i) a mixture of a metal halide and its corresponding halogen dissolved in an organic solvent at a concentration ratio greater than 0.5 and (ii) an oxidizing gas. The organic solvent is a nitrile-based compound and/or a heterocyclic compound. Glyme may be added to the organic solvent to improve battery performance.

Abstract: A rechargeable metal halide battery with an optimized active cathode electrolyte solution has high energy density and does not require charging following fabrication. The optimized active cathode electrolyte solution includes (i) a mixture of a metal halide and its corresponding halogen dissolved in an organic solvent at a concentration ratio greater than 0.5 and (ii) an oxidizing gas. The organic solvent is a nitrile-based compound and/or a heterocyclic compound. Glyme may be added to the organic solvent to improve battery performance.

Abstract: A rechargeable metal halide battery with an optimized electrolyte formulation shows high capacity at fast charging rates. The optimized electrolyte includes a metal halide, an oxidizing gas, and a mixed-solvent solution that includes a glyme-based compound that is in a volume fraction of between 20-70 volume % of the mixed-solvent solution. The mixed-solvent solution may further include a nitrile compound and/or a heterocyclic compound.

Abstract: A sender communication apparatus of a power line communication system that includes: a communication apparatus that is located at a route node of a tree structure of logical connection and broadcasts a received signal; the sender communication apparatus that is located at a node other than the route node of the tree structure; and a recipient communication apparatus that is located at a node other than the route node of the tree structure, wherein the sender communication apparatus comprises a communicator that communicates with the communication apparatus and the recipient communication apparatus via a power line, and the communicator transmits transmission signals to be transmitted to the recipient communication apparatus, to the communication apparatus in a unicast manner.

Abstract: A positive photosensitive resin composition according to the present invention contains at least (A) a polysiloxane compound having at least a structural unit of the general formula (1), (B) a photoacid generator or quinone diazide compound and (C) a solvent [(RX)bR1mSiOn/2]??(1) where RX represents the following group; R1 each represents a hydrogen atom, C1-C3 alkyl group, phenyl group, hydroxy group, C1-C3 alkoxy group or C1-C3 fluoroalkyl group; b represents an integer of 1 to 3; m represents an integer of 0 to 2; n represents an integer of 1 to 3; and b, m and n satisfy b+m+n=4, where X each represents a hydrogen atom or acid labile group; and a represents an integer of 1 to 5. It is possible by the use of this positive photosensitive resin composition to provide a film with high resistance and heat-resistant transparency and provide an electronic component with such a film.

Abstract: According to one aspect of the present invention, there is provided a curable resin composition including at least: a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups as a component (A-1); and silica whose extract water has a pH of 6.1 or lower at 25° C. as a component (B), wherein the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass %. This curable resin composition is able to, even when formed into various shapes and sizes, prevent foaming during curing and thus is suitable as an encapsulant material for a semiconductor element.

Abstract: A positive photosensitive resin composition according to the present invention contains at least (A) a polysiloxane compound having at least a structural unit of the general formula (1), (B) a photoacid generator or quinone diazide compound and (C) a solvent [(RX)bR1mSiOn/2]??(1) where RX represents the following group; R1 each represents a hydrogen atom, C1-C3 alkyl group, phenyl group, hydroxy group, C1-C3 alkoxy group or C1-C3 fluoroalkyl group; b represents an integer of 1 to 3; m represents an integer of 0 to 2; n represents an integer of 1 to 3; and b, m and n satisfy b+m+n=4, where X each represents a hydrogen atom or acid labile group; and a represents an integer of 1 to 5. It is possible by the use of this positive photosensitive resin composition to provide a film with high resistance and heat-resistant transparency and provide an electronic component with such a film.

Abstract: According to one aspect of the present invention, there is provided a curable resin composition including at least: a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups as a component (A-1); and silica whose extract water has a pH of 6.1 or lower at 25° C. as a component (B), wherein the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass %. This curable resin composition is able to, even when formed into various shapes and sizes, prevent foaming during curing and thus is suitable as an encapsulant material for a semiconductor element.