Patents by Inventor Masahide KODAMA
Masahide KODAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240125561Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.Type: ApplicationFiled: December 21, 2023Publication date: April 18, 2024Applicant: FUJITSU LIMITEDInventors: Kento OHGA, Hideo KUBO, Kenji SASABE, Masahide KODAMA, Atsushi ENDO, Keita HIRAI, Nobumitsu AOKI, Takashi URAI
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Patent number: 11892246Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.Type: GrantFiled: January 4, 2022Date of Patent: February 6, 2024Assignee: FUJITSU LIMITEDInventors: Kento Ohga, Hideo Kubo, Kenji Sasabe, Masahide Kodama, Atsushi Endo, Keita Hirai, Nobumitsu Aoki, Takashi Urai
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Publication number: 20240032251Abstract: A cooling device includes a container in which refrigerant is sealed. The container includes; a heat reception plate that forms part of the container and that receives heat from a heat generating element; an evaporator that causes the refrigerant in a liquid phase to evaporate with heat reception in the container; a condenser that causes the refrigerant in a gas phase to condense with heat dissipation in the container; and a plurality of recessed portions formed in a surface of the heat reception plate inside the container.Type: ApplicationFiled: April 19, 2023Publication date: January 25, 2024Applicant: Fujitsu LimitedInventors: Hideo Kubo, Atsushi Endo, Masahide Kodama, Nobumitsu Aoki, Kenji Sasabe, Keita Hirai, Yuki Kanai, Toru Kobayashi, Hiroshi Satou, Takashi Urai, Hiromasa Miyata
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Publication number: 20230320029Abstract: A liquid cooling module includes a heat-receiver, an inlet-passage in which a flow-path through which the liquid-refrigerant flowed from an inlet flows is formed, a first flow-passage in which the flow-path continues from the inlet-passage, and that is formed as spreading in a fan-like shape as viewed in a normal-direction of a heat-receiving-surface, a second flow-passage in which the flow-path continues from the first flow-passage, and that is formed toward the heat-receiver in the normal-direction, a diffuser in which grooves that continue from the second flow-passage in the heat-receiver and diffuses the liquid-refrigerant along a surface on an opposite side of the heat-receiving-surface is formed, a third flow-passage in which the flow-path continues from the grooves, and that is formed in the normal-direction and a direction in which the flow-path is separating from the heat-receiver, and an outlet-passage in which the flow-path continues from the third flow-passage to an outlet.Type: ApplicationFiled: February 1, 2023Publication date: October 5, 2023Applicant: Fujitsu LimitedInventors: Yuki Kanai, Kenji Sasabe, Keita Hirai, Hideo Kubo, Atsushi Endo, Masahide Kodama, Takashi Urai
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Publication number: 20230240046Abstract: A heat sink comprises a bottom plate and a plurality of fins. The bottom plate is formed in a T-shape of a head portion and a body portion and includes a coupling region in which the body portion is thermally coupled to a heat generation element; and the plurality of fins that are erected at the head portion and the body portion of the bottom plate and extend in a direction from the head portion toward the body portion. With the plurality of fins, a pressure loss of first air which flows through a center portion of the head portion is smaller than a pressure loss of second air which flows through a side portion of the head portion in a case where air flows between the plurality of fins along the direction.Type: ApplicationFiled: October 31, 2022Publication date: July 27, 2023Applicant: Fujitsu LimitedInventors: Kenji Sasabe, Hideo Kubo, Keita Hirai, Atsushi Endo, Masahide Kodama, Nobumitsu Aoki, Yuki Kanai, Takashi Urai
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Publication number: 20220346278Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporation circuit that evaporates the refrigerant in a liquid phase inside the container by heat reception; a condensation circuit that condenses the refrigerant in a gas phase inside the container by heat radiation; a transport circuit that transports the refrigerant in the liquid phase inside the container to the evaporation circuit by a capillary phenomenon; a heat radiation member that includes fins, and includes a narrow portion that has a width in a direction orthogonal to a flow direction of cooling air that is narrow on a downstream side in the flow direction, and a wide portion that has the width that is wide on an upstream side in the flow direction; and an air guide member that is provided on the downstream side of the wide portion and on the upstream side of the narrow portion.Type: ApplicationFiled: January 25, 2022Publication date: October 27, 2022Applicant: FUJITSU LIMITEDInventors: Masahide KODAMA, Hideo Kubo, KENJI SASABE, Nobumitsu Aoki, ATSUSHI ENDO, Keita Hirai
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Publication number: 20220322564Abstract: A cooling device includes: a downstream heat radiation member that includes a plurality of downstream fins; and an upstream heat radiation member that is arranged on an upstream side in a flow direction of cooling air with a gap from the downstream heat radiation member, includes a plurality of upstream fins, and is provided with a low pressure loss portion in which pressure loss is lower than pressure loss in another portion in one portion in a fin arrangement direction orthogonal to the flow direction.Type: ApplicationFiled: January 4, 2022Publication date: October 6, 2022Applicant: FUJITSU LIMITEDInventors: Hideo KUBO, Kenji SASABE, Shinnosuke FUJIWARA, Nobumitsu AOKI, Keita HIRAI, Atsushi ENDO, Masahide KODAMA, Kento OHGA
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Publication number: 20220307772Abstract: A cooling device including: a container in which a refrigerant is sealed; a plurality of evaporation structures that evaporate the refrigerant in a liquid phase inside the container by heat reception; a plurality of condensation structures each of which is provided in corresponding one of the plurality of evaporation units and which condenses the refrigerant in a gas phase inside the container by heat radiation; a transport structure that transports the refrigerant in the liquid phase from the condensation units to the evaporation units by surface tension; and a movement portion that communicates the plurality of condensation units such that the refrigerant in the liquid phase is movable between the plurality of condensation structures.Type: ApplicationFiled: December 2, 2021Publication date: September 29, 2022Applicant: FUJITSU LIMITEDInventors: KENJI SASABE, Hideo Kubo, Keita Hirai, KENTO OHGA, Masahide KODAMA, ATSUSHI ENDO, Takashi Urai, Nobumitsu Aoki
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Publication number: 20220299273Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.Type: ApplicationFiled: January 4, 2022Publication date: September 22, 2022Applicant: FUJITSU LIMITEDInventors: KENTO OHGA, Hideo Kubo, KENJI SASABE, Masahide KODAMA, ATSUSHI ENDO, Keita Hirai, Nobumitsu Aoki, Takashi Urai
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Publication number: 20210372707Abstract: A cooling device includes a vessel having a refrigerant sealed inside, an evaporator that receives heat to evaporate a liquid phase of the refrigerant inside the vessel, a condenser that dissipates heat to condense a vapor phase of the refrigerant inside the vessel, a tube shaped transporter that transports the liquid-phase refrigerant inside the vessel to the evaporator by capillary action, and a gap generator that generates a gap between the transporter and the evaporator for the liquid-phase refrigerant to move from the transporter to the evaporator.Type: ApplicationFiled: February 22, 2021Publication date: December 2, 2021Applicant: FUJITSU LIMITEDInventors: Hideo Kubo, ATSUSHI ENDO, Masahide KODAMA, Shinnosuke FUJIWARA
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Patent number: 9750128Abstract: A disclosed unit device: two first circuit boards provided apart from each other in a horizontal direction; heat generating components respectively provided on the two first circuit boards; two second circuit boards provided between the two first circuit boards, arranged to stand at a distance from each other, and each having an opening; and a fan provided between the two second circuit boards and configured to cool the heat generating components on the two first circuit boards by drawing air through the opening of one of the second circuit boards and by expelling the air through the opening of the other second circuit board.Type: GrantFiled: February 26, 2016Date of Patent: August 29, 2017Assignee: FUJITSU LIMITEDInventors: Atsushi Endo, Hideki Kimura, Katsuhiko Nakata, Yoichi Sato, Takashi Urai, Masahide Kodama
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Publication number: 20160270206Abstract: A disclosed unit device: two first circuit boards provided apart from each other in a horizontal direction; heat generating components respectively provided on the two first circuit boards; two second circuit boards provided between the two first circuit boards, arranged to stand at a distance from each other, and each having an opening; and a fan provided between the two second circuit boards and configured to cool the heat generating components on the two first circuit boards by drawing air through the opening of one of the second circuit boards and by expelling the air through the opening of the other second circuit board.Type: ApplicationFiled: February 26, 2016Publication date: September 15, 2016Applicant: FUJITSU LIMITEDInventors: ATSUSHI ENDO, HIDEKI KIMURA, Katsuhiko Nakata, Yoichi SATO, Takashi Urai, Masahide KODAMA