Abstract: A compound represented by the following general formula (IA) or (IB) (R1 represents an electron withdrawing substituent, R2 and R3 represent a hydrogen atom or a halogen atom; R4 and R3 represent a hydrogen atom, an alkylcarbonyl group, or an alkylcarbonyloxymethyl group, and R6 represents a hydrogen atom or an alkyl group) or a salt thereof, and a reagent for measuring hydrogen peroxide comprising the compound or a salt thereof.

Abstract: A compound represented by the following general formula (IA) or (IB) (R1 represents an electron withdrawing substituent, R2 and R3 represent a hydrogen atom or a halogen atom; R4 and R3 represent a hydrogen atom, an alkylcarbonyl group, or an alkylcarbonyloxymethyl group, and R6 represents a hydrogen atom or an alkyl group) or a salt thereof, and a reagent for measuring hydrogen peroxide comprising the compound or a salt thereof.

Abstract: A polyester resin, polyester-imide resin or polyester-amide-imide resin dissolved in a solvent containing 60% by weight or more of at least one polyhydric alcohol derivative selected from the group consisting of R.sub.1 COO(CHR.sub.2 CH.sub.2 O).sub.n H, R.sub.1 COO(CHR.sub.2 CH.sub.2 O).sub.n COR.sub.3, R.sub.1 O(CHR.sub.2 CH.sub.2 O).sub.n COR.sub.3 and R.sub.1 O(CHR.sub.2 CH.sub.2 O).sub.n R.sub.4, wherein R.sub.1, R.sub.3 and R.sub.4 are independently lower alkyl, aryl or aralkyl; R.sub.2 is hydrogen or methyl; and n is an integer of 1 to 3, gives an electrical insulating coating having excellent storage stability and high resin concentration without causing defects of phenols when used as a solvent.

Abstract: An electrical insulating resin composition comprising a resin obtained by reacting (a) one or more tri- or higher polyhydric alcohols and/or tri- or higher polybasic acids, (b) one or more dihydric alcohols, (c) one or more dibasic acids, (d) one or more monobasic acids containing one or more aromatic rings in the molecule, and/or (e) one or more monohydric alcohols containing one or more aromatic rings in the molecule, and if desired (f) one or more compounds containing or being able to form one or more 5-membered imide rings, can give high solids varnishes without lowering the molecular weight of the resin produced. Said varnishes can give coating films excellent in heat resistance, flexibility and mechanical strengths.

Abstract: A resist image, which is excellent in adhesiveness and high in physicochemical strengths, can be obtained by using as a resist material a resin composition having such properties that when it is exposed to actinic rays, a latent image (cure-precursor) is formed therein, and when it is subjected to subsequent heating, only the latent image portion is selectively cured.An example of the above-mentioned resin composition is a latently curable epoxy resin composition composed essentially of (A) an epoxy resin prepolymer and (B) a compound having in the molecule at least two groups represented by the formulas (I) and/or (II), ##STR1## wherein R.sup.1, R.sup.2 and R.sup.3 are individually a hydrogen atom, an alkyl group or aryl group.

Abstract: A photosensitive resin composition consisting essentially of (A) a photo-polymerizable unsaturated compound having at least two terminal ethylene groups, (B) a reactive linear high molecular weight compound having in its side chain one or two functional groups selected from the class consisting of tetrahydrofurfuryl group and N-alkoxymethylcarbamoyl group, (C) a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (D) a compound having at least two epoxy groups, and (E) a potential or latent curing agent for epoxy resins. The photosensitive resin composition can give a protective film excellent in solvent resistance, chemical resistance, heat resistance and mechanical strengths, and hence can be used in the production of printed circuit boards and the precision-processing of metals.

Abstract: A photosensitive resin composition consisting of, or comprising as the essential components, (A) a photo-polymerizable unsaturated compound having at least two terminal ethylene groups, (B) a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (C) a compound containing at least two epoxy groups, and (D) a compound selected from the group consisting of dicyandiamide, p,p'-diaminodiphenyl compounds, polycarboxylic acids having at least two carboxyl groups, polycarboxylic anhydrides and mixtures of the polycarboxylic acids and the polycarboxlic anhydrides. The above photosensitive resin composition can give a protective film excellent in solvent resistance, chemical resistance, heat resistance and mechanical strengths, and hence, can be used in the production of printed circuit boards, precision-processing of metals and as materials for adhesives, paints, plastic relief and the like.