Abstract: The present invention offers a light scanner which is compact and highly precise during high-speed operation, has a long lifespan, and is resistant to influence by external acceleration. Specifically, a light beam emitted from an optical source 20 is separated into two light beams by means of a light beam separation means 30, and these light beams are deflected by a mirror 43 on the scanner 40. On of the light beams is used for the object of usage, while the other light beam is made incident on a photo detector 50 which outputs a signal based on the incident position of the light beam, in order to determine the deflection angle of the light beam based on vibrations of the mirror 43.

Abstract: In order to position an optical semiconductor element in high accuracy and to readily fabricate the same, step is formed on an upper surface of a forward end of an electrode (123) projecting from a lead frame. A submount (102) is previously soldered to a lower stage surface (125), while solder (172) is applied to its upper surface. A collet (61) which is softly supported by a spring (63) in the vertical direction suctionally holds a laser diode element (101) and approaches the electrode (123) from above, to be stopped when its leg portion (61b) comes into contact with an upper stage surface (126). Thus, the laser diode element (101) is precisely positioned. In this state, the solder (172) is heated and cooled, to solder the laser diode element (101) to the submount (102). The laser diode element (101) molded with transparent resin, to be easy to fabricate.

Abstract: The present invention relates to a rolling guide unit wherein spatter scattered as a result of arc welding, gas welding and so forth does not adhere to the track rail.The effect is obtained by forming a fluororesin coating layer on the surface of the track rail.

Abstract: An apparatus for bonding lead terminals to bumps of a semiconductor chip by using a laser beam. On the basis of a temperature signal obtained from irradiation of a lead terminal and a bump to be bonded together under irradiation of the laser beam, state of contact and the bond between the bump and the lead terminal are decided. The bonding between the terminals and the bumps can be realized without fail by checking the state of contact therebetween in precedence to the bonding operation.

Abstract: The present invention relates to a rolling guide unit wherein spatter scattered as a result of arc welding, gas welding and so forth does not adhere to the track rail. The effect is obtained by forming a fluororesin coating layer on the surface of the track rail.

Abstract: A bonding apparatus according to the present invention bonds a semiconductor chip to a conductive member in the face-down style without heating the semiconductor chip. The semiconductor chip which consists essentially of silicon is placed on leads which are put on a TAB tape. A glass plate member is mounted on the semiconductor chip. An infrared light beam is irradiated onto the semiconductor chip from above the semiconductor chip. Transmitted by the semiconductor chip, the infrared light beam illuminates bumps. As a result, the bumps heat up and melt. Since the semiconductor chip does not absorb the infrared light beam, bonding of the semiconductor chip to the leads does not cause a rise in temperature of the semiconductor chip. The bonding apparatus according to the present invention makes the face-down style bonding possible.

Abstract: A bonding apparatus comprises a base (16) for supporting a printed circuit board (7), an atmosphere cover (1) which has a concavity (1c) covering a semiconductor device (5) mounted on the printed circuit board (7) and which is formed of laser light transmitting material, driving means (1j) for moving the atmosphere cover (1) upwards and downwards related to the base (16), pressing means (2) and (3) provided in the atmosphere cover (1) for pressing the semiconductor device (5) toward the printed circuit board (7), and laser heating means (9) for bonding a lead terminal (6) of the semiconductor device (5) with a junction (7a) of the printed circuit board (7).

Abstract: A bonding apparatus comprises a base (16) for supporting a printed circuit board (7), an atmosphere cover (1) which has a concavity (1c) covering a semiconductor device (5) mounted on the printed circuit board (7) and which is formed of laser light transmitting material, driving means (1j) for moving the atmosphere cover (1) upwards and downwards related to the base (16), pressing means (2) and (3) provided in the atmosphere cover (1) for pressing the semiconductor device (5) toward the printed circuit board (7), and laser heating means (9) for bonding a lead terminal (6) of the semiconductor device (5) with a junction (7a) of the printed circuit board (7).

Abstract: A die bonding apparatus includes a Z-axis direction drive mechanism having a main drive motor, a bonding arm having a first arm and a second arm, a holding device provided on one end of the second arm for releasably holding a die, a torque generating device for applying a torque to the second arm, a parallel position detecting device for detecting a displacement of the second arm from a state in which the die and the bonding surface are parallel to each other and for generating a displacement signal, and a control device for storing an inclination of the bonding surface beforehand and for controlling the descent of the second arm and the application of a load to the die.

Abstract: Resin compositions for laminated sheets and laminated sheets produced therefrom are disclosed, the compositions comprising at least one allyl ester resin composed of a polybasic acid and a polyhydric alcohol, wherein an allyl ester group of said resin is bonded to at least one of terminals thereof.

Abstract: Disclosed is a method for die bonding, comprising the steps of arranging a wafer having a multiplicity of mutually separated semiconductor chips vertically and near a lead frame which is conveyed horizontally, and picking up each of the semiconductor chips from the wafer and bonding the same onto the lead frame.

Abstract: Incinerator for oil-containing waste sludges having a furnace, a tank for mixing and stirring the oil-containing waste sludges and oil such as fuel oil or waste oil, a burner for spraying and incinerating the mixture into said furnace, a gas duct containing, if required, heat exchanger means at its midway and a flue, characterized in that said furnace is composed of two chambers, the upper being a combustion chamber, with an opening for spraying and burning said mixture by means of said burner mounted within said opening thereby rendering the waste sludges into a semi-molten state, and the lower chamber being a settling chamber, with a gas duct for discharging combustion gas and an opening for the recovery of clinker form ashes, for settling the clinker ashes contained in the combustion gas, said combustion chamber and said settling chamber being connected by a throttle portion for causing the semi-molten fine particles from the waste sludges to aggregate with each other into clinker form having fine pores be

Abstract: Resin compositions of high adhesivity which comprise (A) ethylene-vinylacetate copolymer or mixture of said copolymer with polyethylene, (B) chlorinated or chlorosulfonated polyethylene, (C) unsaturated carboxylic acids maintaining solid at room temperature and (D) organic peroxides or these components blended with phenolic compounds and/or acid-acceptors.