Abstract: The present invention provides a flexographic printing plate in which the dot gain of fine dots in a fade-out part is reduced and printability is improved. A flexographic printing plate obtained from a flexographic printing plate precursor comprising at least a support (A), a photosensitive resin layer (B) and a heat-sensitive mask layer (C) which are laminated in this order, characterized in that, when dots each having a diameter of 16 ?m are formed at 175 lpi on the printing plate, the dots do not buckle until a load of 0.2 N is applied thereto. Preferably, when dots each having a diameter of 16 ?m are formed at 175 lpi on the printing plate, the shoulder angle of each dot is 105 to 125° and the dot depth is 70 to 85 ?m.

Abstract: A flexographic printing plate obtained from a flexographic printing plate precursor includes at least a support, a photosensitive resin layer and a heat-sensitive mask layer laminated in this order, wherein the composite elastic modulus of each dot is 30 to 80 Mpa and the composite elastic modulus of each solid-printed part is 5 to 15 MPa. A photosensitive resin composition constituting the photosensitive resin layer includes a polymer prepared by polymerizing a conjugated diene, an ethylenically unsaturated compound and a photopolymerization initiator, wherein the content of the photopolymerization initiator is 2 to 9% by mass, the ethylenically unsaturated compound includes a (meth)acrylate compound having a number average molecular weight of 100 to 600 in a content of 5 to 16% by mass, and the ratio of the mass of the photopolymerization initiator and the mass of the compound is within the range of 0.20 to 0.55.

Abstract: The present invention provides a flexographic printing plate in which the problem of ink entanglement, i.e., the direct connection of ink on a dot convex part to ink on an adjacent dot convex part, is reduced. A flexographic printing plate obtained from a flexographic printing plate precursor comprising at least a support (A), a photosensitive resin layer (B) and a heat-sensitive mask layer (C) which are laminated in this order, wherein, on a surface of the printing plate, there are provided dot convex parts, a dot valley part formed between the dot convex parts, and a floor part, and wherein a side surface of the dot valley part and the floor part have been subjected to the same finishing exposure treatment and the same exposure treatment using a germicidal lamp, characterized in that the adhesion force of the floor part on the printing plate is 2.0 N/mm2 or less.

Abstract: The present invention provides a flexographic printing plate precursor which makes it possible to precisely reproduce the pattern of a microcell on the surface of a printing plate without requiring the use of any specialized device or any additional step, and thus to improve the ink laydown on a solid-printed part. A flexographic printing plate precursor comprising at least a support (A), a photosensitive resin layer (B), an oxygen barrier layer (C) and a heat-sensitive mask layer (D) which are laminated in this order, wherein a photosensitive resin composition constituting the photosensitive resin layer (B) comprises (a) a polymer prepared by polymerizing a conjugated diene, (b) an ethylenically unsaturated compound and (c) a photopolymerization initiator, and wherein the content of the photopolymerization initiator (c) in the photosensitive resin composition is 2 to 9% by mass.

Abstract: [Problem] The objective of the present invention is to provide an elastic mesh structure having exceptional cushioning and reducing noise during compression or recovery. [Solution] A mesh structure comprising a three-dimensional, random-loop, joining structure formed by winding a continuous line of thermoplastic resin to form random loops, bringing the loops into contact with one another in a molten state, and fusing the majority of the contact area, wherein (a) the apparent density of the random-loop contact structure is 0.005-0.200 g/cm3, and (b) the number of contact points per unit weight of the random-loop contact structure is 500-1200/g.

Abstract: A relief printing original plate for rotary letterpress printing wherein at least an adhesive layer, a photosensitive resin layer and a cover film are successively layered on a support, wherein the photosensitive resin layer contains at least a synthetic rubber-based polymer, a photopolymerizable unsaturated compound and a photopolymerization initiator, and Shore A hardness of a surface of the photosensitive resin layer after photo-curing is 80 to 95. Preferably, the synthetic rubber-based polymer is a hydrophobic polymer obtained from a water-dispersible latex having a weight-average gelation degree of 50 to 80%. Preferably, the photosensitive resin layer contains 20 to 70% by mass of the synthetic rubber-based polymer. The relief printing original plate is suitably used for a rotary printing machine of a center drum type.

Abstract: A relief printing original plate for rotary letterpress printing wherein at least an adhesive layer, a photosensitive resin layer and a cover film are successively layered on a support, wherein the photosensitive resin layer contains at least a synthetic rubber-based polymer, a photopolymerizable unsaturated compound and a photopolymerization initiator, and Shore A hardness of a surface of the photosensitive resin layer after photo-curing is 80 to 95. Preferably, the synthetic rubber-based polymer is a hydrophobic polymer obtained from a water-dispersible latex having a weight-average gelation degree of 50 to 80%. Preferably, the photosensitive resin layer contains 20 to 70% by mass of the synthetic rubber-based polymer. The relief printing original plate is suitably used for a rotary printing machine of a center drum type.

Abstract: A non-woven fabric which is excellent in thermal resistance, mechanical strength, and thermal dimensional stability for applications exposed to high temperature circumstance and has an extremely large surface area and exhibit an excellent filter performance is obtained. The non-woven fabric is composed of polyimide fibers which are obtained by polycondensation of at least an aromatic tetracarboxylic acid and an aromatic diamine having a benzoxazole structure and have a fiber diameter in the range of 0.001 ?m to 1 ?m. The non-woven fabric is obtained by the steps of preparing a polyamic acid by polycondensation of an aromatic tetracarboxylic acid and an aromatic diamine having a benzoxazole structure, and electro-spinning the polyamic acid to form a polyimide precursor non-woven fabric; and imidizing a polyimide precursor fiber bundle.

Abstract: The present invention provides a fiber having a nano-order fiber diameter, which is produced by without a process of dehydration and cyclization by a heat treatment after fiber spinning and has excellent heat resistance and mechanical strength, and a non-woven fabric composed of the fiber, and discloses the polyamide-imide fiber and the non-woven fabric having an average fiber diameter of from 0.001 ?m to 1 ?m and also discloses the process for producing threrof. The present invention also provides a separator for an electronic component which has a high conductivity and a small separator thickness and is improved in safety during reflow soldering or short-circuiting, and discloses the separator composed of a non-woven fabric obtained by an electro-spinning method.

Abstract: [Problem] The objective of the present invention is to provide an elastic mesh structure having exceptional cushioning and reducing noise during compression or recovery. [Solution] A mesh structure comprising a three-dimensional, random-loop, joining structure formed by winding a continuous line of thermoplastic resin to form random loops, bringing the loops into contact with one another in a molten state, and fusing the majority of the contact area, wherein (a) the apparent density of the random-loop contact structure is 0.005-0.200 g/cm3, and (b) the number of contact points per unit weight of the random-loop contact structure is 500-1200/g.

Abstract: A polishing pad enabling a highly precise optical endpoint sensing during the polishing process and thus having excellent polishing characteristics (such as surface uniformity and in-plane uniformity) is disclosed. A polishing pad enabling to obtain the polishing profile of a large area of a wafer is also disclosed. A polishing pad of a first invention comprises a light-transmitting region having a transmittance of not less than 50% over the wavelength range of 400 to 700 nm. A polishing pad of a second invention comprises a light-transmitting region having a thickness of 0.5 to 4 mm and a transmittance of not less than 80% over the wavelength range of 600 to 700 nm. A polishing pad of a third invention comprises a light-transmitting region arranged between the central portion and the peripheral portion of the polishing pad and having a length (D) in the diametrical direction which is three times or more longer than the length (L) in the circumferential direction.

Abstract: A polishing pad generates very few scratches on a surface of a polishing object, and is excellent in planarization property. The polishing pad has a high polishing rate and is excellent in planarization property. The polishing pad grooves become very little clogged with abrasive grains or polishing swarf during polishing and, even when continuously used for a long period of time, the polishing rate is scarcely reduced.

Abstract: A polishing pad generates very few scratches on a surface of a polishing object, and is excellent in planarization property. The polishing pad has a high polishing rate and is excellent in planarization property. The polishing pad grooves become very little clogged with abrasive grains or polishing swarf during polishing and, even when continuously used for a long period of time, the polishing rate is scarcely reduced.

Abstract: A polishing pad generates very few scratches on a surface of a polishing object, and is excellent in planarization property. The polishing pad has a high polishing rate and is excellent in planarization property. The polishing pad grooves become very little clogged with abrasive grains or polishing swarf during polishing and, even when continuously used for a long period of time, the polishing rate is scarcely reduced.

Abstract: The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.

Abstract: A polishing pad has an excellent polishing rate and is superior in longevity without generating center slow. A method of manufacturing a semiconductor device with the polishing pad is also provided. The polishing pad has a polishing layer consisting of a polyurethane foam having fine cells, wherein a high-molecular-weight polyol component that is a starting component of the polyurethane foam contains a hydrophobic high-molecular-weight polyol A having a number-average molecular weight of 550 to 800 and a hydrophobic high-molecular-weight polyol B having a number-average molecular weight of 950 to 1300 in an A/B ratio of from 10/90 to 50/50 by weight.

Abstract: A polishing pad generates very few scratches on a surface of a polishing object, and is excellent in planarization property. The polishing pad has a high polishing rate and is excellent in planarization property. The polishing pad grooves become very little clogged with abrasive grains or polishing swarf during polishing and, even when continuously used for a long period of time, the polishing rate is scarcely reduced.

Abstract: A method for manufacturing a polishing pad made from a polyurethane resin foam having very uniform, fine cells therein and a polishing pad obtained by that method provides a polishing pad having better polishing characteristics (especially, in planarization) while providing improved dressability while maintaining the planarization characteristics and polishing speed of a conventional polishing pad. The polyurethane resin foam is a cured product obtained by reacting an isocyanate-terminated prepolymer with an aromatic polyamine chain extender having a melting point of 70° C. or lower, for example.

Abstract: A polishing pad generates very few scratches on a surface of a polishing object, and is excellent in planarization property. The polishing pad has a high polishing rate and is excellent in planarization property. The polishing pad grooves become very little clogged with abrasive grains or polishing swarf during polishing and, even when continuously used for a long period of time, the polishing rate is scarcely reduced.

Abstract: It is an object of the invention to provide a polishing pad capable of high precision optical detection of an endpoint during polishing in progress and prevention of slurry leakage from between a polishing region and a light-transmitting region during the use thereof even after the polishing pad has been used for a long period. It is a second object of the invention to provide a polishing pad capable of suppression of deterioration of polishing characteristics (such as in-plane uniformity) and generation of scratches due to a difference in behavior of a polishing region and a light-transmitting region during polishing. It is a third object of the invention to provide a polishing pad having a polishing region and a light-transmitting region with a concentration of a specific metal equal to or lower than a specific value (threshold value).