Patents by Inventor Masaharu Aoki
Masaharu Aoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11402408Abstract: An electrical characteristics inspection tool capable of inspecting electrical characteristics even when an oxide film is formed on pads or bumps formed at a fine pitch. The electrical characteristics inspection tool includes: a flexible sheet; a through electrode having a recess that is recessed from one surface of the flexible sheet; and a conductive elastomer disposed in the recess of the through electrode. Electrical characteristics can be inspected even when an oxide film is formed on pads or bumps of an inspection object by bringing the conductive elastomer into contact with the pads or bumps and bringing a probe into contact with the through electrode since the conductive particles in the conductive elastomer break through the oxide film.Type: GrantFiled: January 16, 2018Date of Patent: August 2, 2022Assignee: DEXERIALS CORPORATIONInventors: Tomoyuki Ishimatsu, Hiroyuki Kumakura, Masaharu Aoki, Takako Kubota
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Publication number: 20220223315Abstract: A connection structure, a method of manufacturing the connection structure, a connection material, and a coated conductive particle capable of reducing and stabilizing a conduction resistance value. The connection structure includes: a first electronic component having a first terminal; a second electronic component having a second terminal, and a cured film provided between the first electronic component and the second electronic component and formed by curing the connection material, wherein, with regard to the coated conductive particles between the first terminal and the second terminal, metal atoms of the conductive layer diffuse into the metal of the metal fine particles, and metal atoms of the first terminal and the metal atoms of the second terminal diffuse into the metal of the metal fine particles.Type: ApplicationFiled: April 23, 2020Publication date: July 14, 2022Applicant: DEXERIALS CORPORATIONInventors: Yusuke TANAKA, Masaharu AOKI, Saori SUGIOKA, Hidetsugu NAMIKI, Shoko KUGA
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Publication number: 20200141978Abstract: An electrical characteristics inspection tool capable of inspecting electrical characteristics even when an oxide film is formed on pads or bumps formed at a fine pitch. The electrical characteristics inspection tool includes: a flexible sheet; a through electrode having a recess that is recessed from one surface of the flexible sheet; and a conductive elastomer disposed in the recess of the through electrode. Electrical characteristics can be inspected even when an oxide film is formed on pads or bumps of an inspection object by bringing the conductive elastomer into contact with the pads or bumps and bringing a probe into contact with the through electrode since the conductive particles in the conductive elastomer break through the oxide film.Type: ApplicationFiled: January 16, 2018Publication date: May 7, 2020Applicant: DEXERIALS CORPORATIONInventors: Tomoyuki ISHIMATSU, Hiroyuki KUMAKURA, Masaharu AOKI, Takako KUBOTA
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Patent number: 10435601Abstract: An adhesive agent having excellent bonding properties with oxide films and excellent heat-dissipation properties and a connection structure using the same. The adhesive agent contains an epoxy compound, a cationic catalyst, and an acrylic resin containing acrylic acid and acrylic acid ester having a hydroxyl group. Acrylic acid in the acrylic resin reacts with the epoxy compound to generate connections between an island of acrylic resin and a sea of epoxy compound and roughen the surface of an oxide film to improve an anchor effect with the sea of epoxy compound; solder particles contained in the adhesive agent are melted to form metal bonding with an electrode, thereby enabling improvement in adhesive strength between the adhesive agent and the electrode and further improving heat dissipation from a surface of the metal bonding.Type: GrantFiled: May 22, 2015Date of Patent: October 8, 2019Assignee: DEXERIALS CORPORATIONInventors: Masaharu Aoki, Shiyuki Kanisawa, Hidetsugu Namiki, Akira Ishigami
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Publication number: 20190016930Abstract: An adhesive composition having excellent life properties is provided. This adhesive composition achieves excellent life properties by containing an epoxy compound, an aluminum chelating agent, and a hindered amine compound. This is presumably because the aluminum chelating agent stably exists due to the coordination of the nitrogen atom of the hindered amine compound with aluminum of the aluminum chelating agent.Type: ApplicationFiled: December 19, 2016Publication date: January 17, 2019Applicant: DEXERIALS CORPORATIONInventors: Hidetsugu NAMIKI, Tomoyuki ISHIMATSU, Takashi MATSUMURA, Masaharu AOKI
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Patent number: 10174225Abstract: An adhesive composition, capable of achieving excellent life performance and a wide margin for mounting, includes a cationic polymerizable compound, an aluminum chelate/silanol-based curing catalyst, and a nucleophilic compound containing a sulfur atom having an unshared electron pair. The nucleophilic compound is a thiol compound or an episulfide compound. The aluminum chelate/silanol-based curing catalyst includes an aluminum chelate curing agent, and a silanol compound or a silane coupling agent. The aluminum chelate curing agent constitutes a latent aluminum chelate curing agent carried by a porous resin obtained through interfacial polymerization of a polyfunctional isocyanate compound.Type: GrantFiled: June 1, 2016Date of Patent: January 8, 2019Assignee: DEXERIALS CORPORATIONInventors: Masaharu Aoki, Hidetsugu Namiki
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Publication number: 20180171184Abstract: An adhesive composition, capable of achieving excellent life performance and a wide margin for mounting, includes a cationic polymerizable compound, an aluminum chelate/silanol-based curing catalyst, and a nucleophilic compound containing a sulfur atom having an unshared electron pair. The nucleophilic compound is a thiol compound or an episulfide compound. The aluminum chelate/silanol-based curing catalyst includes an aluminum chelate curing agent, and a silanol compound or a silane coupling agent. The aluminum chelate curing agent constitutes a latent aluminum chelate curing agent carried by a porous resin obtained through interfacial polymerization of a polyfunctional isocyanate compound.Type: ApplicationFiled: June 1, 2016Publication date: June 21, 2018Applicant: DEXERIALS CORPORATIONInventors: Masaharu AOKI, Hidetsugu NAMIKI
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Patent number: 9994743Abstract: This adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin that includes acrylic acid and an acrylic acid ester having a hydroxyl group. The acrylic acid in the acrylic resin reacts with the epoxy compound, creating a link between the acrylic resin island part and the epoxy compound sea part, and strengthening the anchoring effect with respect to the epoxy compound sea part by roughening the surface of an oxide film. Furthermore, the hydroxyl-group-containing acrylic acid ester in the acrylic resin becomes electrostatically adhesive to wiring due to the polarity of the hydroxyl group. Excellent adhesive strength can be obtained by adhering, in this way, the entire cured product composed of the acrylic resin island part and the epoxy compound sea part to the oxide film.Type: GrantFiled: September 9, 2014Date of Patent: June 12, 2018Assignee: DEXERIALS CORPORATIONInventors: Masaharu Aoki, Shiyuki Kanisawa, Hidetsugu Namiki, Taichi Koyama, Akira Ishigami
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Patent number: 9676066Abstract: An anisotropic conductive adhesive in which high thermal dissipation is provided. Conductive particles and solder particles are dispersed in a binder. In a thermally compressed LED device manufactured using this anisotropic conductive adhesive, terminals of the LED device are electrically connected to terminals of a substrate via particles and the terminals of the LED device and the terminals of the substrate are solder bonded.Type: GrantFiled: September 17, 2013Date of Patent: June 13, 2017Assignee: DEXERIALS CORPORATIONInventors: Akira Ishigami, Shiyuki Kanisawa, Hidetsugu Namiki, Masaharu Aoki
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Patent number: 9670385Abstract: Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.Type: GrantFiled: February 13, 2015Date of Patent: June 6, 2017Assignee: DEXERIALS CORPORATIONInventors: Hidetsugu Namiki, Shiyuki Kanisawa, Akira Ishigami, Masaharu Aoki
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Publication number: 20170121571Abstract: Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.Type: ApplicationFiled: February 13, 2015Publication date: May 4, 2017Applicant: DEXERIALS CORPORATIONInventors: Hidetsugu NAMIKI, Shiyuki KANISAWA, Akira ISHIGAMI, Masaharu AOKI
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Publication number: 20170114255Abstract: An adhesive agent having excellent bonding properties with oxide films and excellent heat-dissipation properties and a connection structure using the same. The adhesive agent contains an epoxy compound, a cationic catalyst, and an acrylic resin containing acrylic acid and acrylic acid ester having a hydroxyl group. Acrylic acid in the acrylic resin reacts with the epoxy compound to generate connections between an island of acrylic resin and a sea of epoxy compound and roughen the surface of an oxide film to improve an anchor effect with the sea of epoxy compound; solder particles contained in the adhesive agent are melted to form metal bonding with an electrode, thereby enabling improvement in adhesive strength between the adhesive agent and the electrode and further improving heat dissipation from a surface of the metal bonding.Type: ApplicationFiled: May 22, 2015Publication date: April 27, 2017Applicant: DEXERIALS CORPORATIONInventors: Masaharu AOKI, Shiyuki KANISAWA, Hidetsugu NAMIKI, Akira ISHIGAMI
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Patent number: 9487678Abstract: Provided is a light emitting device high in the intensity of emitted light. A blue LED chip having a peak of emitted light in a wavelength range of at least 360 nm and at most 500 nm is adhered to an electrode substrate by an anisotropic conductive adhesive. A light reflecting layer made of a silver alloy on a surface of each conductive particle contained in the anisotropic conductive adhesive, and has high reflectance with respect to blue light. The light reflecting layer is formed by sputtering of a sputtering target that contains Ag, Bi, and Nd with the content ratio of Bi set to at least 0.1 weight % (wt %) and at most 3.0 wt % and the content ratio of Nd set to at least 0.1 weight % and at most 2.0 wt % with respect to the total weight of Ag, Bi, and Nd of 100 wt %. The conductive particle has high anti-migration properties.Type: GrantFiled: August 19, 2015Date of Patent: November 8, 2016Assignee: DEXERIALS CORPORATIONInventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi, Masaharu Aoki, Akira Ishigami
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Publication number: 20160194531Abstract: This adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin that includes acrylic acid and an acrylic acid ester having a hydroxyl group. The acrylic acid in the acrylic resin reacts with the epoxy compound, creating a link between the acrylic resin island part and the epoxy compound sea part, and strengthening the anchoring effect with respect to the epoxy compound sea part by roughening the surface of an oxide film. Furthermore, the hydroxyl-group-containing acrylic acid ester in the acrylic resin becomes electrostatically adhesive to wiring due to the polarity of the hydroxyl group. Excellent adhesive strength can be obtained by adhering, in this way, the entire cured product composed of the acrylic resin island part and the epoxy compound sea part to the oxide film.Type: ApplicationFiled: September 9, 2014Publication date: July 7, 2016Applicant: DEXERIALS CORPORATIONInventors: Masaharu AOKI, Shiyuki KANISAWA, Hidetsugu NAMIKI, Taichi KOYAMA, Akira ISHIGAMI
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Publication number: 20150353781Abstract: Provided is a light emitting device high in the intensity of emitted light. A blue LED chip having a peak of emitted light in a wavelength range of at least 360 nm and at most 500 nm is adhered to an electrode substrate by an anisotropic conductive adhesive. A light reflecting layer made of a silver alloy on a surface of each conductive particle contained in the anisotropic conductive adhesive, and has high reflectance with respect to blue light. The light reflecting layer is formed by sputtering of a sputtering target that contains Ag, Bi, and Nd with the content ratio of Bi set to at least 0.1 weight % (wt %) and at most 3.0 wt % and the content ratio of Nd set to at least 0.1 weight % and at most 2.0 wt % with respect to the total weight of Ag, Bi, and Nd of 100 wt %. The conductive particle has high anti-migration properties.Type: ApplicationFiled: August 19, 2015Publication date: December 10, 2015Inventors: Hidetsugu NAMIKI, Shiyuki KANISAWA, Hideaki UMAKOSHI, Masaharu AOKI, Akira ISHIGAMI
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Publication number: 20150209914Abstract: An anisotropic conductive adhesive in which high thermal dissipation is provided. Conductive particles and solder particles are dispersed in a binder. In a thermally compressed LED device manufactured using this anisotropic conductive adhesive, terminals of the LED device are electrically connected to terminals of a substrate via particles and the terminals of the LED device and the terminals of the substrate are solder bonded.Type: ApplicationFiled: September 17, 2013Publication date: July 30, 2015Inventors: Akira Ishigami, Shiyuki Kanisawa, Hidetsugu Namiki, Masaharu Aoki
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Publication number: 20150034989Abstract: an anisotropic conductive adhesive which uses conductive particles where a silver-based metal is used as a conductive layer, having high light reflectance and excellent migration resistance is provided. The anisotropic conductive adhesive includes light reflective conductive particles in an insulating adhesive resin. The light reflective conductive particle includes a light reflective metal layer made of a metal alloy including silver, gold and hafnium formed on the surface of a resin particle as a core by sputtering method. The light reflective metal layer is preferably formed having a composition ratio of a silver of at least 50% by weight to at most 80% by weight: a gold of at least 10% by weight to at most 45%: a hafnium of at least 10% by weight to at most 40% by weight, and a total ratio does not exceed 100% by weight.Type: ApplicationFiled: October 16, 2014Publication date: February 5, 2015Inventors: Hidetsugu NAMIKI, Shiyuki KANISAWA, Hideaki UMAKOSHI, Masaharu AOKI, Akira ISHIGAMI
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Patent number: 8852462Abstract: A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition containing a silicone resin and a curing agent, conductive particles and light-reflective insulating particles. The light-reflective insulating particle is at least one kind of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, silicon oxide, and aluminum oxide. The silicone resin is a glycidyloxyalkyl-alicyclic alkyl-modified organopolysiloxane.Type: GrantFiled: March 14, 2012Date of Patent: October 7, 2014Assignee: Dexerials CorporationInventors: Hideaki Umakoshi, Hidetsugu Namiki, Masaharu Aoki, Akira Ishigami, Shiyuki Kanisawa
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Publication number: 20140248477Abstract: A buffer film for multi-chip packaging which does not cause out of alignment during multi-chip packaging and ensures favorable connection reliability has a structure in which a heat-resistant resin layer having a linear expansion coefficient of 80 ppm/° C. or less and a flexible resin layer made of a resin material having a Shore A hardness according to JIS K6253 of 10 to 80 are laminated. A multi-chip module can be produced by aligning a plurality of chip devices on a substrate through an adhesive to perform temporary adhesion, disposing the buffer film for multi-chip packaging between the chip devices and a bonding head so that the heat-resistant resin layer is on a chip device side, and connecting the plurality of chip devices with the substrate by applying heat and pressure to the chip devices toward the substrate with the bonding head.Type: ApplicationFiled: May 12, 2014Publication date: September 4, 2014Applicant: DEXERIALS CORPORATIONInventors: Akira ISHIGAMI, Shiyuki KANISAWA, Hidetsugu NAMIKI, Hideaki UMAKOSHI, Masaharu AOKI
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Publication number: 20140217450Abstract: An anisotropic conductive adhesive which uses conductive particles where a silver-based metal is used as a conductive layer, having high light reflectance and excellent migration resistance is provided. The anisotropic conductive adhesive includes light reflective conductive particles in an insulating adhesive resin. The light reflective conductive particle includes a light reflective metal layer made of a metal having at least 60% of reflectance at a peak wavelength of 460 nm formed on the surface of a resin particle as a core, and a coating layer made of a silver alloy formed on the surface of the light reflective metal layer. The light reflective metal layer is preferably formed by a plating method.Type: ApplicationFiled: April 7, 2014Publication date: August 7, 2014Inventors: Akira ISHIGAMI, Shiyuki KANISAWA, Hidetsugu NAMIKI, Hideaki UMAKOSHI, Masaharu AOKI