Patents by Inventor Masahiko Igaue

Masahiko Igaue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayered printed wiring board
    Patent number: 8942003
    Abstract: A multilayered printed wiring board includes a plurality of insulating layers; a plurality of wiring layers which are located between the corresponding adjacent insulating layers; and a plurality of interlayer connection conductors for electrically connecting the wiring layers through the insulating layers; wherein a cavity is formed through one or more of the insulating layers so as to insert a first electric/electronic component and an area for embedding a second electric/electronic component is defined for the insulating layers.
    Type: Grant
    Filed: February 14, 2013
    Date of Patent: January 27, 2015
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Takahiro Sahara, Atsushi Kobayashi, Kiyoshi Takeuchi, Masahiko Igaue
  • MULTILAYERED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20130220686
    Abstract: A multilayered printed wiring board includes a plurality of insulating layers; a plurality of wiring layers which are located between the corresponding adjacent insulating layers; and a plurality of interlayer connection conductors for electrically connecting the wiring layers through the insulating layers; wherein a cavity is formed through one or more of the insulating layers so as to insert a first electric/electronic component and an area for embedding a second electric/electronic component is defined for the insulating layers.
    Type: Application
    Filed: February 14, 2013
    Publication date: August 29, 2013
    Inventors: Takahiro Sahara, Atsushi Kobayashi, Kiyoshi Takeuchi, Masahiko Igaue
  • Multilayered printed wiring board and method for manufacturing the same
    Patent number: 8476535
    Abstract: A multilayered printed wiring board includes a flexible wiring board with wiring layers on both main surfaces thereof; a rigid wiring board with wiring layers on both main surfaces thereof and formed opposite to the flexible wiring board under the condition that an area of the main surface of the rigid wiring board is smaller than an area of the main surface of the flexible wiring board; and an electric/electronic component embedded in the rigid wiring board.
    Type: Grant
    Filed: November 9, 2010
    Date of Patent: July 2, 2013
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Takahiro Sahara, Atsushi Kobayashi, Masahiko Igaue, Kiyoshi Takeuchi
  • Multilayered printed wiring board
    Patent number: 8400776
    Abstract: A multilayered printed wiring board includes a plurality of insulating layers; a plurality of wiring layers which are located between the corresponding adjacent insulating layers; and a plurality of interlayer connection conductors for electrically connecting the wiring layers through the insulating layers; wherein a cavity is formed through one or more of the insulating layers so as to insert a first electric/electronic component and an area for embedding a second electric/electronic component is defined for the insulating layers.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: March 19, 2013
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Takahiro Sahara, Atsushi Kobayashi, Kiyoshi Takeuchi, Masahiko Igaue
  • Multilayered printed wiring board and method for manufacturing the same
    Publication number: 20110061903
    Abstract: A multilayered printed wiring board includes a flexible wiring board with wiring layers on both main surfaces thereof; a rigid wiring board with wiring layers on both main surfaces thereof and formed opposite to the flexible wiring board under the condition that an area of the main surface of the rigid wiring board is smaller than an area of the main surface of the flexible wiring board; and an electric/electronic component embedded in the rigid wiring board.
    Type: Application
    Filed: November 9, 2010
    Publication date: March 17, 2011
    Inventors: Takahiro Sahara, Atsushi Kobayashi, Masahiko Igaue, Kiyoshi Takeuchi
  • Multilayered printed wiring board and method for manufacturing the same
    Publication number: 20080049405
    Abstract: A multilayered printed wiring board includes a plurality of insulating layers; a plurality of wiring layers which are located between the corresponding adjacent insulating layers; and a plurality of interlayer connection conductors for electrically connecting the wiring layers through the insulating layers; wherein a cavity is formed through one or more of the insulating layers so as to insert a first electric/electronic component and an area for embedding a second electric/electronic component is defined for the insulating layers.
    Type: Application
    Filed: July 27, 2007
    Publication date: February 28, 2008
    Inventors: Takahiro Sahara, Atsushi Kobayashi, Kiyoshi Takeuchi, Masahiko Igaue
  • Multilayered printed wiring board and method for manufacturing the same
    Publication number: 20080047737
    Abstract: A multilayered printed wiring board includes a flexible wiring board with wiring layers on both main surfaces thereof; a rigid wiring board with wiring layers on both main surfaces thereof and formed opposite to the flexible wiring board under the condition that an area of the main surface of the rigid wiring board is smaller than an area of the main surface of the flexible wiring board; and an electric/electronic component embedded in the rigid wiring board.
    Type: Application
    Filed: July 26, 2007
    Publication date: February 28, 2008
    Inventors: Takahiro Sahara, Atsushi Kobayashi, Masahiko Igaue, Kiyoshi Takeuchi