Patents by Inventor Masaharu Okamura

Masaharu Okamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11945285
    Abstract: The air discharge device includes a duct defining: a main flow path through which an air flow passes; and a main hole opened in a flat shape to discharge the air flow as a working air flow toward a downstream from the main flow path. A throttle portion is provided in the duct to reduce a flow path height of the main flow path from an upstream of the air flow toward a downstream of the air flow. A plurality of partitions are arranged to divide the main flow path in a major direction into a pair of side flow paths and at least one center flow path. The plurality of partitions are disposed in the duct such that a flow path width of the center flow path is reduced from the upstream of the air flow toward the downstream of the air flow.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: April 2, 2024
    Assignee: DENSO CORPORATION
    Inventors: Yasuhiro Takeuchi, Etsuro Yoshino, Yuuji Okamura, Jun Yamaoka, Masaharu Sakai, Yusuke Komatsubara, Yasuhiko Niimi, Tatsuya Yoshida, Hidetaka Nomoto
  • Publication number: 20210323108
    Abstract: A cutting apparatus includes a container including a holder in which a workpiece having an adapter attached thereto is held, a reading target applied to the adapter, an optical sensor to optically read the reading target, a memory storing a position coordinate of the holder and a theoretical position coordinate of the reading target associated with the position coordinate of the holder, a reader to read the reading target using the optical sensor to acquire an image of the reading target, a calculator to determine, in accordance with the image acquired by the reader, an actual position coordinate of the reading target to calculate a correction value from a difference between the actual position coordinate and the theoretical position coordinate, and an updater to update, using the correction value calculated by the calculator, the position coordinate of the holder stored in the memory.
    Type: Application
    Filed: December 18, 2020
    Publication date: October 21, 2021
    Inventors: Yusuke SAGISAKA, Makoto YAMAGUCHI, Masaharu OKAMURA
  • Patent number: 9121090
    Abstract: In a resin molded article (M), a wear-resistant surface layer (2) is provided on a surface of a base (1) made of a thermoplastic resin with an undercoat layer (3) being interposed therebetween, and the surface layer (2) has a composition containing silicon, oxygen, carbon, and hydrogen, a thickness of 0.02 ?m or greater and 0.48 ?m or less, and a density of greater than 1.5 g/cm3 or a hardness of 1.5 GPa or greater.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: September 1, 2015
    Assignees: DAIKYO NISHIKAWA CORPORATION, HIROSHIMA PREFECTURE
    Inventors: Takeharu Suga, Masaharu Okamura, Hiroshi Ahagon, Hiroharu Kojima, Norio Nawachi, Akira Yamamoto
  • Patent number: 7938228
    Abstract: A process for producing a sound absorber having skin layers constituting front and back surfaces and, interposed between the skin layers, a void layer having a plurality of pin formed holes, each hole having a depth which is enough to penetrate one of the skin layers and is not enough to reach the other skin layer. The sound absorber is formed of a resin material containing 2 to 60 wt % of reinforcing fibers with a length of 2 to 100 mm.
    Type: Grant
    Filed: March 7, 2006
    Date of Patent: May 10, 2011
    Assignees: Prime Polymer Co., Ltd., DaikyoNishikawa Corporation
    Inventors: Yoshiaki Saito, Minoru Sugawara, Hirofumi Goda, Takeharu Suga, Masaharu Okamura, Toshifumi Sakai
  • Publication number: 20100327629
    Abstract: In a resin molded article (M), a wear-resistant surface layer (2) is provided on a surface of a base (1) made of a thermoplastic resin with an undercoat layer (3) being interposed therebetween, and the surface layer (2) has a composition containing silicon, oxygen, carbon, and hydrogen, a thickness of 0.02 ?m or greater and 0.48 ?m or less, and a density of greater than 1.5 g/cm3 or a hardness of 1.5 GPa or greater.
    Type: Application
    Filed: February 19, 2009
    Publication date: December 30, 2010
    Applicants: DAIKYONISHIKAWA CORPORATION, HIROSHIMA PREFECTURE
    Inventors: Takeharu Suga, Masaharu Okamura, Hiroshi Ahagon, Hiroharu Kojima, Norio Nawachi, Akira Yamamoto
  • Publication number: 20090026010
    Abstract: A process for producing a sound absorber having skin layers constituting front and back surfaces and, interposed between the skin layers, a void layer having a number of voids, and having a plurality of formed holes each having a depth which is enough to penetrate one of the skin layers and is not enough to reach the other skin layer; comprising: providing a mold having a fixed part, a movable part, and at least one pin disposed in a manner that it can be projected into and retracted from a cavity; and having a step to cause the pin to project into the cavity during the course of charging the cavity with a resin material and molding the sound absorber and form the holes communicating with the void layer simultaneously with molding of the sound absorber.
    Type: Application
    Filed: March 7, 2006
    Publication date: January 29, 2009
    Applicants: PRIME POLYMER CO., LTD., DAIKYONISHIKAWA CORPORATION
    Inventors: Yoshiaki Saito, Minoru Sugawara, Hirofumi Goda, Takeharu Suga, Masaharu Okamura, Toshifumi Sakai
  • Patent number: 7364014
    Abstract: A sound absorbing body 40 has a molded body 44 including two unexpanded layers 41, 42 and an expanded layer 43 having a number of voids and held between these unexpanded layers 41, 42, a plurality of holes 41A of a depth that passes through the unexpanded layer 41 and does not reach the other unexpanded layer 42 are formed at any positions on the molded body 44, a cross-sectional area of the hole 41A is in the range from 0.785 to 314 mm2, and the pitch is 1 mm or larger. Laminating a plurality of materials is not required, and both the sound absorbing capability and sound insulating capability can be secured by integral molding, and further, only unpleasant sounds can selectively be absorbed.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: April 29, 2008
    Assignees: Prime Polymer Co., Ltd., Daikyonishikawa Corporation
    Inventors: Hirofumi Goda, Minoru Sugawara, Yoshiaki Saito, Takeharu Suga, Masaharu Okamura, Toshifumi Sakai
  • Publication number: 20050252714
    Abstract: A sound absorbing body 40 has a molded body 44 including two unexpanded layers 41, 42 and an expanded layer 43 having a number of voids and held between these unexpanded layers 41, 42, a plurality of holes 41A of a depth that passes through the unexpanded layer 41 and does not reach the other unexpanded layer 42 are formed at any positions on the molded body 44, a cross-sectional area of the hole 41A is in the range from 0.785 to 314 mm2, and the pitch is 1 mm or larger. Laminating a plurality of materials is not required, and both the sound absorbing capability and sound insulating capability can be secured by integral molding, and further, only unpleasant sounds can selectively be absorbed.
    Type: Application
    Filed: April 25, 2003
    Publication date: November 17, 2005
    Inventors: Hirofumi Goda, Minoru Sugawara, Yoshiaki Saito, Takeharu Suga, Masaharu Okamura, Toshifumi Sakai
  • Patent number: 6494510
    Abstract: An impact absorbing mechanism for absorbing an impact load input between receiving portions at a predetermined distance from each other is provided; in the impact absorbing mechanism, a dispersing transferring portion for dispersing and transferring the input impact load in two directions is formed by connecting respective one end sides of two load transferring members, impact absorbing members for absorbing dispersed impact loads in directions along the transferring members and supported by receiving stopping portions are disposed on the other end sides of the respective load transferring members, a connecting portion of the load transferring members is positioned to be closer to load input sides than to the other end sides of the respective load transferring members, and the input impact load is dispersed and absorbed in two directions; thereby, it is possible to obtain an impact absorbing mechanism by which impact energy absorbing performance in a displacement initial stage is enhanced to carry out efficie
    Type: Grant
    Filed: February 13, 2001
    Date of Patent: December 17, 2002
    Assignee: G P Daikyo Corporation
    Inventors: Masaharu Okamura, Toshifumi Sakai
  • Patent number: 6368448
    Abstract: A method for joining thermoplastic resin molded products by pressing together joining surfaces of two molded products with electric resistance wire therebetween is provided, wherein the method comprising: a first step in which electric resistance wire 20 is sandwiched between the joining surfaces of two molded products which are to be joined, pressure is applied at a first predetermined pressure, and current of a predetermined value is applied for a predetermined time to the electric resistance wire, so that the resin around the electric resistance wire is melted by the thermal energy produced in the electric resistance wire while the surfaces of the two molded products that are to be joined are held at a predetermined interval; and a second step in which, following the conclusion of the first step, the current being applied to the electric resistance wire is stopped, and a second predetermined pressure is applied to attach the molten resin under pressure.
    Type: Grant
    Filed: August 31, 1999
    Date of Patent: April 9, 2002
    Assignee: G P Daikyo Corporation
    Inventors: Masaharu Okamura, Toshiki Miyachi, Takeharu Suga, Nobuyuki Homi
  • Publication number: 20010013705
    Abstract: An impact absorbing mechanism for absorbing an impact load input between receiving portions at a predetermined distance from each other is provided; in the impact absorbing mechanism, a dispersing transferring portion for dispersing and transferring the input impact load in two directions is formed by connecting respective one end sides of two load transferring members, impact absorbing members for absorbing dispersed impact loads in directions along the transferring members and supported by receiving stopping portions are disposed on the other end sides of the respective load transferring members, a connecting portion of the load transferring members is positioned to be closer to load input sides than to the other end sides of the respective load transferring members, and the input impact load is dispersed and absorbed in two directions; thereby, it is possible to obtain an impact absorbing mechanism by which impact energy absorbing performance in a displacement initial stage is enhanced to carry out efficie
    Type: Application
    Filed: February 13, 2001
    Publication date: August 16, 2001
    Applicant: G P Daikyo Corporation
    Inventors: Masaharu Okamura, Toshifumi Sakai
  • Patent number: 5988713
    Abstract: A bumper reinforcement has a generally reversely positioned U-shaped cross section, which is adapted to be combined with a bumper face having a generally U-shaped cross section to constitute a bumper. The bumper reinforcement is removably assembled to within an opening of the bumper face with an opening side of the bumper reinforcement directed toward the bumper face. Also, the bumper reinforcement has a plurality of vertical reinforcing ribs that extend vertically to link upper face portion and lower face portion of the bumper reinforcement with each other, and for segments partitioned by the vertical reinforcing ribs, diagonal reinforcing ribs extend diagonally in the segments and stretched diagonally across vertical reinforcing ribs on both sides of each segment, linking them with each other. The vertical reinforcing ribs and the diagonal reinforcing ribs are integrally molded in the bumper reinforcement.
    Type: Grant
    Filed: September 12, 1997
    Date of Patent: November 23, 1999
    Assignee: Daikyo Co., Ltd.
    Inventors: Masaharu Okamura, Toshifumi Sakai