Patents by Inventor Masahiko Takashima

Masahiko Takashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040058791
    Abstract: An electrically conductive roll including a center shaft, an electrically conductive elastic layer formed on an outer circumferential surface of the center shaft, and a resistance adjusting layer formed radially outwardly of the electrically conductive elastic layer, wherein the resistance adjusting layer is formed of a rubber composition which includes a rubber material, a thermoplastic resin having crosslinkable double bonds, at least one electron-conductive agent, at least one ion-conductive agent, and at least one electrically insulating filler, the thermoplastic resin, the at least one electron-conductive agent, the at least one ion-conductive agent, and the at least one electrically insulating filler being included in the rubber composition in respective amounts of 3-40 parts by weight, 10-150 parts by weight, not greater than 2 parts by weight, and 20-80 parts by weight, per 100 parts by weight of the rubber material.
    Type: Application
    Filed: August 27, 2003
    Publication date: March 25, 2004
    Applicant: Tokai Rubber Industries, Ltd.
    Inventors: Masahiko Takashima, Nobuya Yoshida, Satoshi Tatsumi, Tetsuya Itoh, Kenichi Tsuchiya, Jiro Iwashiro
  • Publication number: 20030180519
    Abstract: The oxygen-absorbing multi-layered structure of the present invention comprises an oxygen-absorbing thermoplastic resin layer containing an oxygen-absorbing composition, and an oxygen-permeable thermoplastic resin layer formed on at least one surface of the oxygen-absorbing layer. The oxygen-permeable layer is a stretched film comprising (A) a matrix polyolefin resin, (B) incompatible thermoplastic resin particles dispersible in the matrix polyolefin resin (A), and (C) inorganic powder. The matrix polyolefin resin (A) has a melting point at least 50° C. lower than that of the incompatible thermoplastic resin particles (B). With this oxygen-absorbing layer, the oxygen-absorbing multi-layered structure is improved in oxygen permeability, and is inhibited from being deteriorated in oxygen-absorbing speed even when the film thickness thereof is increased to such an extent as to prevent the exposure of the oxygen-absorbing composition.
    Type: Application
    Filed: February 25, 2003
    Publication date: September 25, 2003
    Inventors: Takashi Kashiba, Masahiko Takashima, Takahiro Seki
  • Publication number: 20020165326
    Abstract: The polyester-based resin composition of the present invention comprises a melt blend (C) consisting of a polyamide resin (A) and a polyester resin (B).
    Type: Application
    Filed: February 25, 2002
    Publication date: November 7, 2002
    Inventors: Masahiko Takashima, Koji Yamamoto, Hiroyuki Nanba
  • Patent number: 6319575
    Abstract: A polyester resin composition is produced by melt-kneading a mixture comprising a polyamide resin and a polyester resin, and a tricarboxylic acid compound. The polyamide resin is a polymerization product of a diamine component containing 70 mol % or more of m-xylylenediamine and a dicarboxylic acid component containing 70 mol % or more of adipic acid. The polyester resin is a polymerization product of a dicarboxylic acid component containing 70 mol % or more of an aromatic dicarboxylic acid and a diol component containing 70 mol % or more of an aliphatic diol. The incorporation of a tricarboxylic acid compound such as aromatic tricarboxylic acids and their anhydrides improves transparency and whitening resistance at moisture absorbing of films, sheets and thin-wall hollow containers without deteriorating their gas barrier properties.
    Type: Grant
    Filed: April 19, 2000
    Date of Patent: November 20, 2001
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Masahiko Takashima, Koji Yamamoto, Hisashi Shimazaki