Patents by Inventor Masahiko Imoto
Masahiko Imoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150165998Abstract: A side collision detection device for a vehicle includes a hollow detection tube member, a pressure sensor, and a control device. The detection tube member is arranged in a door of the vehicle. The door includes a rigid member that is provided to extend in a front-rear direction of the vehicle. The detection tube member is arranged along an outer surface of the rigid member in a width direction of the vehicle. The pressure sensor detects a pressure in the detection tube member. The control device detects a collision of an object with the door based on a result of the detection of the pressure by the pressure sensor.Type: ApplicationFiled: December 10, 2014Publication date: June 18, 2015Inventor: Masahiko IMOTO
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Publication number: 20150114081Abstract: An outer panel and an inner panel of a vehicle door form a closed sealing chamber. A pressure sensor is attached to the inner panel to detect a pressure within the closed sealing chamber. The pressure sensor detects an increase in pressure caused by constriction of the closed sealing chamber when a collision occurs to a vehicle door. The in-vehicle speaker supplies a sound wave into the closed sealing chamber and detects, as an inspection pressure, a pressure in the closed sealing chamber when the sound wave is supplied. In an initial state of a vehicle, the inspection pressure is compared with an initial pressure threshold value, which is set based on a pressure in the closed sealing chamber generated when the sound wave is supplied. When the inspection pressure is equal to or lower than the initial pressure threshold value, it is detected that the air-tightness of the closed sealing chamber is lowered.Type: ApplicationFiled: October 14, 2014Publication date: April 30, 2015Inventor: Masahiko IMOTO
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Patent number: 8053685Abstract: A metal wiring plate includes a soldering portion to which an electronic device is soldered and a wiring portion extending from the soldering portion and configured to electrically connect the electronic device to other device. The wiring portion includes a narrow portion located adjacent to the soldering portion. The width of the narrow portion is less than the width of the soldering portion so that the narrow portion helps prevent melted solder applied to the soldering portion from spreading to areas outside the soldering portion. The narrow portion allows the electronic apparatus to be surely soldered to the soldering portion without using solder resist.Type: GrantFiled: April 22, 2008Date of Patent: November 8, 2011Assignee: Denso CorportionInventors: Tatsuya Watanabe, Masahiko Imoto, Hideyuki Iiboshi, Shinichi Awano
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Patent number: 7905131Abstract: A resin leak detector includes a pressure sensor element and a leak determination unit. The pressure sensor element detects a pressure in a case cavity. That is, when resin leaks into a space between an upper circuit case and a lower circuit case, the pressure in the case cavity decreases temporarily. The decrease of the pressure in the case cavity is detected by the pressure sensor element based on comparison between a detected pressure and a predetermined lower limit. The resin leak into the upper and lower circuit case is detected without cutting an outer case of an electronic device such as an acceleration sensor or the like.Type: GrantFiled: June 17, 2008Date of Patent: March 15, 2011Assignee: Denso CorporationInventors: Tatsuya Watanabe, Masahiko Imoto, Yoshinari Goshima
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Patent number: 7776247Abstract: In a method of manufacturing an electronic device, an electronic element is disposed on a wiring plate that is electrically coupled with a connector terminal, a first surface of the wiring plate is covered with a first casing element and a second surface of the wiring plate is covered with a second casing element to form an electronic circuit part, the electronic circuit part is disposed in a case cavity of a molding tool, and a resin is filled into the case cavity to form the resin-molded case while keeping a state where a first pressure that pushes the first casing element toward the wiring plate and that changes with time is substantially equal to a second pressure that pushes the second casing element toward the wiring plate and that changes with time.Type: GrantFiled: June 2, 2008Date of Patent: August 17, 2010Assignee: Denso CorporationInventors: Tatsuya Watanabe, Masahiko Imoto, Yoshinari Goshima
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Patent number: 7719006Abstract: A semiconductor device includes: a semiconductor chip; a package for accommodating the chip, wherein the package has a box shape with an opening and a bottom; and a cover for sealing the opening of the package. The semiconductor chip is disposed on the bottom of the package. The cover has a plate shape. The cover includes a protrusion, which is disposed at a center of the plate shape. The protrusion protrudes toward an outside of the package.Type: GrantFiled: February 26, 2008Date of Patent: May 18, 2010Assignee: Denso CorporationInventors: Tatsuya Watanabe, Masahiko Imoto
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Publication number: 20080314121Abstract: A resin leak detector includes a pressure sensor element and a leak determination unit. The pressure sensor element detects a pressure in a case cavity. That is, when resin leaks into a space between an upper circuit case and a lower circuit case, the pressure in the case cavity decreases temporarily. The decrease of the pressure in the case cavity is detected by the pressure sensor element based on comparison between a detected pressure and a predetermined lower limit. The resin leak into the upper and lower circuit case is detected without cutting an outer case of an electronic device such as an acceleration sensor or the like.Type: ApplicationFiled: June 17, 2008Publication date: December 25, 2008Applicant: DENSO CORPORATIONInventors: Tatsuya Watanabe, Masahiko Imoto, Yoshinari Goshima
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Publication number: 20080296796Abstract: In a method of manufacturing an electronic device, an electronic element is disposed on a wiring plate that is electrically coupled with a connector terminal, a first surface of the wiring plate is covered with a first casing element and a second surface of the wiring plate is covered with a second casing element to form an electronic circuit part, the electronic circuit part is disposed in a case cavity of a molding tool, and a resin is filled into the case cavity to form the resin-molded case while keeping a state where a first pressure that pushes the first casing element toward the wiring plate and that changes with time is substantially equal to a second pressure that pushes the second casing element toward the wiring plate and that changes with time.Type: ApplicationFiled: June 2, 2008Publication date: December 4, 2008Applicant: DENSO CORPORATIONInventors: Tatsuya Watanabe, Masahiko Imoto, Yoshinari Goshima
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Publication number: 20080287008Abstract: An electronic device includes an electronic circuit section, a case, and a connector housing. The electronic circuit section includes a connector terminal. The case seals the electronic circuit section in such a manner that the connector terminal protrudes to an outside of the case. The connector housing is integrated with the case and has an approximately cylindrical shape to surround an outer circumference of the connector terminal. The case and the connector housing are made of resin with a molding tool by filling resin into a case cavity and a connector-housing cavity of the molding tool in a state where the electronic circuit section is held by a holding portion of the molding tool.Type: ApplicationFiled: May 13, 2008Publication date: November 20, 2008Applicant: DENSO CORPORATIONInventors: Tatsuya Watanabe, Masahiko Imoto, Yoshinari Goshima
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Publication number: 20080264683Abstract: A metal wiring plate includes a soldering portion to which an electronic device is soldered and a wiring portion extending from the soldering portion and configured to electrically connect the electronic device to other device. The wiring portion includes a narrow portion located adjacent to the soldering portion. The width of the narrow portion is less than the width of the soldering portion so that the narrow portion helps prevent melted solder applied to the soldering portion from spreading to areas outside the soldering portion. The narrow portion allows the electronic apparatus to be surely soldered to the soldering portion without using solder resist.Type: ApplicationFiled: April 22, 2008Publication date: October 30, 2008Applicant: DENSO CORPORATIONInventors: Tatsuya Watanabe, Masahiko Imoto, Hideyuki Iiboshi, Shinichi Awano
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Publication number: 20080236307Abstract: A sensor apparatus includes a sensor body made of resin, an electronic circuit housed in the sensor body and constructed with electronic devices configured to detect a physical quantity and output a sensor signal indicative of the detected physical quantity, connector terminals for electrically connecting the electronic circuit to an external apparatus. The terminals are supported by the sensor body and have first end portions located outside the sensor body and second end portions located inside the sensor body. The electronic devices are physically and electrically connected directly to the second end portions of the terminals. The electronic devices and the second end portions of the terminals are integrally molded in the sensor body.Type: ApplicationFiled: March 24, 2008Publication date: October 2, 2008Applicant: DENSO CORPORATIONInventors: Tatsuya Watanabe, Masahiko Imoto
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Publication number: 20080224304Abstract: A semiconductor device includes: a semiconductor chip; a package for accommodating the chip, wherein the package has a box shape with an opening and a bottom; and a cover for sealing the opening of the package. The semiconductor chip is disposed on the bottom of the package. The cover has a plate shape. The cover includes a protrusion, which is disposed at a center of the plate shape. The protrusion protrudes toward an outside of the package.Type: ApplicationFiled: February 26, 2008Publication date: September 18, 2008Applicant: DENSO CorporationInventors: Tatsuya Watanabe, Masahiko Imoto
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Patent number: 7235749Abstract: A collision impact detector detects deceleration of a vehicle caused by its collision with another vehicle or an obstacle. A rotor is rotatably supported on a shaft and biased by a coil spring in a direction opposite to a rotational direction in which the rotor is rotated by the deceleration. One axial end of the coil spring is supported by a first support integrally formed with the rotor, and the other axial end of the coil spring is supported by a second support formed separately from the rotor. In this manner, a friction torque generated between the coil spring and the second support is eliminated, thereby considerably reducing a total friction torque associated with rotation of the rotor. The second support may be formed either integrally with or separately from a housing supporting the shaft.Type: GrantFiled: April 29, 2004Date of Patent: June 26, 2007Assignee: DENSO CorporationInventor: Masahiko Imoto
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Publication number: 20050000287Abstract: A collision impact detector detects deceleration of a vehicle caused by its collision with another vehicle or an obstacle. A rotor is rotatably supported on a shaft and biased by a coil spring in a direction opposite to a rotational direction in which the rotor is rotated by the deceleration. One axial end of the coil spring is supported by a first support integrally formed with the rotor, and the other axial end of the coil spring is supported by a second support formed separately from the rotor. In this manner, a friction torque generated between the coil spring and the second support is eliminated, thereby considerably reducing a total friction torque associated with rotation of the rotor. The second support may be formed either integrally with or separately from a housing supporting the shaft.Type: ApplicationFiled: April 29, 2004Publication date: January 6, 2005Inventor: Masahiko Imoto
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Patent number: 6642461Abstract: A deceleration impact detector for detecting a vehicle collision or the like is composed of a rotor having an eccentric gravity center, a spring biasing the rotor to its initial position, a cam connected to rotor, and a pair of contacts consisting of a movable contact and a stationary contact. The rotor rotates together with the cam when a deceleration exceeding a predetermined level is imposed on the rotor. The pair of contacts are closed by the cam thereby to generate an electrical signal to inflate an air-bag. The movable contact is made of a resilient leaf spring, while the stationary contact is made of a plate having a high rigidity, so that resonant vibrations of the stationary contact otherwise caused by a high deceleration impact are avoided.Type: GrantFiled: April 19, 2002Date of Patent: November 4, 2003Assignee: Denso CorporationInventor: Masahiko Imoto
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Publication number: 20030000816Abstract: A deceleration impact detector for detecting a vehicle collision or the like is composed of a rotor having an eccentric gravity center, a spring biasing the rotor to its initial position, a cam connected to rotor, and a pair of contacts consisting of a movable contact and a stationary contact. The rotor rotates together with the cam when a deceleration exceeding a predetermined level is imposed on the rotor. The pair of contacts are closed by the cam thereby to generate an electrical signal to inflate an air-bag. The movable contact is made of a resilient leaf spring, while the stationary contact is made of a plate having a high rigidity, so that resonant vibrations of the stationary contact otherwise caused by a high deceleration impact are avoided.Type: ApplicationFiled: April 19, 2002Publication date: January 2, 2003Applicant: DENSO CORPORATIONInventor: Masahiko Imoto