Abstract: An apparatus comprises a sputter cleaning device, an alignment device operable in atmospheric condition and a heating and soldering device in the form of a belt furnace operable in non-oxidizing or reducing environment. Instead of the sputter cleaning device, a mechanical polishing or cutting device can be used to clean a surface of solder or a member to be bonded or a solder ball plated with gold may be used. An alignment between two members to be bonded is provided by an alignment mark means which comprises a protrusion on a surface of one member and a complimentary recess formed at a center portion of a protrusion means formed on a corresponding surface of the other member.

Abstract: A solder bonding metal layer which is formed on a circuit board comprises a metal layer having a mixture of first metal which is easily wetted with metals constituting the solder and which easily forms alloy or intermetallic compounds and of second metal which is not wetted easily with the above solder and not melted. In this case, a concentration gradient that the concentration of the first metal is high on the bonding surface may be formed in the metal layer. A circuit board having a solder bonding metal layer which keeps good bonding even after many times of repairs and improves the reliability is realized.

Abstract: In a method of soldering for use in fabricating electronic circuit device, after an oxide layer and/or contaminated layer on a surface of a soldering material and members to be soldered thereby is removed by sputter-cleaning with atom or ion, the members are aligned in an oxidizing atmosphere within a predetermined time period and, then, the soldering material is heated in non-oxidizing atmosphere to performe soldering. An apparatus for performing the above method comprises a sputter cleaning device, an alignment device operable in atmospheric condition and a heating and soldering device in the form of a belt furnace operable in non-oxidizing or reducing environment. Instead of the sputter cleaning device, a mechanical polishing or cutting device can be used to cleaning a surface of solder or a member to be bonded or a solder ball plated with gold may be used.

Abstract: The present invention provides a multistep electronic circuit device comprising a plurality of parts and elements mechanically or electrically bonded in sequence to each other and to a substrate with a plurality of solders, which comprises as the parts and elements the substrate, input and output pins and LSI chips, and optionally packages and a cooler bonded through multistep bonding, the bondings of the parts and elements including at least one CCB bonding and at least one sealing, the solders each having a lower melting point than the heatproof temperature of the part or element to be bonded with the solder, and one of the solders having a melting point of at least 10.degree. C. lower than that of the other solder used at the bonding step immediately before. The solders used are selected from Au10-15wt%Ge alloy (melting point: 356.degree.-450.degree. C.), Pb1-5wt%Sn alloy (melting point: 314.degree.-325.degree. C.), Pb10-13wt%Sn alloy (melting point: 270.degree.-300.degree. C.

Abstract: An electronic circuit device comprising an electronic part having a gold-plated connecting terminal arranged thereon connected through a solder to a circuit substrate on the predetermined connecting element thereof, in which the connecting terminal of the electronic part and the solder-connected portion of the circuit substrate are constituted by an alloy composition consisting of 1.0 to 8.0 wt. % of Ag, 0.1 to 6.0 wt % of Au and the balance of Sn, is provided. The device is made by using a solder for use in connecting a gold-plated connecting terminal which consists of 1.0 to 8.

Abstract: A method of controlling the surface potential of a photoconductive element included in an electrophotograpic copier or similiar image forming apparatus. When the background area of a photoconductive element is contaminated due to the shaving of the photoconductive film provided on the photoconductive element or similar type of cause, the method increases the amount of light for imagewise exposure. When the contamination is ascribable to residual potential on the surface of the photoconductor element, the method increases bias potential for development and charge potential. The method, therefore, adequately controls the background contamination ascribable to the change in the sensitivity of the photoconductive element which is in turn ascribable to different types of causes, i.e., the increase in the residual potential and the shaving of the photoconductive film or the like.

Abstract: A delay circuit for use in an electric blasting system including a capacitor for storing electric energy supplied from an electric blaster, an actuation circuit for detecting the stop of voltage supply from the blaster to generate an actuation signal, a circuit for generating clock pulses, a circuit for counting a predetermined number of clock pulses in response to the actuation signal to generate an igniting signal, and a switching circuit for responding to the igniting signal to discharge the electric energy stored in the capacitor through an igniting resistor, the actuation circuit having a zener diode with a threshold voltage. When the voltage supply from the blaster is stopped and the voltage across the zener diode becomes lower than the threshold voltage, the zener diode is cut-off to generate the actuation signal.

Abstract: An electric detonator of the delay type including a housing having a metal portion and an insulating portion, a pair of leg wires extending outside through the housing, a delay circuit connected across the leg wires and generating an ignition current at a predetermined timing, and an igniting resistor connected to an output terminal of the delay circuit and one of the leg wires. In order to check the resistance value of the igniting resistor even after the detonator has been assembled, a by-pass resistor is connected between the other of the leg wires and a junction point between the delay circuit and the igniting resistor. A small measuring current is conducted through the igniting resistor via the by-pass resistor to generate a voltage drop across the igniting resistor. This voltage drop is measured by connecting a voltage measuring device between the leg wire and the metal portion of the housing.

Abstract: An electric detonator of delay type including leg wires connectable to bus wires, a capacitor connected across the leg wires for storing the electric energy supplied from an electric blaster via the leg wires, a delay circuit connected across the leg wires and generating an igniting signal at a predetermined timing, a switching circuit and an igniting resistor connected to the switching circuit, whereby the switching circuit is made conductive in response to the igniting signal to discharge the electric energy stored in the capacitor through the igniting resistor to explode the detonator. In order to operate the detonator reliably and safely, there are provided low and high voltage protection circuits for discharging the electric energy therethrough when the power supply voltage is out of a predetermined normal operation range.

Abstract: A control method applicable to an electrophotographic copier for protecting the background of copies against smears due to a residual potential on a photoconductive element. Before a visible pattern is produced, the photoconductive element is charged by a lower potential than a charging potential which is adapted to form a document image and, then, it is discharged. Potential remaining on the photoconductive element which has been discharged is developed to produce the visible pattern, and the density of this pattern is optically detected. Based on the density level of the visible pattern detected, at least one of a developing bias potential, a charging potential and an exposing potential which are to form a document image is corrected. In the event of producing the visible pattern, the potential remaining on the photoconductive element is developed by a developing bias potential which has been corrected on the bias of visible pattern density level detected immediately before.

Abstract: A delay type electric detonating primer for use in a multiple-step blasting system including a capacitor for storing electric changes supplied from an electric blaster via bus wires and leg wires, an actuation circuit connected across the capacitor for generating an actuation signal when an energy supply from the electric blaster is stopped, a clock pulse generating circuit having a crystal oscillator and being energized with energy stored in the capacitor to produce clock pulses, a counting circuit which is initiated to count the clock pulses in response to the actuation signal, and generates an ignition signal when the counter has counted the predetermined number of clock pulses, and a switching circuit for discharging electric charges stored in the capacitor through an igniting resistor in response to the ignition signal.

Abstract: In an image control device for an electrophotographic copier, a temperature on the surface of a photoconductive element or in the vicinity thereof is sensed. The amount of charge deposited on the photoconductive element is controlled to maintain the potential in a background constant in response to a sensed temperature.

Abstract: Electrophotographic light-sensitive member having a protective coating on a photoconductive layer of the light-sensitive member, said protective coating consisting of an organic high polymer containing Lewis acid.

Abstract: A magnetic brush development apparatus includes a developer containing magnetic powder therein which is attracted to a non-magnetic support member by a magnet arranged therein. The developer is brought into contact with a latent electrostatic image bearing member which is located in a development section for developing the latent electrostatic image. The magnet has substantially one magnetic pole portion capable of producing a magnetic field having a plurality of peaks in the intensity of the magnetic field located in the development section.

Abstract: A plurality of parallel wires (27) are disposed between a corona discharge electrode (24) and a surface (13) to be electrostatically charged. The surface (13) is moved relative to the electrode (24) and wires (27). The wires (27) are equally spaced from each other in a plane (28) which is inclined relative to the surface (13) in such a manner that the spacing between the wires (27) and the surface (13) increases in the direction of movement of the surface (13) relative to the wires (27). A high voltage for corona discharge is applied to the electrode (24). A low voltage is applied to the wires (27) to prevent the surface (13) from being charged above a predetermined potential. The low voltage may be applied to the wires (27) by means of a zener diode (31) connected between the wires (27) and ground which prevents a potential induced in the wires (27) from the electrode (24) from exceeding the zener voltage of the diode (31).

Abstract: Electrophotographic light-sensitive member having a protective coating on a photoconductive layer of the light-sensitive member, said protective coating consisting of an organic high polymer containing Lewis acid.

Abstract: There are provided sensitizers for electrophotographic light-sensitive materials including organic photoconductors and electrophotographic light-sensitive materials containing same. The sensitizers are reaction products comprising benzopyrylium salt and benzopyran.