Patents by Inventor Masahiko Iso

Masahiko Iso has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5227099
    Abstract: A method for printing a letter, character or a figure on an inner ear type headphone, which is a molded body of a thermoplastic synthetic resin, by irradiating the surface with a laser light, and a headphone housing on which the letter etc. has been printed by the above method. The printing is performed by irradiating the surface of the synthetic resin molded body with a laser light for expanding any moisture or air contained in the molded body for foaming the surface. Printing is achieved in the form of foamed regions of the synthetic resin and hence is clear and superior in abrasion resistance and durability.
    Type: Grant
    Filed: July 23, 1991
    Date of Patent: July 13, 1993
    Assignee: Sony Corporation
    Inventors: Yoshiyuki Kamon, Masahiko Iso, Takayuki Ishii
  • Patent number: 5224171
    Abstract: A method for printing a letter, character or a figure on an inner ear type headphone, which is a molded body of a thermoplastic synthetic resin, by irradiating the surface with a laser light, and a headphone housing on which the letter etc. has been printed by the above method. The printing is performed by irradiating the surface of the synthetic resin molded body with a laser light for expanding any moisture or air contained in the molded body for foaming the surface. Printing is achieved in the form of foamed regions of the synthetic resin and hence is clear and superior in abrasion resistance and durability.
    Type: Grant
    Filed: April 23, 1992
    Date of Patent: June 29, 1993
    Assignee: Sony Corporation
    Inventors: Yoshiyuki Kamon, Masahiko Iso, Takayuki Ishii
  • Patent number: 4981194
    Abstract: An electro-acoustic transducer includes a housing enclosing an electro-acoustic transducer device and having an opening by which the diaphragm side of the transducer device is exposed to the outside, and a ring provided to the outer surface of the perimeter of the opening. The outer perimeter of the ring is adapted to be softer and more pliable than the housing.
    Type: Grant
    Filed: October 18, 1988
    Date of Patent: January 1, 1991
    Assignee: Sony Corporation
    Inventors: Yoshiyuki Kamon, Masahiko Iso, Makoto Yamagishi