Abstract: In a current sensor having a magnetic gap, a main body is divided into a first case segment having a terminal and a second case segment. An opening is formed in the main body. A magnetic sensor element is mounted on an element mounting portion arranged on a surface of the first case segment, the surface attaching to the second case segment. The sensor element is electrically coupled with the terminal. A core holding portion is formed in the main body that surrounds the opening and the element mounting portion. A core having the magnetic gap is inserted in the core holding portion. The sensor element is arranged in the magnetic gap of the core on the element mounting portion. The sensor element can thereby be disposed accurately in the magnetic gap of the core, and detection accuracy of the current sensor can be increased.

Abstract: A current sensor for measuring an electric current flowing through a conductor includes a ring shaped magnetic core, a bare semiconductor chip, and a case. The magnetic core has a gap and surrounds the conductor. The bare semiconductor chip has a front surface and a vertical Hall effect element formed on the front surface. The bare semiconductor chip is arranged in the gap of the magnetic core to detect a magnetic field generated by the electric current. The magnetic core and the bare semiconductor chip are accommodated in the case. A back surface of the bare semiconductor chip is fixed in the case in such a manner that the front surface of the bare semiconductor chip is parallel to a direction of the magnetic field.

Abstract: A current sensor includes a busbar, a case, a connector, and a bare chip having a current detection circuit. The busbar has a crimp terminal at one end, a ring terminal at the other end, and a shunt resistor welded between the crimp and ring terminals. The shunt resistor is encapsulated in the case, and the busbar has an electrode exposed to a sealed inner room of the case. The connector has a connector body unitary with the case and has a connector terminal that is exposed to the inner room at one end and exposed to an outside of the connector body at the other end. The bare chip is arranged in the inner room of the case and wire-bonded to each of the busbar and the connector terminal.

Abstract: In a current sensor having a magnetic gap, a main body is divided into a first case segment having a terminal and a second case segment. An opening is formed in the main body. A magnetic sensor element is mounted on an element mounting portion arranged on a surface of the first case segment, the surface attaching to the second case segment. The sensor element is electrically coupled with the terminal. A core holding portion is formed in the main body that surrounds the opening and the element mounting portion. A core having the magnetic gap is inserted in the core holding portion. The sensor element is arranged in the magnetic gap of the core on the element mounting portion. The sensor element can thereby be disposed accurately in the magnetic gap of the core, and detection accuracy of the current sensor can be increased.

Abstract: A mounting structure of a current sensor includes: the current sensor including a detection portion; and a connection member for electrically connecting between a battery post of a battery and a harness. The current sensor is mounted on the connection member. The connection member includes a predetermined portion, a current density of which is higher than that of other portions of the connection member. The detection portion of the current sensor is disposed on the predetermined portion of the connection member when the current sensor is mounted on the connection member. The mounting structure may include a pair of holes, one for connection at the battery post, the other one for connection to the harness.

Abstract: A current detection apparatus includes a magnetic core having a ring shape with a gap and a center opening portion through which a current path is disposed, and a magnetic sensor including a magnetic sensing element such as a Hall effect element arranged in the gap. When a current flows through the current path, the magnetic core generates magnetic flux therein so that magnetic field is generated in the gap. The magnetic sensor outputs different electrical signals, each of which is measured in a different measurement range and corresponds to intensity of the magnetic field in the gap. The current detection apparatus measures the current based on the electrical signals outputted from the magnetic sensor.

Abstract: A current sensor for measuring an electric current flowing through a conductor includes a ring shaped magnetic core, a bare semiconductor chip, and a case. The magnetic core has a gap and surrounds the conductor. The bare semiconductor chip has a front surface and a vertical Hall effect element formed on the front surface. The bare semiconductor chip is arranged in the gap of the magnetic core to detect a magnetic field generated by the electric current. The magnetic core and the bare semiconductor chip are accommodated in the case. A back surface of the bare semiconductor chip is fixed in the case in such a manner that the front surface of the bare semiconductor chip is parallel to a direction of the magnetic field.

Abstract: A current sensor includes a busbar, a case, a connector, and a bare chip having a current detection circuit. The busbar has a crimp terminal at one end, a ring terminal at the other end, and a shunt resistor welded between the crimp and ring terminals. The shunt resistor is encapsulated in the case, and the busbar has an electrode exposed to a sealed inner room of the case. The connector has a connector body unitary with the case and has a connector terminal that is exposed to the inner room at one end and exposed to an outside of the connector body at the other end. The bare chip is arranged in the inner room of the case and wire-bonded to each of the busbar and the connector terminal.

Abstract: A pressure sensor includes a pressure detecting chamber sectionally formed by a diaphragm for receiving measured pressure and a semiconductor chip having a diaphragm as a pressure-sensitive portion is equipped in the pressure detecting chamber. Electrically insulating pressure transmitting liquid for transmitting the measured pressure received by the diaphragm to the semiconductor chip is sealingly filled in the pressure detecting chamber. Also, an electrical circuit for signal processing is equipped around the pressure-sensitive portion at the surface site of the semiconductor chip. The electrical circuit is coated by protection film. Electrical conducting film set to ground potential is formed as the uppermost layer of the semiconductor chip on the surface of the protection film.

Abstract: A current detection apparatus includes a magnetic core having a ring shape with a gap and a center opening portion through which a current path is disposed, and a magnetic sensor including a magnetic sensing element such as a Hall effect element arranged in the gap. When a current flows through the current path, the magnetic core generates magnetic flux therein so that magnetic field is generated in the gap. The magnetic sensor outputs different electrical signals, each of which is measured in a different measurement range and corresponds to intensity of the magnetic field in the gap. The current detection apparatus measures the current based on the electrical signals outputted from the magnetic sensor.

Abstract: A mounting structure of a current sensor includes: the current sensor including a detection portion; and a connection member for electrically connecting between a battery post of a battery and a harness. The current sensor is mounted on the connection member. The connection member includes a predetermined portion, a current density of which is higher than that of other portions of the connection member. The detection portion of the current sensor is disposed on the predetermined portion of the connection member when the current sensor is mounted on the connection member.

Abstract: A pressure sensor includes a pressure detecting chamber sectionally formed by a diaphragm for receiving measured pressure and a semiconductor chip having a diaphragm as a pressure-sensitive portion is equipped in the pressure detecting chamber. Electrically insulating pressure transmitting liquid for transmitting the measured pressure received by the diaphragm to the semiconductor chip is sealingly filled in the pressure detecting chamber. Also, an electrical circuit for signal processing is equipped around the pressure-sensitive portion at the surface site of the semiconductor chip. The electrical circuit is coated by protection film. Electrical conducting film set to ground potential is formed as the uppermost layer of the semiconductor chip on the surface of the protection film.

Abstract: A semiconductor pressure sensor in which a semiconductor sensor element is contained in a package which is made by assembling a first case and a second case, and which have simple structure with low cost. The semiconductor pressure sensor is generally made up of a sensor element made of semiconductor; a sensor case made of resin; plural leads insert-formed into the sensor case so as to be partly exposed from the sensor case, wherein the leads is electrically connected to the sensor element; and a connector case assembled with the sensor case for covering the sensor element. The connector case has a flange portion which is provided with a cover portion, and a surround portion protruding from the cover portion for surrounding an exposed portion of the leads. The surround portion and the exposed portion form a connecting portion which can be connected with an external terminal. Hence, connecting function of the sensor can be realized with simple structure without additional connecting members.

Abstract: An improved on-chip type filter for filtrating electromagnetic noise is disclosed. Within a sensor chip are provided processing and amplifying circuits, a ground pad, a power pad and an output pad. Also, within the sensor chip are disposed low pass filters between the power pad, the outpad and the circuits to filtrate electromagnetic noise. The lengths of aluminum wires connecting the power pad, the output pad and the low pass filters are shorter than the lengths of aluminum wires connecting the ground pad and the low pass filters. The aluminum wires connecting the power pad or the output pad and the low pass filters are uncrossed wires, which do not cross any other wires.