Abstract: A solution having a polymer dissolved in a hydrophobic organic solvent is cast on a substrate, said organic solvent is evaporated in a moist atmosphere to condense moisture contained in an atmosphere prevailing on a surface of said cast solution into micro-droplets, said micro-droplets are dispersed on the surface of said cast solution or in said cast solution into a close-packed structure, said micro-droplets, condensed and dispersed on the surface of said cast solution or in said cast solution, are evaporated to obtain a porous honeycomb structure with said droplets used as casts, and said porous honeycomb structure is at least bisected by peeling in a thickness direction, thereby obtaining honeycomb structures wherein micro-pillars or anisotropic micro-pillars are regularly formed and arranged by said bisection on the peeled sections.

Abstract: A solution having a polymer dissolved in a hydrophobic organic solvent is cast on a substrate, said organic solvent is evaporated in a moist atmosphere to condense moisture contained in an atmosphere prevailing on a surface of said cast solution into micro-droplets, said micro-droplets are dispersed on the surface of said cast solution or in said cast solution into a close-packed structure, said micro-droplets, condensed and dispersed on the surface of said cast solution or in said cast solution, are evaporated to obtain a porous honeycomb structure with said droplets used as casts, and said porous honeycomb structure is at least bisected by peeling in a thickness direction, thereby obtaining honeycomb structures wherein micro-pillars or anisotropic micro-pillars are regularly formed and arranged by said bisection on the peeled sections.

Abstract: A composite metallic material 1 according to the invention is used for, e.g., electrolytic capacitors, and includes a metallic material substrate 10 and a high polymer thin layer 11 having a fine pattern 12 formed on at least one surface of the substrate 10 by self-organization. This high polymer thin film 11 is formed by, for example, drying hydrophobic organic solvent solution of high polymer compound. By subjecting this composite metallic material 1 to etching processing, etching pits are formed uniformly with high density based on the fine pattern.

Abstract: A composite metallic material 1 according to the invention is used for, e.g., electrolytic capacitors, and includes a metallic material substrate 10 and a high polymer thin layer 11 having a fine pattern 12 formed on at least one surface of the substrate 10 by self-organization. This high polymer thin film 11 is formed by, for example, drying hydrophobic organic solvent solution of high polymer compound. By subjecting this composite metallic material 1 to etching processing, etching pits are formed uniformly with high density based on the fine pattern.