Patents by Inventor Masahiko Ohiro

Masahiko Ohiro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
    Patent number: 6984880
    Abstract: A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof. The frame rail and the internal inner leads are retained by a lead retaining member on their upper and/or lower surface(s).
    Type: Grant
    Filed: November 7, 2003
    Date of Patent: January 10, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masanori Minamio, Fumihiko Kawai, Masahiko Ohiro, Masanori Koichi, Yoshinori Satoh, Akira Oga, Toshiyuki Fukuda
  • Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
    Publication number: 20040094829
    Abstract: A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof. The frame rail and the internal inner leads are retained by a lead retaining member on their upper and/or lower surface(s).
    Type: Application
    Filed: November 7, 2003
    Publication date: May 20, 2004
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masanori Minamio, Fumihiko Kawai, Masahiko Ohiro, Masanori Koichi, Yoshinori Satoh, Akira Oga, Toshiyuki Fukuda
  • Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
    Patent number: 6720207
    Abstract: A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof. The frame rail and the internal inner leads are retained by a lead retaining member on their upper and/or lower surface(s).
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: April 13, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masanori Minamio, Fumihiko Kawai, Masahiko Ohiro, Masanori Koichi, Yoshinori Satoh, Akira Oga, Toshiyuki Fukuda
  • Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
    Publication number: 20020109214
    Abstract: A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof. The frame rail and the internal inner leads are retained by a lead retaining member on their upper and/or lower surface(s).
    Type: Application
    Filed: October 9, 2001
    Publication date: August 15, 2002
    Inventors: Masanori Minamio, Fumihiko Kawai, Masahiko Ohiro, Masanori Koichi, Yoshinori Satoh, Akira Oga, Toshiyuki Fukuda