Patents by Inventor Masahiko Ekeuti

Masahiko Ekeuti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4088828
    Abstract: A printed circuit board wherein a conductor pattern is printed on an insulating base, first solder resist layers are formed on the surface of the conductor pattern remaining lands which are for soldering thereon, second solder resist layers for prevention of bridging for preventing bridging of solder are formed at least at portions where the gap between the lands is narrow, and thereby electronic parts such as an IC can be reliably assembled on the printed circuit board.
    Type: Grant
    Filed: March 1, 1976
    Date of Patent: May 9, 1978
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshio Yamamoto, Masaki Sono, Masahiko Ekeuti