Abstract: It is an object of the present invention to provide a printed circuit board capable of accurately detecting disconnections of circuit patterns with an automatic circuit pattern inspecting device even when positions of mounting lands are slightly deviated from normal positions due to manufacturing errors. For solving this object, the printed circuit board of the present invention is provided with a first mounting land 4a and a second mounting land 4b, and a first circuit pattern 6a and a second circuit pattern 6b on a surface thereof, wherein a first electric checker land 10a and a second checker land 10b which are electrically connected with the first mounting land 4a and the second mounting land 4b are provided on a surface of a wiring board 2.

Abstract: Printed wiring board manufacturing method, and printed wiring board.

Abstract: In a method of manufacturing a printed wiring board with a pattern formed using a printing process, a pattern of a portion requiring position accuracy can be accurately formed at a predetermined position. A method of manufacturing a printed wiring board 10 according to the present invention includes preparing a laminated board 12 including a metal layer 16 formed on a surface of a base material 14, forming a first etching resist layer 20a by printing a pattern of a portion 18a requiring position accuracy on the metal layer of the laminated board using a metal mask 32, forming a second etching resist layer 20b by printing a pattern of a portion 18b other than the portion requiring position accuracy on the metal layer of the laminated board using a screen plate 34, removing, by etching, the metal layer of the laminated board where the first etching resist layer and the second etching resist layer are not formed, and stripping the first etching resist layer and the second etching resist layer.

Abstract: It is an object of the present invention to provide a printed circuit board capable of accurately detecting disconnections of circuit patterns with an automatic circuit pattern inspecting device even when positions of mounting lands are slightly deviated from normal positions due to manufacturing errors. For solving this object, the printed circuit board of the present invention is provided with a first mounting land 4a and a second mounting land 4b, and a first circuit pattern 6a and a second circuit pattern 6b on a surface thereof, wherein a first electric checker land 10a and a second checker land 10b which are electrically connected with the first mounting land 4a and the second mounting land 4b are provided on a surface of a wiring board 2.

Abstract: A method for machining a ceramic matrix composite (CMC), the method enhancing a machining speed for the ceramic matrix composite (CMC), includes: a step of scanning an irradiated portion of a surface of a machining target material by a laser head to irradiate the irradiated portion with laser light from the laser head, and forming a deteriorated layer on the irradiated portion of the surface of the machining target material; and a step of sequentially removing the deteriorated layer by an end mill, the deteriorated layer being formed on the irradiated portion, wherein the deteriorated layer is formed by heating the irradiated portion up to a predetermined temperature by irradiation of continuous oscillation laser light, and by forming a crack by irradiation of pulsed oscillation laser light.

Abstract: A method for machining a ceramic matrix composite (CMC), the method enhancing a machining speed for the ceramic matrix composite (CMC), includes: a step of scanning an irradiated portion of a surface of a machining target material by a laser head to irradiate the irradiated portion with laser light from the laser head, and forming a deteriorated layer on the irradiated portion of the surface of the machining target material; and a step of sequentially removing the deteriorated layer by an end mill, the deteriorated layer being formed on the irradiated portion, wherein the deteriorated layer is formed by heating the irradiated portion up to a predetermined temperature by irradiation of continuous oscillation laser light, and by forming a crack by irradiation of pulsed oscillation laser light.

Abstract: A method is provided to cut a thin-walled member without causing chattering vibration, without using a chattering vibration preventing retainer, that performs the following: (A) preparing a material having much stock for obtaining a thin-walled material, (B) while rotating the material about a center axis, cutting the inner round surface of the material within a predetermined range by feeding a cutting tool relative to material by the desired distance from one end side to the other end side of the material along the center axis, (C) while rotating the material about the center axis, cutting the outer round surface of the material within a predetermined range by feeding the cutting tool relative to the material by the desired distance from the one end side to the other end side of the material along the center axis, and (D) alternately repeating (B) and (C) to finish cutting the material.

Abstract: A method is provided to cut a thin-walled member without causing chattering vibration, without using a chattering vibration preventing retainer, that performs the following: (A) preparing a material having much stock for obtaining a thin-walled material, (B) while rotating the material about a center axis, cutting the inner round surface of the material within a predetermined range by feeding a cutting tool relative to material by the desired distance from one end side to the other end side of the material along the center axis, (C) while rotating the material about the center axis, cutting the outer round surface of the material within a predetermined range by feeding the cutting tool relative to the material by the desired distance from the one end side to the other end side of the material along the center axis, and (D) alternately repeating (B) and (C) to finish cutting the material.