Patents by Inventor Masahide Takazawa
Masahide Takazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240096378Abstract: According to one embodiment, an electronic device includes a wall and a substrate. The substrate is provided with an opening. The substrate includes an organic compound layer, a first surface of the organic compound layer, a second surface of the organic compound layer opposite the first surface, first wiring on the second surface, second wiring on the second surface, a first pad, and a second pad. The first surface is attached to the wall. The first pad is connected to the first wiring. The second pad is connected to the second wiring away from the first pad. The opening penetrates the organic compound layer to open to the first surface and the second surface between the first pad and the second pad.Type: ApplicationFiled: March 7, 2023Publication date: March 21, 2024Inventors: Nobuhiro YAMAMOTO, Masahide TAKAZAWA
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Publication number: 20230420002Abstract: According to one embodiment, an electronic device includes a housing, a substrate, a connector, a metal member, a screw, first solder, and second solder. The substrate includes a first surface to which a second hole opens and a metal region to which a first hole opens. The region is provided on the first surface. The connector is provided with a third hole. The metal member is attached to the connector and includes a second surface to which a fourth hole opens and a joint inserted into the second hole. The screw attaches the connector and the metal member to the housing through the third hole and the fourth hole. The first solder joins the region and the second surface to each other. The second solder joins an inner surface of the second hole and the joint to each other.Type: ApplicationFiled: September 12, 2023Publication date: December 28, 2023Inventor: Masahide TAKAZAWA
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Patent number: 11790956Abstract: According to one embodiment, an electronic device includes a housing, a substrate, a connector, a metal member, a screw, first solder, and second solder. The substrate includes a first surface to which a second hole opens and a metal region to which a first hole opens. The region is provided on the first surface. The connector is provided with a third hole. The metal member is attached to the connector and includes a second surface to which a fourth hole opens and a joint inserted into the second hole. The screw attaches the connector and the metal member to the housing through the third hole and the fourth hole. The first solder joins the region and the second surface to each other. The second solder joins an inner surface of the second hole and the joint to each other.Type: GrantFiled: March 4, 2022Date of Patent: October 17, 2023Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage CorporationInventor: Masahide Takazawa
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Publication number: 20230282996Abstract: According to an embodiment, an electronic device includes a substrate and an electronic component. The substrate includes a first surface facing a first direction and to which a first hole and a second hole are open. The electronic component includes a base, a first protrusion in the first hole, and a second protrusion in the second hole. The first protrusion and the second protrusion protrude from the base. The first end of the first protrusion is more apart from the first surface than the second end of the second protrusion. The first protrusion and the second protrusion have a first inclined surface and a second inclined surface extending obliquely with respect to the first direction. In a third direction orthogonal to the first direction the first inclined surface is longer in length than the second inclined surface.Type: ApplicationFiled: September 7, 2022Publication date: September 7, 2023Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATIONInventors: Kiyokazu ISHIZAKI, Masahide TAKAZAWA, Nobuhiro YAMAMOTO
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Publication number: 20230087592Abstract: According to one embodiment, an electronic device includes a housing, a substrate, a connector, a metal member, a screw, first solder, and second solder. The substrate includes a first surface to which a second hole opens and a metal region to which a first hole opens. The region is provided on the first surface. The connector is provided with a third hole. The metal member is attached to the connector and includes a second surface to which a fourth hole opens and a joint inserted into the second hole. The screw attaches the connector and the metal member to the housing through the third hole and the fourth hole. The first solder joins the region and the second surface to each other. The second solder joins an inner surface of the second hole and the joint to each other.Type: ApplicationFiled: March 4, 2022Publication date: March 23, 2023Inventor: Masahide TAKAZAWA
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Patent number: 11562770Abstract: According to one embodiment, a disk device includes a housing, recording medium, a magnetic head, an internal wireless communication device, and an internal component. The housing has an internal space. The internal wireless communication device generates at least either of: an electric signal representing information to be written to the recording medium, the electric signal corresponding to light, a magnetic field, or an electric field generated by an external wireless communication device; and light, a magnetic field, or an electric field toward the external wireless communication device, the light, the magnetic field, or the electric field corresponding to an electric signal representing information read from the recording medium.Type: GrantFiled: September 8, 2021Date of Patent: January 24, 2023Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATIONInventors: Taichi Okano, Masahide Takazawa, Jai Liu, Nobuhiro Yamamoto, Kota Tokuda
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Patent number: 11536646Abstract: An electronic apparatus includes a wiring board. The wiring board also includes a first wiring pattern that is provided on the wiring board and includes a first wiring portion extending in a first direction. The wiring board further includes a second wiring pattern that includes a second wiring portion extending in the first direction. The wiring also includes a first via provided on the first wiring portion, and a second via provided on the second wiring portion. A power supply circuit applies a first voltage to the first wiring portion at periodic time intervals. A detection circuit outputs an alert signal when a current flows through the second wiring pattern.Type: GrantFiled: August 12, 2020Date of Patent: December 27, 2022Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATIONInventor: Masahide Takazawa
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Publication number: 20220301591Abstract: According to one embodiment, a disk device includes a housing, recording medium, a magnetic head, an internal wireless communication device, and an internal component. The housing has an internal space. The internal wireless communication device generates at least either of: an electric signal representing information to be written to the recording medium, the electric signal corresponding to light, a magnetic field, or an electric field generated by an external wireless communication device; and light, a magnetic field, or an electric field toward the external wireless communication device, the light, the magnetic field, or the electric field corresponding to an electric signal representing information read from the recording medium.Type: ApplicationFiled: September 8, 2021Publication date: September 22, 2022Inventors: Taichi OKANO, Masahide TAKAZAWA, Jai LIU, Nobuhiro YAMAMOTO, Kota TOKUDA
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Publication number: 20220301595Abstract: A disk device according to one embodiment includes a first conversion device, a second conversion device, an optical waveguide, a first component, and a second component. The first conversion device emits light corresponding to an electric signal. The second conversion device generates an electric signal corresponding to incident light. The optical waveguide includes a first end joined to the first conversion device and a second end joined to the second conversion device, and transmits light emitted from the first conversion device to the second conversion device. The first component is electrically connected to the first conversion device. The second component is electrically connected to the second conversion device, and communicates with the first component through the first conversion device, the optical waveguide, and the second conversion device.Type: ApplicationFiled: September 8, 2021Publication date: September 22, 2022Inventors: Taichi OKANO, Jia LIU, Masahide TAKAZAWA, Nobuhiro TAKAZAWA, Kota TOKUDA
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Patent number: 11289129Abstract: An electronic device according to one embodiment includes a housing, a first substrate, a second substrate, a first wireless communication device and a second wireless communication device. The first substrate is located inside the housing. The second substrate is located outside the housing and attached to the housing. The first wireless communication device is included in the first substrate. The second wireless communication device is included in the second substrate and wirelessly communicates with the first wireless communication device.Type: GrantFiled: August 31, 2020Date of Patent: March 29, 2022Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATIONInventors: Taichi Okano, Nobuhiro Yamamoto, Kota Tokuda, Jia Liu, Masahide Takazawa
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Publication number: 20210225412Abstract: An electronic device according to one embodiment includes a housing, a first substrate, a second substrate, a first wireless communication device and a second wireless communication device. The first substrate is located inside the housing. The second substrate is located outside the housing and attached to the housing. The first wireless communication device is included in the first substrate. The second wireless communication device is included in the second substrate and wirelessly communicates with the first wireless communication device.Type: ApplicationFiled: August 31, 2020Publication date: July 22, 2021Inventors: Taichi Okano, Nobuhiro Yamamoto, Kota Tokuda, Jia Liu, Masahide Takazawa
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Publication number: 20210215593Abstract: An electronic apparatus includes a wiring board. The wiring board also includes a first wiring pattern that is provided on the wiring board and includes a first wiring portion extending in a first direction. The wiring board further includes a second wiring pattern that includes a second wiring portion extending in the first direction. The wiring also includes a first via provided on the first wiring portion, and a second via provided on the second wiring portion. A power supply circuit applies a first voltage to the first wiring portion at periodic time intervals. A detection circuit outputs an alert signal when a current flows through the second wiring pattern.Type: ApplicationFiled: August 12, 2020Publication date: July 15, 2021Inventor: Masahide TAKAZAWA
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Publication number: 20180059970Abstract: A storage device includes a nonvolatile memory device that includes a storage area and a circuit configured to measure a write time required for writing data into the storage area and compare the measured write time with a threshold value, and a controller configured to prohibit the data from being written into the storage area in which the measured write time is determined to be longer than the threshold value by the circuit of the nonvolatile memory.Type: ApplicationFiled: February 28, 2017Publication date: March 1, 2018Inventor: Masahide TAKAZAWA
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Publication number: 20010052040Abstract: A data conversion device is provided in an information-processing device having an image-display device as an integral part thereof, wherein the information-processing device supplies data to the image-display device through the data conversion device. The data conversion device includes a voltage-level conversion unit converting a voltage level of input data of the data conversion device inputted from the information-processing device to a desired voltage level, and a bit-length conversion unit converting a bit length of the input data to a desired bit length. The data conversion device is implemented on a single semiconductor chip, and is directly connected to the information-processing device without using a data transmission method of transmitting data for a long distance.Type: ApplicationFiled: December 5, 2000Publication date: December 13, 2001Inventors: Masahide Takazawa, Yukihiro Okada