Patents by Inventor Masaharu Okamura
Masaharu Okamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11945285Abstract: The air discharge device includes a duct defining: a main flow path through which an air flow passes; and a main hole opened in a flat shape to discharge the air flow as a working air flow toward a downstream from the main flow path. A throttle portion is provided in the duct to reduce a flow path height of the main flow path from an upstream of the air flow toward a downstream of the air flow. A plurality of partitions are arranged to divide the main flow path in a major direction into a pair of side flow paths and at least one center flow path. The plurality of partitions are disposed in the duct such that a flow path width of the center flow path is reduced from the upstream of the air flow toward the downstream of the air flow.Type: GrantFiled: June 9, 2021Date of Patent: April 2, 2024Assignee: DENSO CORPORATIONInventors: Yasuhiro Takeuchi, Etsuro Yoshino, Yuuji Okamura, Jun Yamaoka, Masaharu Sakai, Yusuke Komatsubara, Yasuhiko Niimi, Tatsuya Yoshida, Hidetaka Nomoto
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Publication number: 20210323108Abstract: A cutting apparatus includes a container including a holder in which a workpiece having an adapter attached thereto is held, a reading target applied to the adapter, an optical sensor to optically read the reading target, a memory storing a position coordinate of the holder and a theoretical position coordinate of the reading target associated with the position coordinate of the holder, a reader to read the reading target using the optical sensor to acquire an image of the reading target, a calculator to determine, in accordance with the image acquired by the reader, an actual position coordinate of the reading target to calculate a correction value from a difference between the actual position coordinate and the theoretical position coordinate, and an updater to update, using the correction value calculated by the calculator, the position coordinate of the holder stored in the memory.Type: ApplicationFiled: December 18, 2020Publication date: October 21, 2021Inventors: Yusuke SAGISAKA, Makoto YAMAGUCHI, Masaharu OKAMURA
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Patent number: 9121090Abstract: In a resin molded article (M), a wear-resistant surface layer (2) is provided on a surface of a base (1) made of a thermoplastic resin with an undercoat layer (3) being interposed therebetween, and the surface layer (2) has a composition containing silicon, oxygen, carbon, and hydrogen, a thickness of 0.02 ?m or greater and 0.48 ?m or less, and a density of greater than 1.5 g/cm3 or a hardness of 1.5 GPa or greater.Type: GrantFiled: February 19, 2009Date of Patent: September 1, 2015Assignees: DAIKYO NISHIKAWA CORPORATION, HIROSHIMA PREFECTUREInventors: Takeharu Suga, Masaharu Okamura, Hiroshi Ahagon, Hiroharu Kojima, Norio Nawachi, Akira Yamamoto
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Patent number: 7938228Abstract: A process for producing a sound absorber having skin layers constituting front and back surfaces and, interposed between the skin layers, a void layer having a plurality of pin formed holes, each hole having a depth which is enough to penetrate one of the skin layers and is not enough to reach the other skin layer. The sound absorber is formed of a resin material containing 2 to 60 wt % of reinforcing fibers with a length of 2 to 100 mm.Type: GrantFiled: March 7, 2006Date of Patent: May 10, 2011Assignees: Prime Polymer Co., Ltd., DaikyoNishikawa CorporationInventors: Yoshiaki Saito, Minoru Sugawara, Hirofumi Goda, Takeharu Suga, Masaharu Okamura, Toshifumi Sakai
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Publication number: 20100327629Abstract: In a resin molded article (M), a wear-resistant surface layer (2) is provided on a surface of a base (1) made of a thermoplastic resin with an undercoat layer (3) being interposed therebetween, and the surface layer (2) has a composition containing silicon, oxygen, carbon, and hydrogen, a thickness of 0.02 ?m or greater and 0.48 ?m or less, and a density of greater than 1.5 g/cm3 or a hardness of 1.5 GPa or greater.Type: ApplicationFiled: February 19, 2009Publication date: December 30, 2010Applicants: DAIKYONISHIKAWA CORPORATION, HIROSHIMA PREFECTUREInventors: Takeharu Suga, Masaharu Okamura, Hiroshi Ahagon, Hiroharu Kojima, Norio Nawachi, Akira Yamamoto
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Publication number: 20090026010Abstract: A process for producing a sound absorber having skin layers constituting front and back surfaces and, interposed between the skin layers, a void layer having a number of voids, and having a plurality of formed holes each having a depth which is enough to penetrate one of the skin layers and is not enough to reach the other skin layer; comprising: providing a mold having a fixed part, a movable part, and at least one pin disposed in a manner that it can be projected into and retracted from a cavity; and having a step to cause the pin to project into the cavity during the course of charging the cavity with a resin material and molding the sound absorber and form the holes communicating with the void layer simultaneously with molding of the sound absorber.Type: ApplicationFiled: March 7, 2006Publication date: January 29, 2009Applicants: PRIME POLYMER CO., LTD., DAIKYONISHIKAWA CORPORATIONInventors: Yoshiaki Saito, Minoru Sugawara, Hirofumi Goda, Takeharu Suga, Masaharu Okamura, Toshifumi Sakai
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Patent number: 7364014Abstract: A sound absorbing body 40 has a molded body 44 including two unexpanded layers 41, 42 and an expanded layer 43 having a number of voids and held between these unexpanded layers 41, 42, a plurality of holes 41A of a depth that passes through the unexpanded layer 41 and does not reach the other unexpanded layer 42 are formed at any positions on the molded body 44, a cross-sectional area of the hole 41A is in the range from 0.785 to 314 mm2, and the pitch is 1 mm or larger. Laminating a plurality of materials is not required, and both the sound absorbing capability and sound insulating capability can be secured by integral molding, and further, only unpleasant sounds can selectively be absorbed.Type: GrantFiled: April 25, 2003Date of Patent: April 29, 2008Assignees: Prime Polymer Co., Ltd., Daikyonishikawa CorporationInventors: Hirofumi Goda, Minoru Sugawara, Yoshiaki Saito, Takeharu Suga, Masaharu Okamura, Toshifumi Sakai
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Publication number: 20050252714Abstract: A sound absorbing body 40 has a molded body 44 including two unexpanded layers 41, 42 and an expanded layer 43 having a number of voids and held between these unexpanded layers 41, 42, a plurality of holes 41A of a depth that passes through the unexpanded layer 41 and does not reach the other unexpanded layer 42 are formed at any positions on the molded body 44, a cross-sectional area of the hole 41A is in the range from 0.785 to 314 mm2, and the pitch is 1 mm or larger. Laminating a plurality of materials is not required, and both the sound absorbing capability and sound insulating capability can be secured by integral molding, and further, only unpleasant sounds can selectively be absorbed.Type: ApplicationFiled: April 25, 2003Publication date: November 17, 2005Inventors: Hirofumi Goda, Minoru Sugawara, Yoshiaki Saito, Takeharu Suga, Masaharu Okamura, Toshifumi Sakai
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Patent number: 6494510Abstract: An impact absorbing mechanism for absorbing an impact load input between receiving portions at a predetermined distance from each other is provided; in the impact absorbing mechanism, a dispersing transferring portion for dispersing and transferring the input impact load in two directions is formed by connecting respective one end sides of two load transferring members, impact absorbing members for absorbing dispersed impact loads in directions along the transferring members and supported by receiving stopping portions are disposed on the other end sides of the respective load transferring members, a connecting portion of the load transferring members is positioned to be closer to load input sides than to the other end sides of the respective load transferring members, and the input impact load is dispersed and absorbed in two directions; thereby, it is possible to obtain an impact absorbing mechanism by which impact energy absorbing performance in a displacement initial stage is enhanced to carry out efficieType: GrantFiled: February 13, 2001Date of Patent: December 17, 2002Assignee: G P Daikyo CorporationInventors: Masaharu Okamura, Toshifumi Sakai
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Patent number: 6368448Abstract: A method for joining thermoplastic resin molded products by pressing together joining surfaces of two molded products with electric resistance wire therebetween is provided, wherein the method comprising: a first step in which electric resistance wire 20 is sandwiched between the joining surfaces of two molded products which are to be joined, pressure is applied at a first predetermined pressure, and current of a predetermined value is applied for a predetermined time to the electric resistance wire, so that the resin around the electric resistance wire is melted by the thermal energy produced in the electric resistance wire while the surfaces of the two molded products that are to be joined are held at a predetermined interval; and a second step in which, following the conclusion of the first step, the current being applied to the electric resistance wire is stopped, and a second predetermined pressure is applied to attach the molten resin under pressure.Type: GrantFiled: August 31, 1999Date of Patent: April 9, 2002Assignee: G P Daikyo CorporationInventors: Masaharu Okamura, Toshiki Miyachi, Takeharu Suga, Nobuyuki Homi
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Publication number: 20010013705Abstract: An impact absorbing mechanism for absorbing an impact load input between receiving portions at a predetermined distance from each other is provided; in the impact absorbing mechanism, a dispersing transferring portion for dispersing and transferring the input impact load in two directions is formed by connecting respective one end sides of two load transferring members, impact absorbing members for absorbing dispersed impact loads in directions along the transferring members and supported by receiving stopping portions are disposed on the other end sides of the respective load transferring members, a connecting portion of the load transferring members is positioned to be closer to load input sides than to the other end sides of the respective load transferring members, and the input impact load is dispersed and absorbed in two directions; thereby, it is possible to obtain an impact absorbing mechanism by which impact energy absorbing performance in a displacement initial stage is enhanced to carry out efficieType: ApplicationFiled: February 13, 2001Publication date: August 16, 2001Applicant: G P Daikyo CorporationInventors: Masaharu Okamura, Toshifumi Sakai
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Patent number: 5988713Abstract: A bumper reinforcement has a generally reversely positioned U-shaped cross section, which is adapted to be combined with a bumper face having a generally U-shaped cross section to constitute a bumper. The bumper reinforcement is removably assembled to within an opening of the bumper face with an opening side of the bumper reinforcement directed toward the bumper face. Also, the bumper reinforcement has a plurality of vertical reinforcing ribs that extend vertically to link upper face portion and lower face portion of the bumper reinforcement with each other, and for segments partitioned by the vertical reinforcing ribs, diagonal reinforcing ribs extend diagonally in the segments and stretched diagonally across vertical reinforcing ribs on both sides of each segment, linking them with each other. The vertical reinforcing ribs and the diagonal reinforcing ribs are integrally molded in the bumper reinforcement.Type: GrantFiled: September 12, 1997Date of Patent: November 23, 1999Assignee: Daikyo Co., Ltd.Inventors: Masaharu Okamura, Toshifumi Sakai