Abstract: A multilayer substrate includes a first metal plate forming a first coil; a second metal plate facing the first metal plate in a coil-winding axis direction and forming a second coil; a first insulating layer having therein the first metal plate; and a second insulating layer having therein the second metal plate. A metal foil is connected to the first metal plate through a plurality of via holes. An electronic component embedded in the first insulating layer is connected to a pattern formed on the metal foil.

Abstract: A multilayer substrate includes a first metal plate forming a first coil; a second metal plate facing the first metal plate in a coil-winding axis direction and forming a second coil; a first insulating layer having therein the first metal plate; and a second insulating layer having therein the second metal plate. A metal foil is connected to the first metal plate through a plurality of via holes. An electronic component embedded in the first insulating layer is connected to a pattern formed on the metal foil.

Abstract: An electronic device includes a heat dissipation member, a power element that is thermally coupled to the heat dissipation member, and a first conductive layer to which the power element is electrically coupled. The electronic device further includes a control element that controls a switching operation of the power element, a second conductive layer to which the control element is electrically coupled, and a resin layer arranged between the first conductive layer and the second conductive layer. The power element is embedded in the resin layer. The first conductive layer, the resin layer, and the second conductive layer are stacked on the heat dissipation member in this order from the ones closer to the heat dissipation member.

Abstract: An electronic device includes a heat dissipation member, a power element that is thermally coupled to the heat dissipation member, and a first conductive layer to which the power element is electrically coupled. The electronic device further includes a control element that controls a switching operation of the power element, a second conductive layer to which the control element is electrically coupled, and a resin layer arranged between the first conductive layer and the second conductive layer. The power element is embedded in the resin layer. The first conductive layer, the resin layer, and the second conductive layer are stacked on the heat dissipation member in this order from the ones closer to the heat dissipation member.

Abstract: A glass board used in the production of liquid crystal panels includes a matrix of individual substrates. Each of the substrates has a contact portion of an electrode formed on one of its principle surfaces. The individual substrates are spaced from each other so that the contact portions of adjacent substrates are not in contact with each other. Thus, when the individual substrates are cut, the contact portions are not weakened and contaminants are prevented from getting between the contact portions and the substrates.

Abstract: First and second substrates (1, 2) oppose each other. A display apparatus includes first and second opposing substrates. (1, 2). A common electrode (5) is formed on the side of the liquid crystal layer (3) of the second substrate (2). Display electrodes (4) of liquid crystal cells (LC) are formed on the side of the liquid crystal layer (3) of the first substrate (1). Pixel driving elements (106) are connected to the display electrodes (4). On-chip color filters (8a to 8c, 41a to 41c, 51a to 51c) of respective colors RGB, made of a photosensitive high polymer color film (31, 43, 53), are formed on the side of the liquid crystal layer (3) of the display electrodes (4). A black matrix (9, 42, 52), made of a photosensitive high polymer color film (33, 54), is formed between the on-chip color filters (8a to 8c, 41a to 41c, 51a to 51c) of the respective colors RGB.