Patents by Inventor Masahiko Kanno

Masahiko Kanno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE
    Publication number: 20160199946
    Abstract: A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is a vacuum pickup surface. Each vacuum pickup surface is a sheared surface and extends along a longitudinal direction of the rectangular parallelepiped solder piece. The solder piece may be located in an open cavity in a supply tape with one of only the four vacuum pickup surfaces exposed to be available for vacuum pickup.
    Type: Application
    Filed: March 21, 2016
    Publication date: July 14, 2016
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Masahiko ABE, Koji WATANABE, Hideaki TAKAHASHI, Masahiko KANNO, Masaya ITO
  • Solder piece, chip solder and method of fabricating solder piece
    Patent number: 9327364
    Abstract: A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is a vacuum pickup surface. Each vacuum pickup surface is a sheared surface and extends along a longitudinal direction of the rectangular parallelepiped solder piece. The solder piece may be located in an open cavity in a supply tape with one of only the four vacuum pickup surfaces exposed to be available for vacuum pickup.
    Type: Grant
    Filed: January 15, 2015
    Date of Patent: May 3, 2016
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Masahiko Abe, Koji Watanabe, Hideaki Takahashi, Masahiko Kanno, Masaya Ito
  • SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE
    Publication number: 20150122874
    Abstract: A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is a vacuum pickup surface. Each vacuum pickup surface is a sheared surface and extends along a longitudinal direction of the rectangular parallelepiped solder piece. The solder piece may be located in an open cavity in a supply tape with one of only the four vacuum pickup surfaces exposed to be available for vacuum pickup.
    Type: Application
    Filed: January 15, 2015
    Publication date: May 7, 2015
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Masahiko ABE, Koji WATANABE, Hideaki TAKAHASHI, Masahiko KANNO, Masaya ITO
  • Solder piece, chip solder and method of fabricating solder piece
    Patent number: 8991679
    Abstract: A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is sucked surface.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: March 31, 2015
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Masahiko Abe, Koji Watanabe, Hideaki Takahashi, Masahiko Kanno, Masaya Ito
  • SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE
    Publication number: 20130082087
    Abstract: A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is sucked surface.
    Type: Application
    Filed: September 30, 2011
    Publication date: April 4, 2013
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Masahiko Abe, Koji Watanabe, Hideaki Takahashi, Masahiko Kanno, Masaya Ito