Abstract: The electric component includes at least a set of electrode terminals 2, 3, a semiconductor element 4 electrically connected with the set of electrode terminals, and a package 6 made of synthetic resin and sealing the electrode terminals and the semiconductor element with part of a lower surface of each of the electrode terminals exposed at a lower surface of the package. A cover layer 11 made of synthetic resin is formed to cover a cut surface of a tip of a connector lead remainder extending integrally outward from the each of the electrode terminals. Thus, disadvantages resulting from exposure of the cut surface of the tip of the connector lead remainder are eliminated.

Abstract: Test equipment of engine motoring for automatically conducting an engine test includes a conveying mechanism that carries in and carries out an engine to and from a test position, a fixing mechanism that fixes the engine carried in to the test position, a coupling mechanism that directly couples an electrical motor to the engine and can detect drive torque, an encoder that generates a pulse signal as an operating standard in synchronism with rotation of the electrical motor, a plurality of detection units driven to reciprocate so as to be connected to and disconnected from or approach and separate from the engine positioned at the test position and detect a plurality of operating state quantities, a control unit for various driving controls, and a judging unit for judging whether the engine is normal by comparing information obtained by the plurality of detection units with standard information obtained in advance.

Abstract: The electric component includes at least a set of electrode terminals 2, 3, a semiconductor element 4 electrically connected with the set of electrode terminals, and a package 6 made of synthetic resin and sealing the electrode terminals and the semiconductor element with part of a lower surface of each of the electrode terminals exposed at a lower surface of the package. A cover layer 11 made of synthetic resin is formed to cover a cut surface of a tip of a connector lead remainder extending integrally outward from the each of the electrode terminals. Thus, disadvantages resulting from exposure of the cut surface of the tip of the connector lead remainder are eliminated.

Abstract: The electric component includes at least a set of electrode terminals 2, 3, a semiconductor element 4 electrically connected with the set of electrode terminals, and a package 6 made of synthetic resin and sealing the electrode terminals and the semiconductor element with part of a lower surface of each of the electrode terminals exposed at a lower surface of the package. A cover layer 11 made of synthetic resin is formed to cover a cut surface of a tip of a connector lead remainder extending integrally outward from the each of the electrode terminals. Thus, disadvantages resulting from exposure of the cut surface of the tip of the connector lead remainder are eliminated.

Abstract: The test equipment of engine motoring of the present invention includes a conveying mechanism (30) that carries in and carries out an engine to and from a test position, a fixing mechanism (40) that fixes the engine carried in to the test position, a coupling mechanism (60) that directly couples an electrical motor (50) to the engine and can detect a drive torque, an encoder (70) that generates a pulse signal as an operating standard in synchronism with rotation of the electrical motor, a plurality of detection units (80 through 130) that are driven to reciprocate so as to be connected to and disconnected from or approach and separate from the engine positioned at the test position and detect a plurality of operating state quantities, a control means (200) for various driving controls, and a judging means (200) for judging whether the engine is normal by comparing information obtained by the plurality of detection units with standard information obtained in advance.

Abstract: The electric component includes at least a set of electrode terminals 2, 3, a semiconductor element 4 electrically connected with the set of electrode terminals, and a package 6 made of synthetic resin and sealing the electrode terminals and the semiconductor element with part of a lower surface of each of the electrode terminals exposed at a lower surface of the package. A cover layer 11 made of synthetic resin is formed to cover a cut surface of a tip of a connector lead remainder extending integrally outward from the each of the electrode terminals. Thus, disadvantages resulting from exposure of the cut surface of the tip of the connector lead remainder are eliminated.

Abstract: A semiconductor device includes a semiconductor chip, an external connection electrode connected to the chip and a resin package for covering the chip. The resin package includes a mounting surface which faces a supporting substrate. The electrode includes a thick portion and a thin portion. The thick portion is partially exposed to the outside at the mounting surface of the package.

Abstract: A solid electrolytic capacitor includes a capacitor element having an element body and an anode wire extending therefrom, an anode lead electrically connected to the anode wire, a cathode lead electrically connected to the element body, and a resin package integrally sealing these parts. Each of the anode lead and the cathode lead is a conductive plate. The element body is connected to the upper surface of the cathode lead. The anode wire is connected to the upper surface of the anode lead via a conductive bolster.

Abstract: A solid electrolytic capacitor includes a capacitor element having an element body and an anode wire extending therefrom, an anode lead electrically connected to the anode wire, a cathode lead electrically connected to the element body, and a resin package integrally sealing these parts. Each of the anode lead and the cathode lead is a conductive plate. The element body is connected to the upper surface of the cathode lead. The anode wire is connected to the upper surface of the anode lead via a conductive bolster.

Abstract: A fabrication method for an electronic device includes four steps. The first step is for preparing a leadframe with first and second conductive members. The second step is for connecting a first and a second electronic chips to the first and the second conductive members, respectively. For the third step, the first chip is enclosed by a first resin package allowing partial exposure of the first conductive member, while the second chip by a second resin package spaced from the first package. For the fourth step, the exposed part of the first conductive member is cut. The cutting is performed using first and second tools, where the first tool makes an indentation in the exposed part on a first side. On another side opposite to the first side, the second tool makes a full cut to be linked with the indentation.

Abstract: A semiconductor device (S1) includes a semiconductor chip (5), a chip-mounting internal lead (1) mounting the semiconductor chip (5), chip-connecting leads (2, 3) electrically connected to an upper surface of the semiconductor chip (5), and a rectangular resin package 7 housing the semiconductor chip (5) and the internal leads (1 to 3). The chip-mounting internal lead (1) has an end which is rectangular or substantially rectangular and extends along the length of the resin package (7).

Abstract: A solid electrolytic capacitor includes a capacitor element having an element body and an anode wire extending therefrom, an anode lead electrically connected to the anode wire, a cathode lead electrically connected to the element body, and a resin package integrally sealing these parts. Each of the anode lead and the cathode lead is a conductive plate. The element body is connected to the upper surface of the cathode lead. The anode wire is connected to the upper surface of the anode lead via a conductive bolster.

Abstract: A semiconductor device is fabricated in the following manner. First, semiconductor chips are mounted on a leadframe prepared from an electroconductive strip of a uniform thickness. Then, wire-bonding is performed on the respective chips, and a resin layer is formed on the leadframe to enclose the chips and the associated bonding wires. Thus, an intermediate product is obtained. Then, the intermediate product is cut into separate, finished devices by using two cutters. One of them is a relatively thin cutter, while the other is a relatively thick cutter. The thin cutter is used for making a full cut in the leadframe, while the thick cutter is used for making a half-depth cut in the leadframe.

Abstract: A fabrication method for an electronic device includes four steps. The first step is for preparing a leadframe with first and second conductive members. The second step is for connecting a first and a second electronic chips to the first and the second conductive members, respectively. For the third step, the first chip is enclosed by a first resin package allowing partial exposure of the first conductive member, while the second chip by a second resin package spaced from the first package. For the fourth step, the exposed part of the first conductive member is cut. The cutting is performed using first and second tools, where the first tool makes an indentation in the exposed part on a first side. On another side opposite to the first side, the second tool makes a full cut to be linked with the indentation.

Abstract: The present invention relates to an electronic component formed of an electrically conductive plate and including a plurality of leads 1, 2 each having an island 10 for mounting of a semiconductor chip 3 or having a connecting portion 20 for connection with a wire 4. According to an electronic component X offered by the present invention, at least a set of mutually adjacent leads 1, 2 have their respective mutually facing side surfaces 10a, 20a made non-parallel to each other. Preferably, at least one side surface 20a (10a) of the leads 1, 2 is at least partially curved, folded and/or slanted.

Abstract: A semiconductor device is fabricated in the following manner. First, semiconductor chips are mounted on a leadframe prepared from an electroconductive strip of a uniform thickness. Then, wire-bonding is performed on the respective chips, and a resin layer is formed on the leadframe to enclose the chips and the associated bonding wires. Thus, an intermediate product is obtained. Then, the intermediate product is cut into separate, finished devices by using two cutters. One of them is a relatively thin cutter, while the other is a relatively thick cutter. The thin cutter is used for making a full cut in the leadframe, while the thick cutter is used for making a half-depth cut in the leadframe.

Abstract: A solid electrolytic capacitor includes a capacitor element having an element body and an anode wire extending therefrom, an anode lead electrically connected to the anode wire, a cathode lead electrically connected to the element body, and a resin package integrally sealing these parts. Each of the anode lead and the cathode lead is a conductive plate. The element body is connected to the upper surface of the cathode lead. The anode wire is connected to the upper surface of the anode lead via a conductive bolster.

Abstract: A semiconductor device includes a semiconductor chip, an external connection electrode connected to the chip and a resin package for covering the chip. The resin package includes a mounting surface which faces a supporting substrate. The electrode includes a thick portion and a thin portion. The thick portion is partially exposed to the outside at the mounting surface of the package.