Patents by Inventor Masafumi Takeuchi

Masafumi Takeuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5892277
    Abstract: In a TAB tape, dummy copper foil patterns are provided on the portions of an adhesive on which neither pads nor leads are provided, thereby flattening the upper surface of solder resist coated on the resultant structure.
    Type: Grant
    Filed: June 19, 1997
    Date of Patent: April 6, 1999
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Morihiko Ikemizu, Takayuki Okutomo, Yutaka Fukuoka, Masafumi Takeuchi
  • Patent number: 5448451
    Abstract: Two device holes are formed in a base film such that the device holes are juxtaposed in a width direction of the base film perpendicular to a feed direction of the base film. An outer lead hole is formed in the base film with a distance from the device holes in the feed direction. A first lead wire group is arranged on the base film between the outer lead hole and one of the device holes, and a second lead wire group is arranged on the base film between the outer lead hole and the other device hole. Further, a third lead wire group is arranged on the base film between both device holes.
    Type: Grant
    Filed: November 19, 1993
    Date of Patent: September 5, 1995
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Chiaki Takubo, Kimihiro Ikebe, Masafumi Takeuchi, Seiichi Hirata, Sumio Takeda