Abstract: The resin sealing apparatus according to the present invention includes a press device for closing and opening an upper mold and a lower mold. The press device includes a fixed platen to which one of the upper mold and the lower mold is fixed and a movable platen to which the other one is fixed, a tie bar fixing the fixed platen and holding the movable platen so that the movable platen can be lifted and lowered, and a drive device lifting and lowering the movable platen. The fixed platen has a fixed portion fixed to the tie bar on the side of a first surface of a main body portion and a bell-shaped portion provided on the side of a second surface opposite to the first surface, and one of the upper mold and the lower mold is fixed to the bell-shaped portion.

Abstract: To provide a resin molding apparatus capable of correcting the bending of a workpiece during preheating or the like, improving production efficiency, and preventing the occurrence of defective products. A resin molding apparatus according to the present invention includes: a molding die which performs resin molding of a workpiece W having an electronic component mounted inside a carrier; and a loader which transports the workpiece, the loader includes a frame body which comes into contact with and separates from an outer edge portion of an upper surface of the workpiece, a moving device which moves the frame body up and down, and a chuck claw which comes into contact with an outer edge portion of a lower surface of the workpiece, and the frame body includes a contact portion which is provided over the entire circumference of the outer edge portion in the upper surface of the workpiece.

Abstract: A resin molding apparatus that can prevent a workpiece from deflecting during transfer and prevent the occurrence of molding defects due to the deflection is provided. A resin molding apparatus according to the present invention includes a molding mold that molds a workpiece on which an electronic component is mounted inside a carrier with a resin and a loader that transfers the workpiece, the loader includes a chuck that comes into contact with and separates from an outer edge part on a lower surface of the workpiece, a moving device that moves the chuck, and a frame that comes into contact with and separates from an outer edge part on an upper surface of the workpiece, and at least during transfer, the workpiece is able to be interposed between the chuck and the frame.

Abstract: A preferred aim of the invention is to provide technique for improving reliability of semiconductor devices when using a low-dielectric-constant film having a lower dielectric constant than a silicon oxide film to a part of an interlayer insulating film. More specifically, to achieve the preferred aim, an interlayer insulating film IL1 forming a first fine layer is formed of a middle-Young's-modulus film, and thus it is possible to separate an integrated high-Young's-modulus layer (a semiconductor substrate 1S and a contact interlayer insulating film CIL) and an interlayer insulating film (a low-Young's-modulus film; a low-dielectric-constant film) IL2 forming a second fine layer not to let them directly contact with each other, and stress can be diverged. As a result, film exfoliation of the interlayer insulating film IL2 formed of a low-Young's-modulus film can be prevented and thus reliability of semiconductor devices can be improved.

Abstract: A resin supply apparatus includes a calculation unit for calculating a resin supply pattern based on the shape of a cavity of a resin sealing mold, and a supply unit for supplying a resin to an object to be coated along the resin supply pattern. The resin supply pattern has a plurality of linear paths, and one of mutually adjacent linear paths is inclined with respect to an axis of symmetry that divides a cavity in line symmetry, the other one of the mutually adjacent linear paths is inclined with respect to the one linear path, and a region between the mutually adjacent linear paths is opened to the outside of the object to be coated, at least on a side on which the other linear path is separated from the one linear path.

Abstract: A resin supply apparatus, a resin sealing apparatus, and a method for manufacturing a resin-sealed product are provided. A resin supply apparatus supplies a resin onto a workpiece on which elements are arranged in a first direction and a second direction intersecting the first direction, respectively. The resin supply apparatus includes: an acquisition unit for acquiring arrangement information of the elements on the workpiece; a supply unit for supplying the resin onto the workpiece; a calculation unit for calculating a resin supply pattern based on the arrangement information; and a drive unit for moving at least one of the workpiece and the supply unit relative to the other along the resin supply pattern. The resin supply pattern has linear paths extending along the first direction, and a region between the mutually adjacent linear paths in the plurality of linear paths is opened to the outside of the workpiece.

Abstract: A resin molding device that can hold a thin and large-size workpiece without positional displacement when the workpiece is conveyed even if dimensional tolerance and rigidity are different, and can convey the workpiece to a mold frame without losing flatness or damage is provided. When a loader (4) holds a workpiece (W) aligned by a preheating part (10), a center position of a loader hand (4b) is aligned with a center position of the workpiece (W) according to an amount of positional displacement between an external form position of the workpiece (W) and a reference position in the X-Y direction and the workpiece (W) is then held.

Abstract: A resin molding device that is easy to handle until a thin and large-size workpiece is delivered to a loader, and can supply the workpiece to a mold frame while preventing the workpiece from losing its flatness and being damaged is provided. A resin molding device includes a workpiece transfer part (2) that reciprocates between a first position and a second position and transfers a workpiece (W), and in the workpiece transfer part (2), a holder plate (5) larger than an external form of the workpiece and having a thick plate thickness is mounted on a transfer part main body (2a), and the workpiece (W) that is positioned with respect to and overlaps the holder plate (5) based on the external form is transferred.

Abstract: A resin molding apparatus and a cleaning method of a workpiece which can prevent a workpiece from being carried into a mold die in a state where particles (dust) are adhered to the workpiece, and can prevent deterioration of molding quality. A resin molding apparatus according to the present invention, in which a workpiece with an electronic component mounted on a carrier and a mold resin are carried into a mold die, includes: a press part having the mold die for clamping and resin-sealing the workpiece and the mold resin; and a cleaning apparatus for cleaning a back surface of the workpiece conveyed to the press part, wherein the electronic component is not mounted on the back surface. The cleaning apparatus is arranged at a position overlapping a conveyance path of the workpiece on the upstream side of the press part.

Abstract: To provide a resin molding apparatus capable of correcting the bending of a workpiece during preheating or the like, improving production efficiency, and preventing the occurrence of defective products. A resin molding apparatus according to the present invention includes: a molding die which performs resin molding of a workpiece W having an electronic component mounted inside a carrier; and a loader which transports the workpiece, the loader includes a frame body which comes into contact with and separates from an outer edge portion of an upper surface of the workpiece, a moving device which moves the frame body up and down, and a chuck claw which comes into contact with an outer edge portion of a lower surface of the workpiece, and the frame body includes a contact portion which is provided over the entire circumference of the outer edge portion in the upper surface of the workpiece.

Abstract: A resin molding apparatus that can prevent a workpiece from deflecting during transfer and prevent the occurrence of molding defects due to the deflection is provided. A resin molding apparatus according to the present invention includes a molding mold that molds a workpiece on which an electronic component is mounted inside a carrier with a resin and a loader that transfers the workpiece, the loader includes a chuck that comes into contact with and separates from an outer edge part on a lower surface of the workpiece, a moving device that moves the chuck, and a frame that comes into contact with and separates from an outer edge part on an upper surface of the workpiece, and at least during transfer, the workpiece is able to be interposed between the chuck and the frame.

Abstract: A preferred aim of the invention is to provide technique for improving reliability of semiconductor devices when using a low-dielectric-constant film having a lower dielectric constant than a silicon oxide film to apart of an interlayer insulating film. More specifically, to achieve the preferred aim, an interlayer insulating film IL1 forming a first fine layer is formed of a middle-Young's-modulus film, and thus it is possible to separate an integrated high-Young's-modulus layer (a semiconductor substrate 1S and a contact interlayer insulating film CIL) and an interlayer insulating film (a low-Young's-modulus film; a low-dielectric-constant film) IL2 forming a second fine layer not to let them directly contact with each other, and stress can be diverged. As a result, film exfoliation of the interlayer insulating film IL2 formed of a low-Young's-modulus film can be prevented and thus reliability of semiconductor devices can be improved.

Abstract: In a semiconductor device, a width of a second epitaxial layer is greater than a width of a first epitaxial layer, and a thickness of an end portion of the second epitaxial layer, which is in contact with an element isolation portion, is smaller than a thickness of an end portion of the first epitaxial layer, which is in contact with the element isolation portion, and a second shortest distance between the element isolation portion and a second plug is greater than a first shortest distance between the element isolation portion and a first plug.

Abstract: In a semiconductor device, a width of a second epitaxial layer is greater than a width of a first epitaxial layer, and a thickness of an end portion of the second epitaxial layer, which is in contact with an element isolation portion, is smaller than a thickness of an end portion of the first epitaxial layer, which is in contact with the element isolation portion, and a second shortest distance between the element isolation portion and a second plug is greater than a first shortest distance between the element isolation portion and a first plug.

Abstract: The compact resin molding machine is capable of efficiently performing a sequence of molding actions from feeding a work and resin to accommodating the molded work. The resin molding machine comprises: a work conveying mechanism including a robot, which has a robot hand for holding the work and which is capable of rotating and linearly moving; a work feeding section for feeding the work; a resin feeding section for feeding the resin; a press section including a molding die set, in which the work is resin-molded; a work accommodating section for accommodating the molded work; and a control section controlling the entire resin molding machine. The work feeding section, the resin feeding section, the press section and the work accommodating section are located to enclose a moving area of the robot of the work conveying mechanism.

Abstract: A semiconductor device in which reliability of a bonding pad to which a conductive wire is bonded is achieved. A bonding pad having an OPM structure is formed of an Al—Cu alloy film having a Cu concentration of 2 wt % or more. By increasing the Cu concentration, the Al—Cu alloy film forming the bonding pad is hardened. Therefore, the bonding pad is difficult to be deformed by impact in bonding of a Cu wire, and deformation of an OPM film as following the deformation of the bonding pad can be reduced. In this manner, concentration of a stress on the OPM film caused by the impact from the Cu wire can be reduced, and therefore, the breakage of the OPM film can be prevented.

Abstract: A semiconductor device in which reliability of a bonding pad to which a conductive wire is bonded is achieved. A bonding pad having an OPM structure is formed of an Al—Cu alloy film having a Cu concentration of 2 wt % or more. By increasing the Cu concentration, the Al—Cu alloy film forming the bonding pad is hardened. Therefore, the bonding pad is difficult to be deformed by impact in bonding of a Cu wire, and deformation of an OPM film as following the deformation of the bonding pad can be reduced. In this manner, concentration of a stress on the OPM film caused by the impact from the Cu wire can be reduced, and therefore, the breakage of the OPM film can be prevented.

Abstract: A semiconductor device in which reliability of a bonding pad to which a conductive wire is bonded is achieved. A bonding pad having an OPM structure is formed of an Al—Cu alloy film having a Cu concentration of 2 wt % or more. By increasing the Cu concentration, the Al—Cu alloy film forming the bonding pad is hardened. Therefore, the bonding pad is difficult to be deformed by impact in bonding of a Cu wire, and deformation of an OPM film as following the deformation of the bonding pad can be reduced. In this manner, concentration of a stress on the OPM film caused by the impact from the Cu wire can be reduced, and therefore, the breakage of the OPM film can be prevented.

Abstract: The method is capable of resin-molding one side face of a work in a molding die set, in which the work is sucked and held on at least one of clamping faces and resin-molded in a cavity concave section. The method comprises the steps of: sucking and holding a release film which covers at least one of the clamping faces of the molding die set; setting the work in the molding die set; sucking the other side face of the work through a work sucking hole of the release film, which is formed before or after holding the release film, so as to hold the work on the clamping face; closing the molding die set so as to clamp the work; and pressurizing and heating the resin, which has been accommodated in the cavity concave section, with resin.

Abstract: A semiconductor device in which reliability of a bonding pad to which a conductive wire is bonded is achieved. A bonding pad having an OPM structure is formed of an Al—Cu alloy film having a Cu concentration of 2 wt % or more. By increasing the Cu concentration, the Al—Cu alloy film forming the bonding pad is hardened. Therefore, the bonding pad is difficult to be deformed by impact in bonding of a Cu wire, and deformation of an OPM film as following the deformation of the bonding pad can be reduced. In this manner, concentration of a stress on the OPM film caused by the impact from the Cu wire can be reduced, and therefore, the breakage of the OPM film can be prevented.