Patents by Inventor Masahiko Ogima

Masahiko Ogima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6361866
    Abstract: Provided are a halogen-free and phosphorus-free prepreg having good flame retardancy and having excellent electric characteristics and heat resistance, and a laminated board. The prepreg is formed of a resin composition comprising, as essential components, a phenol compound (I) having a structural unit of the formula (1), wherein R1 is hydrogen or phenol, R2 is a hydrogen or methyl and n is an integer of 0 to 10, an epoxy resin (II) prepared by epoxidizing the same phenol compound as said phenol compound, a metal hydrate (III) and a molybdenum compound (IV), and a substrate which is impregnated with said resin composition or to which said resin composition is applied. The laminated board for an insulating material, which is formed of the prepreg.
    Type: Grant
    Filed: March 13, 2000
    Date of Patent: March 26, 2002
    Assignees: Mitsubishi Gas Chemical Company, Inc., The Sherwin-Williams Company
    Inventors: Masahiko Ogima, Takeshi Narushima, Norio Nagai