Patents by Inventor Masafumi Shishino

Masafumi Shishino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6248660
    Abstract: A method for forming a metallic plug capable of preventing the occurrence of defects due to a short between conductive layers and the decrease of reliability in a conductive layer caused by a change of plug resistance by polishing and eliminating a filling film and an adhesive layer using a slurry for polishing a metal after eliminating a part of the filling film by dry etching beforehand. A metal plug can be obtained by the following steps: forming an end connection opened in an interlayer dielectric so as to expose the surface of a conductive layer under the interlayer dielectric; forming an adhesive layer on the exposed conductive layer and on the interlayer dielectric; forming a filling film on the adhesive layer, which fills the end connection completely; eliminating 60% or more of the film thickness of the filling film formed by dry etching; and polishing and eliminating the filling film and the adhesive layer using a slurry for polishing a metal.
    Type: Grant
    Filed: January 26, 1998
    Date of Patent: June 19, 2001
    Assignee: Matsushita Electronics Corporation
    Inventors: Masashi Hamanaka, Tetsuo Ishida, Masafumi Shishino