Abstract: A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder composition, oxidation of the solder composition is suppressed. As a result, although the hot air is used for heating, a solder bump can be formed by the liquid-like solder composition. Further, because the lid structure is uniformly heated by the hot air, radiation heat from the lid structure is also uniform, and a container is more uniformly heated. In addition, because the hot air is suppressed from directly blowing against a liquid surface, the liquid-like solder composition is not scattered by the hot air.

Abstract: An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower portion of the substrate or the jig and by a feature that a solder bump is formed on a pad electrode by heating or reflowing a solder composition which is a mixture containing solder particles, a flux component, and a liquid material which is liquid at normal temperature or changing to liquid when heated, and the composition is heated from the substrate side.

Abstract: A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder composition, oxidation of the solder composition is suppressed. As a result, although the hot air is used for heating, a solder bump can be formed by the liquid-like solder composition. Further, because the lid structure is uniformly heated by the hot air, radiation heat from the lid structure is also uniform, and a container is more uniformly heated. In addition, because the hot air is suppressed from directly blowing against a liquid surface, the liquid-like solder composition is not scattered by the hot air.

Abstract: Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid in a liquid tank, a substrate is positioned with a surface facing up. Subsequently, the inert liquid containing solder fine particles is fed from a solder fine particle forming unit to the liquid tank and the solder fine particles are dropped from a supply pipe onto the substrate in the inert liquid. The solder fine particles naturally fall down by the gravity, thereby reaching the substrate. The solder fine particles reached on the pad electrodes on the substrate stay there due to the gravity, and spread on the surfaces of the pad electrodes after the solder wet time, thereby forming solder coating.

Abstract: [Problem to be Solved] [Solution] A solder composition 10 is for forming a solder layer on an electrode 21 provided on a substrate 20. The solder composition 10 includes solder powder composed of a plurality of solder particles 12 coated with organic films 11, and a medium 13 having a boiling point not lower than the melting point of the solder powder. The solder layer on the electrode 21 grows by coalescence of the solder particles 12 with the solder layer. Therefore, when the coalescence of the solder particles proceeds and the amount of the organic film per unit surface area of the solder layer reaches a certain level, the growth of the solder layer stops. Namely, the final solder amount of the solder layer is determined depending on the initial size of the solder particle 12 and amount of the organic film 11. Thereby, it is possible to inhibit coalescence of the solder particles 12 on the electrode 21 beyond necessity, so a short-circuit failure of the electrode 21 can be prevented.

Abstract: A solder composition capable of in the bump formation on a substrate, simplifying the coating operation. There is provided solder composition (10) comprising a mixture of liquid substance (12) and solder particles (11), wherein the liquid substance (12) contains a flux component of organic acid whose reaction temperature for oxide film removal is in the vicinity of the melting point of the solder particles and has such a viscosity that the liquid substance flows at ordinary temperature and accumulates in the form of a layer on substrate (20). The solder particles (11) consist of a particulate agent that settles in the liquid substance (12) toward a solder base material, having a particle diameter and mixing ratio enabling uniform dispersion in the liquid substance (12).

Abstract: An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower portion of the substrate or the jig and by a feature that a solder bump is formed on a pad electrode by heating or reflowing a solder composition which is a mixture containing solder particles, a flux component, and a liquid material which is liquid at normal temperature or changing to liquid when heated, and the composition is heated from the substrate side.

Abstract: Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid (13) in a liquid tank (11), a substrate (20) is positioned with a surface (21) facing up. Subsequently, the inert liquid (13) containing solder fine particles (14) is fed from a solder fine particle forming unit (15) to the liquid tank (11) and the solder fine particles (14) are dropped from a supply pipe (16) onto the substrate (20) in the inert liquid (13). The solder fine particles (14) naturally fall down by the gravity, thereby reaching the substrate (20). The solder fine particles (14) reached on the pad electrodes on the substrate (20) stay there due to the gravity, and spread on the surfaces of the pad electrodes after the solder wet time, thereby forming solder coating.

Abstract: Process gas is fed from a gas supply means to a plasma generating means in a vacuum chamber, and hydrogen-containing plasma is generated by the plasma generating means under a low pressure. A soft solder alloy on the surface of a workpiece supported by a workpiece exposing means is exposed to the hydrogen-containing plasma so that the soft solder alloy is irradiated with the hydrogen-containing plasma. Either simultaneously with or immediately after the plasma irradiation, the soft solder alloy undergoes reflow treatment in a vacuum by a heating means. As no flux is used, there is no need of a washing process, and the bump-shaped electrode terminals produced by using the inexpensive soft solder alloy on the surface of the workpiece have great reliability.

Abstract: Process gas is fed from a gas supply means to a plasma generating means in a vacuum chamber, and hydrogen-containing plasma is generated by the plasma generating means under a low pressure. A soft solder alloy on the surface of a workpiece supported by a workpiece exposing means is exposed to the hydrogen-containing plasma so that the soft solder alloy is irradiated with the hydrogen-containing plasma. Either simultaneously with or immediately after the plasma irradiation, the soft solder alloy undergoes reflow treatment in a vacuum by a heating means. As no flux is used, there is no need of a washing process, and the bump-shaped electrode terminals produced by using the inexpensive soft solder alloy on the surface of the workpiece have great reliability.

Abstract: Process gas is fed from a gas supply means to a plasma generating means in a vacuum chamber, and hydrogen-containing plasma is generated by the plasma generating means under a low pressure. A soft solder alloy on the surface of a workpiece supported by a workpiece exposing means is exposed to the hydrogen-containing plasma so that the soft solder alloy is irradiated with the hydrogen-containing plasma. Either simultaneously with or immediately after the plasma irradiation, the soft solder alloy undergoes reflow treatment in a vacuum by a heating means. As no flux is used, there is no need of a washing process, and the bump-shaped electrode terminals produced by using the inexpensive soft solder alloy on the surface of the workpiece have great reliability.