Patents by Inventor Masafumi TEZUKA

Masafumi TEZUKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device manufacturing method
    Patent number: 9466509
    Abstract: A method of manufacturing a semiconductor device, includes preparing a molding die for molding a resin case for a semiconductor device, the molding die having protrusions to fix each of a plurality of terminals having a leg portion in a predetermined position; conforming and holding each of the plurality of terminals to the corresponding protrusions in the molding die; and injecting resin into the molding die to integrally mold the plurality of terminals and the resin case.
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: October 11, 2016
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Kazunaga Onishi, Rikihiro Maruyama, Masafumi Tezuka, Masahiro Kikuchi
  • SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    Publication number: 20150249023
    Abstract: A method of manufacturing a semiconductor device, includes preparing a molding die for molding a resin case for a semiconductor device, the molding die having protrusions to fix each of a plurality of terminals having a leg portion in a predetermined position; conforming and holding each of the plurality of terminals to the corresponding protrusions in the molding die; and injecting resin into the molding die to integrally mold the plurality of terminals and the resin case.
    Type: Application
    Filed: May 18, 2015
    Publication date: September 3, 2015
    Inventors: Kazunaga ONISHI, Rikihiro MARUYAMA, Masafumi TEZUKA, Masahiro KIKUCHI
  • Semiconductor device manufacturing method and semiconductor device
    Patent number: 9070696
    Abstract: In a method of manufacturing a semiconductor device, a molding die for molding a resin case for a semiconductor device is prepared such that the molding die has protrusions to fix each of a plurality of terminals having a leg portion in a predetermined position. Each of the plurality of terminals is held to the corresponding protrusions in the molding die, and resin is injected into the molding die to integrally mold the plurality of terminals and the resin case.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: June 30, 2015
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Kazunaga Onishi, Rikihiro Maruyama, Masafumi Tezuka, Masahiro Kikuchi
  • SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
    Publication number: 20140312464
    Abstract: In a method of manufacturing a semiconductor device, a molding die for molding a resin case for a semiconductor device is prepared such that the molding die has protrusions to fix each of a plurality of terminals having a leg portion in a predetermined position. Each of the plurality of terminals is held to the corresponding protrusions in the molding die, and resin is injected into the molding die to integrally mold the plurality of terminals and the resin case.
    Type: Application
    Filed: April 11, 2014
    Publication date: October 23, 2014
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Kazunaga ONISHI, Rikihiro MARUYAMA, Masafumi TEZUKA, Masahiro KIKUCHI