Abstract: A magnetron sputtering apparatus has a ring-shaped flat target and includes magnets of the same polarity respectively arranged at a front side and a rear side of the target extending along an inner peripheral edge of the target, and magnets of the same polarity respectively arranged at the front side and the rear side of the target extending along an outer peripheral edge of the target. The magnets extending along the inner peripheral edge of the target are inverted in polarity relative to the other magnets extending along the outer peripheral edge of the target.

Abstract: An ionization deposition apparatus includes an ion source which is located in a vacuum chamber and which is provided with gas introduction ports for supplying a gaseous film material into the vacuum chamber, a filament unit, which is separated into a plurality of independently controllable filaments, for generating thermoelectrons when the filaments are heated by filament currents, and an anode electrode for accelerating and colliding the thermoelectrons against molecules of the gaseous film material to thereby turn the molecules to plasma. A holder for holding a to-be-deposited object, the holder being placed confronting the anode electrode of the ion source in the vacuum chamber, and connected to a bias source to attract ions in the plasma to a surface of the holder.

Abstract: A sputtering apparatus to be used in reactive sputtering which mixes a reactive gas into a discharge gas so as to form chemical compound thin membranes.A heating means is provided for heating the target. Light such as infrared rays or the like, and laser beams are ideal as the heating means. A thermometer for applying light is preferable to measure the temperature of at least one portion of the target for controlling the heating condition of the target. The composition of the thin membrane to be formed by the reactive sputtering can may be made constant.