Abstract: A solid state image sensing device has a plurality of photo sensing elements arranged in a two-dimensional fashion at pixel units pixel unit in the horizontal and vertical directions. Each of the plurality of photo sensing elements is formed of a vertical selection transistor whose gate electrode is connected to a horizontal selection line and whose source electrode is connected to a vertical signal line. A photoelectric conversion element is provided under a channel region of the vertical selection transistor. A high concentration impurity is buried in lower portions of the source electrode and the channel region. When a voltage is applied to the source electrode, a signal charge which is subjected to a photoelectric conversion by the photoelectric conversion element is reset. Reset noise, Vth irregularity, smear component and the surface dark current can be reduced and blooming is suppressed.

Abstract: A solid state image sensing device is formed of a plurality of photo-sensing sections arranged in a two-dimensional fashion at a pixel unit in the horizontal and vertical directions. In this case, each of the plurality of photo-sensing sections is formed of a feedback gate transistor whose gate electrode and source electrode are both connected to a vertical signal line, a vertical selection transistor which is connected in series to the feedback gate transistor and whose gate electrode is connected to a horizontal selection line, and a photoelectric conversion element provided under a channel region of each of the feedback gate transistor and the vertical selection transistor, whereby the sensitivity of the solid state image sensing device is increased and the smear thereof can be lowered.

Abstract: A charge transfer and/or amplifying device includes a surface channel region of opposite conductivity type formed on the surface of a charge transfer buried channel region, a junction gate type field effect transistor formed of source and drain regions separated from each other by the buried channel region and the surface channel region and an insulated gate electrode formed on the surface channel region, wherein the gate electrode and the source region of the junction gate type field effect transistor are electrically coupled to thereby enhance a conversion efficiency.

Abstract: A solid state imager of an amplifying type having an amplifying element for each photo receptor portion, wherein a noise cancelling unit is provided for the amplified output of each photo receptor portion at every vertical line so as to decrease noises, and further the solid state imager is configured to be the rear-illuminated structure, so that the sensitivity of the solid state imager can be improved due to the reduction of the noises and the numerical aperture thereof can be also improved.

Abstract: The present invention is concerned with a solid state imaging device wherein a pulse voltage is applied to a semiconductor substrate to carry out an electronic shuttering operation in a blanking period. An output circuit comprising a MIS transistor formed in a well region on the semiconductor substrate. The impurity concentration and the junction depth of the well region are set so that a time constant determined by parasitic capacitances and resistances of the well region becomes shorter than the period which elapses since the application of the pulse voltage until the expiration of the blanking period, to suppress fluctuations in the level or gain of the MIS transistor due to the pulse voltage to prevent adverse effects on the output signals.

Abstract: An output circuit for CCD imager devices or CCD delay devices is disclosed in which a depletion type second MIS transistor is connected to the drain side of a first MIS transistor constituting a source follower adapted for converting transferred signal signals into an electrical voltage, and an output voltage is supplied to the gate of the second MIS transistor. This depletion type second MIS transistor causes the drain potential of the first MIS transistor to be changed in phase with the input electrical charges to reduce the gate-to-drain capacitance of the first MIS transistor to improve the charge-to-voltage conversion gain.

Abstract: A method for fabricating a solid-state image pick-up device changes part of the constituent elemental Si into the n-type impurity phosphorus P, thus changing the substrate to an n-type, by atomic transmutation through neutron irradiation of a p-type silicon Si wafer, and thus produces a Si substrate with a resistivity .rho..sub.s of 10 to 100 ohm-cm. or preferably 40 to 60 ohm-cm. A solid-state image pick-up device with a plurality of photosensors and vertical and horizontal shift registers as set forth above is then fabricated using the resulting Si substrate. In the preferred process, the silicon substrate can be obtained by irradiating a wafer sectioned from a crystal grown by the MCZ method, for instance, with neutrons as described before until it has the required resistivity .rho..sub.s. This silicon substrate is preferably of a p-type before neutron irradiation, that is, in the crystal growth state, and its resistivity .rho..sub.o is then ten or more times higher (100 ohm-cm. or more) than that .rho..

Abstract: A solid state imager device having an electronic shutter function suitable for use in a video camera or an electronic still camera to suppress brightness differences on TV screens between open and closed periods of the shutter having a semiconductor substrate of a first conductivity type, a region of second conductivity type formed on the semiconductivity substrate of the first conductivity type and a signal charge accumulating region formed on the surface side of the second conductivity type region wherein, a predetermined voltage is applied to the semiconductor substrate of the first conductivity type and the signal charges accumulated in the signal charge accumulating region are discharged to the semiconductor substrate of the first conductivity type, whereby, the exposure time of the solid state imager device can be controlled so that when this imager device is used, for example, in a video camera, the video camera does not have to be provided with a mechanical shutter.

Abstract: A method for fabricating a solid-state image pick-up device changes part of the constituent elemental Si into the n-type impurity phosphorus P, thus changing the substrate to an n-type, by atomic transmutation through neutron irradiation of a p-type silicon Si wafer, and thus produces a Si substrate with a resistivity .rho..sub.s of 10 to 100 ohm-cm. or preferably 40 to 60 ohm-cm. A solid-state image pick-up device with a plurality of photosensors and vertical and horizontal shift registers as set forth above is then fabricated using the resulting Si substrate. In the preferred process, the silicon substrate can be obtained by irradiating a wafer sectioned from a crystal grown by the MCZ method, for instance, with neutrons as described before until it has the required resistivity .rho..sub.s. This silicon substrate is preferably of a p-type before neutron irradiation, that is, in the crystal growth state, and its resistivity .rho..sub.o is then ten or more times higher (100 ohm-cm. or more) than that .rho..

Abstract: A solid state image pick-up device includes means for cancelling a difference in impedance between photo-sensing areas in a photo-sensitive array. The impedance difference cancelling means cancels or makes the difference of impedance at each photo-sensing area ignorable to unify the charge handling in respective photo-sensing areas. In practice, the impedance difference cancelling means provides a resistance high enough to make the impedance difference between respective photo-sensing areas ignorable.

Abstract: A charge transfer device which has an output section that forms a floating diffusion-type amplifier in which a precharge gate electrode is mounted such that a channel formed between a corner portion of a floating diffusion region and the precharged drain region is mounted at an angle so as to reduce the contact surface between the floating diffusion region and the precharge gate electrode to thus improve the characteristics of the device.

Abstract: A solid state image sensor of the interline transfer type comprises a sensing and vertical transfer portion formed on a semiconductor substrate of a first conductive type, for example, P - type, a horizontal charge transfer portion and an output portion, wherein a semiconductor layer of a second conductive type, for example, N - type with the low impurity density is provided on the semiconductor substrate and a plurality of P - type semiconductor regions with the high impurity density, each of which contains a vertical charge transfer portion for vertically transferring a signal charge therein and an overflow drain for draining off a superfluous charge, both of which are provided in the form of N - type semiconductor areas apart from each other, and a plurality of photo-sensing areas for storing the signal charge produced in response to the light from the outside formed between each adjacent two of the P - type semiconductor regions are provided on the semiconductor layer of the N - type, so that no needless