Patents by Inventor Masaharu Yamanaka

Masaharu Yamanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig
    Patent number: 7393706
    Abstract: A method of manufacturing an optical semiconductor device includes preparing an optical semiconductor provided on a distal end of a first lead portion of a lead frame and connected electrically with a distal end of a second lead portion of the lead frame, forming thermoplastic resin for preparing a package molding jig having a concave portion corresponding to a contour of a package of the optical semiconductor device, inserting the distal ends of the lead portions into the concave portion of the package molding jig for positioning and fixing, and filling packaging resin in the concave portion of the package molding jig.
    Type: Grant
    Filed: March 7, 2005
    Date of Patent: July 1, 2008
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masaki Adachi, Masaharu Yamanaka, Fumihide Nagashima, Tatsuhiko Nagafuchi, Takao Abe, Masayoshi Harada, Hirofumi Hansei, Hironari Kotsubo
  • Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig
    Publication number: 20050208690
    Abstract: A method of manufacturing an optical semiconductor device includes preparing an optical semiconductor provided on a distal end of a first lead portion of a lead frame and connected electrically with a distal end of a second lead portion of the lead frame, forming thermoplastic resin for preparing a package molding jig having a concave portion corresponding to a contour of a package of the optical semiconductor device, inserting the distal ends of the lead portions into the concave portion of the package molding jig for positioning and fixing, and filling packaging resin in the concave portion of the package molding jig.
    Type: Application
    Filed: March 7, 2005
    Publication date: September 22, 2005
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Masaki Adachi, Masaharu Yamanaka, Fumihide Nagashima, Tatsuhiko Nagafuchi, Takao Abe, Masayoshi Harada, Hirofumi Hansei, Hironari Kotsubo