Patents by Inventor Masahiko Sano
Masahiko Sano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240363795Abstract: A semiconductor optical element includes a first indirect transition type semiconductor portion including a first conductivity type impurity at a first concentration, a second indirect transition type semiconductor portion including the first conductivity type impurity at a second concentration, a third indirect transition type semiconductor portion including a second conductivity type impurity at a third concentration, a fourth indirect transition type semiconductor portion including the second conductivity type impurity at a fourth concentration, and a fifth indirect transition type semiconductor portion including the second conductivity type impurity at a fifth concentration, in this order. The third indirect transition type semiconductor portion and the fourth indirect transition type semiconductor portion are in contact with each other. The first concentration is higher than the second concentration. The third concentration is higher than the fourth concentration.Type: ApplicationFiled: April 24, 2024Publication date: October 31, 2024Applicant: NICHIA CORPORATIONInventor: Masahiko SANO
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Publication number: 20230343909Abstract: A light emitting apparatus includes: a mount substrate; one or more light emitting devices located above the mount substrate; a light conversion member located above the one or more light emitting devices; and a covering member that contains a light reflective material and covers the one or more light emitting devices. The light conversion member includes: a light emission surface facing upward, a lateral surface facing laterally, and a light receiving surface facing downward. The covering member covers the lateral surface of the light conversion member, and is interposed between the mount substrate and the one or more light emitting devices.Type: ApplicationFiled: June 29, 2023Publication date: October 26, 2023Applicant: NICHIA CORPORATIONInventors: Shunsuke MINATO, Masahiko SANO
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Publication number: 20230268471Abstract: A light emitting device including a first light emitting element and an optical member disposed over the first light emitting element. The optical member includes a light transmissive member and a ceramic component. The light transmissive member has a first upper surface, a second upper surface, and a lower surface opposing to the first upper surface and a second upper surface. The ceramic component is disposed on the second upper surface of the light transmissive member. The light transmissive member and the ceramic component each has a portion that overlaps with the first light emitting element when viewed in plan view.Type: ApplicationFiled: April 26, 2023Publication date: August 24, 2023Applicant: NICHIA CORPORATIONInventors: Masakatsu TOMONARI, Masahiko SANO
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Patent number: 11735699Abstract: A light emitting apparatus includes: a mount substrate; at least one light emitting device mounted on the mount substrate; a light transparent member, wherein a lower surface of the light transparent member is attached to an upper surface of the at least one light emitting device via at least one adhesive material layer, wherein the light transparent member has a plate shape and is positioned to receive incident light emitted from the light emitting devices, and wherein a lateral surface of the light transparent member is located laterally inward of a lateral surface of the at least one light emitting device; and a covering member that contains a light reflective material and covers at least the lateral surface of the light transparent member.Type: GrantFiled: January 12, 2022Date of Patent: August 22, 2023Assignee: NICHIA CORPORATIONInventors: Shunsuke Minato, Masahiko Sano
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Patent number: 11670746Abstract: A light emitting device including a mounting board, one or more light emitting elements, a light transmissive member, and a light reflective member. The light emitting element(s) are mounted on the mounting board, and each include an upper surface. The light transmissive member is bonded to the upper surface of each of the light emitting element(s). The light transmissive member has an upper surface and a lower surface, and allows light from the light emitting element(s) to be incident on the lower surface of the light transmissive member and to be output from the upper surface of the light transmissive member. The light reflective member covers surfaces of the light transmissive member and lateral surfaces of the light emitting element(s) and exposes the upper surface of the light transmissive member. At least a first portion of the mounting board is exposed from the light reflective member in a plan view.Type: GrantFiled: January 28, 2021Date of Patent: June 6, 2023Assignee: NICHIA CORPORATIONInventors: Masakatsu Tomonari, Masahiko Sano
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Patent number: 11640957Abstract: A light emitting module includes a substrate, a light reflective resin layer, wiring electrodes and a light emitting element. The light reflective resin layer is arranged on the substrate. The wiring electrodes are arranged over the substrate with the light reflective resin layer being interposed between the substrate and the wiring electrodes. The light emitting element has an electrode formation surface including a positive and negative pair of element electrodes, and a light emitting surface on a side opposite to the electrode formation surface. The light emitting element is arranged on top surfaces of the wiring electrodes with the element electrodes facing the top surfaces of the wiring electrodes.Type: GrantFiled: December 9, 2020Date of Patent: May 2, 2023Assignee: NICHIA CORPORATIONInventors: So Sakamaki, Yasunori Nagahama, Masahiko Sano, Katsuyoshi Kadan
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Patent number: 11585494Abstract: A fluorescent module includes a fluorescent member including a phosphor-containing layer, and a light reflecting layer disposed on the phosphor-containing layer. The phosphor-containing layer contains a YAG phosphor and a Ga-YAG phosphor within the same layer, the Ga-YAG phosphor being a phosphor in which a portion of the aluminum constituting the YAG phosphor is substituted with gallium. A volumetric ratio of the Ga-YAG phosphor to the entirety of the YAG phosphor and the Ga-YAG phosphor is in a range of 19.0% to 80%.Type: GrantFiled: August 24, 2021Date of Patent: February 21, 2023Assignee: NICHIA CORPORATIONInventors: Takafumi Sugiyama, Toshiyuki Hirai, Masahiko Sano, Toru Takasone
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Patent number: 11410975Abstract: A method of manufacturing a display device 1 includes: providing a substrate including at least one sub-pixel defined therein and a first wiring disposed for the sub-pixel, and the light-emitting element that includes a first electrode disposed on a lower surface and a second electrode disposed on at least two lateral surfaces intersecting with each other; mounting the light-emitting element on the substrate and electrically connecting the first electrode to the first wiring; forming a resin member covering the at least one light-emitting element, on the substrate, exposing a portion of the second electrode from an upper surface of the resin member by removing an upper portion of the resin member; and forming a second wiring with a mesh shape on the resin member such that a portion of the second wiring is disposed on the light-emitting element to electrically connect the second wiring to the second electrode.Type: GrantFiled: February 20, 2020Date of Patent: August 9, 2022Assignee: NICHIA CORPORATIONInventors: Kinya Ichikawa, Katsuyoshi Kadan, Masahiko Sano, Ryohei Hirose, Hiroshi Yoneda
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Patent number: 11362246Abstract: A method of manufacturing a display device 1 includes: providing a substrate including sub-pixel defined therein and a first wiring disposed for the sub-pixel, and light-emitting element having a lower surface and a lateral surface and including a first electrode disposed on the lower surface, and a second electrode disposed on the lateral surface; mounting the light-emitting element and electrically connecting the first electrode to the first wiring; forming a resin member on the substrate and covering the light-emitting element; exposing an upper portion of the light-emitting element from an upper surface of the resin member such that the second electrode is partially exposed by removing an upper portion of the resin member; and forming a second wiring on the upper surface of the resin member excluding a portion of the light-emitting element exposed from the resin member and electrically connecting the second wiring to the second electrode.Type: GrantFiled: February 20, 2020Date of Patent: June 14, 2022Assignee: NICHIA CORPORATIONInventors: Kinya Ichikawa, Katsuyoshi Kadan, Masahiko Sano, Ryohei Hirose, Hiroshi Yoneda
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Publication number: 20220140212Abstract: A light emitting apparatus includes: a mount substrate; at least one light emitting device mounted on the mount substrate; a light transparent member, wherein a lower surface of the light transparent member is attached to an upper surface of the at least one light emitting device via at least one adhesive material layer, wherein the light transparent member has a plate shape and is positioned to receive incident light emitted from the light emitting devices, and wherein a lateral surface of the light transparent member is located laterally inward of a lateral surface of the at least one light emitting device; and a covering member that contains a light reflective material and covers at least the lateral surface of the light transparent member.Type: ApplicationFiled: January 12, 2022Publication date: May 5, 2022Applicant: NICHIA CORPORATIONInventors: Shunsuke MINATO, Masahiko SANO
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Patent number: 11257996Abstract: A light emitting apparatus includes: a mount substrate; a first light emitting device mounted on the mount substrate; a light transparent member, wherein a lower surface of the light transparent member is attached to an upper surface of the first light emitting device via an adhesive material, wherein the light transparent member has a plate shape and is positioned to receive incident light emitted from the first light emitting device, and wherein a first lateral surface of the light transparent member is located laterally inward of a lateral surface of the first light emitting device; and a covering member that contains a light reflective material and covers at least the lateral surface of the light transparent member.Type: GrantFiled: November 26, 2019Date of Patent: February 22, 2022Assignee: NICHIA CORPORATIONInventors: Shunsuke Minato, Masahiko Sano
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Publication number: 20210381662Abstract: A fluorescent module includes a fluorescent member including a phosphor-containing layer, and a light reflecting layer disposed on the phosphor-containing layer. The phosphor-containing layer contains a YAG phosphor and a Ga-YAG phosphor within the same layer, the Ga-YAG phosphor being a phosphor in which a portion of the aluminum constituting the YAG phosphor is substituted with gallium. A volumetric ratio of the Ga-YAG phosphor to the entirety of the YAG phosphor and the Ga-YAG phosphor is in a range of 19.0% to 80%.Type: ApplicationFiled: August 24, 2021Publication date: December 9, 2021Inventors: Takafumi SUGIYAMA, Toshiyuki HIRAI, Masahiko SANO, Toru TAKASONE
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Patent number: 11131433Abstract: A fluorescent module includes a fluorescent member, a heat dissipation member, and an optical relaxation member. The fluorescent member includes a phosphor-containing layer, and a light reflecting layer. The fluorescent member is secured to the heat dissipation member so that the light reflecting layer is arranged between the phosphor-contacting layer and the heat dissipation member. The optical relaxation member is configured to absorb and/or diffuse light. The optical relaxation member is arranged with respect to the fluorescent member so that the light reflecting layer is arranged between the phosphor-containing layer and the optical relaxation member.Type: GrantFiled: August 8, 2019Date of Patent: September 28, 2021Assignee: NICHIA CORPORATIONInventors: Takafumi Sugiyama, Toshiyuki Hirai, Masahiko Sano, Toru Takasone
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Publication number: 20210187928Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.Type: ApplicationFiled: March 10, 2021Publication date: June 24, 2021Inventors: Daisuke SANGA, Masatsugu ICHIKAWA, Shunsuke MINATO, Toru TAKASONE, Masahiko SANO
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Publication number: 20210151644Abstract: A light emitting device including a mounting board, one or more light emitting elements, a light transmissive member, and a light reflective member. The light emitting element(s) are mounted on the mounting board, and each include an upper surface. The light transmissive member is bonded to the upper surface of each of the light emitting element(s). The light transmissive member has an upper surface and a lower surface, and allows light from the light emitting element(s) to be incident on the lower surface of the light transmissive member and to be output from the upper surface of the light transmissive member. The light reflective member covers surfaces of the light transmissive member and lateral surfaces of the light emitting element(s) and exposes the upper surface of the light transmissive member. At least a first portion of the mounting board is exposed from the light reflective member in a plan view.Type: ApplicationFiled: January 28, 2021Publication date: May 20, 2021Applicant: NICHIA CORPORATIONInventors: Masakatsu TOMONARI, Masahiko SANO
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Patent number: 10974492Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.Type: GrantFiled: February 19, 2020Date of Patent: April 13, 2021Assignee: NICHIA CORPORATIONInventors: Daisuke Sanga, Masatsugu Ichikawa, Shunsuke Minato, Toru Takasone, Masahiko Sano
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Publication number: 20210091053Abstract: A light emitting module includes a substrate, a light reflective resin layer, wiring electrodes and a light emitting element. The light reflective resin layer is arranged on the substrate. The wiring electrodes are arranged over the substrate with the light reflective resin layer being interposed between the substrate and the wiring electrodes. The light emitting element has an electrode formation surface including a positive and negative pair of element electrodes, and a light emitting surface on a side opposite to the electrode formation surface. The light emitting element is arranged on top surfaces of the wiring electrodes with the element electrodes facing the top surfaces of the wiring electrodes.Type: ApplicationFiled: December 9, 2020Publication date: March 25, 2021Inventors: So SAKAMAKI, Yasunori NAGAHAMA, Masahiko SANO, Katsuyoshi KADAN
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Patent number: 10944030Abstract: A light emitting device includes one or more light emitting elements, a light transmissive member, and a light reflective member. The one or more light emitting elements each includes an upper surface. The light transmissive member has an upper surface and a lower surface. The light reflective member covers surfaces of the light transmissive member and lateral surfaces of the one or more light emitting elements so as to expose the upper surface of the light transmissive member. The upper surface area of the light transmissive member is smaller than a sum of the upper surface areas of the one or more light emitting elements, and the lower surface area of the light transmissive member is larger than a sum of the upper surface areas of the one or more light emitting elements.Type: GrantFiled: November 13, 2019Date of Patent: March 9, 2021Assignee: NICHIA CORPORATIONInventors: Masakatsu Tomonari, Masahiko Sano
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Patent number: RE49298Abstract: The present invention provides a light emitting element capable or realizing at least one of lower resistance, higher output, higher power efficiency (1 m/W), higher mass productivity and lower cost of the element using a light transmissive electrode for an electrode arranged exterior to the light emitting structure. A semiconductor light emitting element includes a light emitting section, a first electrode and a second electrode on a semiconductor structure including first and second conductive type semiconductor layers, the first and the second electrodes respectively including at least two layers of a first layer of a light transmissive conductive film conducting to the first and the second conductive type semiconductor and a second layer arranged so as to conduct with the first layer. First and second light transmissive insulating films are respectively arranged so as to overlap at least one part of the first and the second layers.Type: GrantFiled: April 5, 2019Date of Patent: November 15, 2022Assignee: NICHIA CORPORATIONInventors: Masahiko Sano, Takahiko Sakamoto, Keiji Emura, Katsuyoshi Kadan
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Patent number: RE49406Abstract: The present invention provides a light emitting element capable or realizing at least one of lower resistance, higher output, higher power efficiency (1 m/W), higher mass productivity and lower cost of the element using a light transmissive electrode for an electrode arranged exterior to the light emitting structure. A semiconductor light emitting element includes a light emitting section, a first electrode and a second electrode on a semiconductor structure including first and second conductive type semiconductor layers, the first and the second electrodes respectively including at least two layers of a first layer of a light transmissive conductive film conducting to the first and the second conductive type semiconductor and a second layer arranged so as to conduct with the first layer. First and second light transmissive insulating films are respectively arranged so as to overlap at least one part of the first and the second layers.Type: GrantFiled: July 10, 2019Date of Patent: January 31, 2023Assignee: NICHIA CORPORATIONInventors: Masahiko Sano, Takahiko Sakamoto, Keiji Emura, Katsuyoshi Kadan