Abstract: A heat sink unit comprising a substrate, a fan, driving means, a fin composed as a separate body from the substrate, and a cover. The cover has a first opening in a section facing the fan, and also forms a second opening with the substrate at one side of the cover. The fin is composed of a separate material from the substrate, and fixed to an opening provided in the substrate. A height from a bottom surface of a heat sink substrate to an upper surface of a cover at a section the fin is disposed is larger than that at a section where the fan is disposed. A thickness of a base of the fin is larger than a thickness of the heat sink substrate. Furthermore, an electronic apparatus of this invention has a heat sink unit of this invention disposed within the apparatus.

Abstract: A cooling apparatus integrally formed within a casing for an electronic device. A mounting board has heat generating members and the cooling apparatus mounted thereto. In an embodiment, a cooling fan having a flat motor is integrally formed with the mounting board by directly fixing a stator coil and a bearing of a motor on the mounting board. The reduced thickness of this structure permits the circuit element to be arranged on the bottom side of the mounting board, permitting increased surface area for the mounting of components of the electronic device. In another embodiment, the mounting board is made of multiple layers, and the field coils form a flat stator on the multiple layers of the mounting board. A bearing is integrally formed in the multiple layers of the mounting board.

Abstract: A blower is provided for effectively cooling heat generating parts in a casing of a personal computer and so on, with a heat sink apparatus using the blower and an electronic equipment using the heat sink apparatus. The blower comprises a fan and an outer frame. The outer frame of the fan is made of a highly thermally conductive material such as aluminum. A radiation board is fixed to or formed integrally with a lower surface of the outer frame. Heat generated from a heat generating device is conveyed through the radiation board to the outer frame. The blower is provided with radiation fins so that the heat conveyed to the outer frame is transferred to the radiation fins as well.

Abstract: A blower is provided for effectively cooling heat generating parts in a casing of a personal computer and so on, with a heat sink apparatus using the blower and an electronic equipment using the heat sink apparatus. The blower comprises a fan and an outer frame. The outer frame of the fan is made of a highly thermally conductive material such as aluminum. A radiation board is fixed to or formed integrally with a lower surface of the outer frame. Heat generated from a heat generating device is conveyed through the radiation board to the outer frame. The blower is provided with radiation fins so that the heat conveyed to the outer frame is transferred to the radiation fins as well.

Abstract: In an electronic apparatus having a housing and a cooling device for cooling at least one section of heat-generating sections in the housing, the cooling device of the present invention has air-discharge-openings provided on the housing and a cooling fan motor that is thermally coupled with at least one part of the heat-generating section. The cooling fan motor of the present invention has a motor section including a rotary shaft, blades mounted on the shaft and a case, wherein the motor section is disposed at one end of the case and an opening is provided at the other end of the case. The case is made of heat conductive material, and is placed so that the openings face the air discharge openings. This structure effectively and sufficiently dissipates the build-up heat produced by the heat-generating components in the housing, and cools them down.

Abstract: It is intended to provide a heat sink unit and an electronic apparatus capable of efficiently cooling a plurality of semiconductor devices and taking action for unnecessary electromagnetic waves. There are provided a plurality of fan units and electromagnetic shielding means for cutting off electromagnetic waves on a heat sink substrate. It is also provided a heat sink substrate, a unit having a fan for supplying fluid to the heat sink substrate and driving means for rotating the fan, and electromagnetic shielding means provided for the heat sink substrate.

Abstract: A cooling device comprises a) a housing with openings, b) substrates disposed in the housing, c) heat-generating components mounted on the substrates, d) a heat conductive member thermally coupled to the heat-generating-components and a frame thermally coupled to an edge of the heat conductive member, and e) a cooling fan motor accommodated in the housing and mounted on the substrate. The cooling fan motor occupies less space in the housing, and dissipates the build-up heat produced by the heat-generating components as well as cools down the components. The cooling device thus contributes to slimming and downsizing of the electronic apparatuses such as mobile personal computers and digital video cameras.

Abstract: There is disclosed a thermal conductive member which can be easily handled, and has high thermal conductivity and the high ability of intimate contact with a heat-generating device and a heatsink, and applies a small stress to a semiconductor package. An electronic device, using this thermal conductive member, is also disclosed. The thermal conductive member connects the heat-generating member to the heatsink serving to radiate heat generated by said heat-generating member, and includes an elastic member, and a thermal conductive foil wound on an elastic member in intimate contact therewith. The electronic device includes the heat-generating member such as a semiconductor, the heatsink for radiating heat generated by the heat-generating member, and the above thermal conductive member interposed between the heat-generating device and the heatsink.

Abstract: A fan-motor-incorporated heat sink effectively supplies cooling air flow in a thin electronic device having limited space above the heat sink. The heat sink enables air intake above the heat sink by positioning a fan, the fins of a heat sink substrate and the side wall of the substrate lower than the fan driving unit. The heat sink substrate and the fins are formed such that air is exhausted only in one direction. A cover is provided on the side of the heat sink substrate on which the fan driving unit is mounted and to which air is taken in to prevent exhausted air from being taken in. The structure of the electronic device is positioned close to the upper surface of the fan driving unit on the heat sink. Thus, the heat sink can be installed on a thin electronic device while improving the cooling of a heat emitting element.