Abstract: A multilayer ceramic capacitor includes a second alloy portion including one metal element provided in a greatest amount among metal elements of an internal electrode layer, and one or more metal elements among a metal group including Sn, In, Ga, Zn, Bi, Pb, Cu, Ag, Pd, Pt, Ph, Ir, Ru, Os, Fe, V, and Y is provided between a second dielectric ceramic layer and a first internal electrode layer, and between a second dielectric ceramic layer and a second internal electrode layer, respectively.

Abstract: The present inventors discovered affinity purification resins having sufficient binding affinity for Fc region variants with reduced binding to Protein A. Specifically, immunoglobulins containing an Fc region variant having reduced binding to Protein A could be purified using a Protein A-modified ligand containing a structure in which the amino acids of the C-domain have been substituted as an Fc ligand.

Abstract: The present inventors discovered that additional aggregation of low-pI antibody can be suppressed by removing formed antibody aggregates after a certain period of time following Protein A column purification, acidic treatment, and neutralization. Furthermore, the present inventors found that efficient impurities removal for a low-pI antibody can be accomplished by using an anion exchange resin in the Bind/Elute mode and then a hydrophobic interaction chromatography or multimodal chromatography resin, compared with conventional methods.

Abstract: The present inventors discovered that additional aggregation of low-pI antibody can be suppressed by removing formed antibody aggregates after a certain period of time following Protein A column purification, acidic treatment, and neutralization. Furthermore, the present inventors found that efficient impurities removal for a low-pI antibody can be accomplished by using an anion exchange resin in the Bind/Elute mode and then a hydrophobic interaction chromatography or multimodal chromatography resin, compared with conventional methods.

Abstract: A transmission unit of a first device transmits, before transmitting at least one data packet including data to be transmitted located in a data region to another device, a first packet notifying that usage of a serial bus is to be started to a second device. The second device includes a flag register storing a bus usage flag representing a usage state of a serial bus. A reception unit of the second device sets the bus usage flag at an engaged state upon receiving the first packet. A transmission transmits a data packet to another device as long as the bus usage flag is not set at an engaged state.

Abstract: An apparatus (10) for melt-adhering resin pipes, comprising support means (11, 12) for supporting a resin pipe (1) engaged with a resin joint (2), and laser irradiation means (30) for irradiating a laser beam onto a portion of the resin pipe engaged with the resin joint. Further, an axial direction driving means and a circumferential direction driving means may be provided so that the laser irradiation means (30) moves in the circumferential direction and in the axial direction of the resin pipe.

Abstract: A crystal oscillator has: a crystal unit having a container body in which a crystal blank is housed and hermetically sealed; and a mounting substrate that houses an IC chip having at least an integrated oscillating circuit that uses the crystal unit. External terminals are formed as protrusions at four corners of the outer bottom surface of the container body, and depressions corresponding to the external terminals are formed at four corners of the top surface of the mounting substrate. Bonding terminals are formed at the inner bottom surface of the depressions. The mounting substrate is electrically and mechanically bonded to the outer bottom surface of the crystal unit by fitting the external terminals into the depressions and bonding the external terminals to the corresponding bonding terminals by soldering.

Abstract: A crystal oscillator has: a crystal unit having a container body in which a crystal blank is housed and hermetically sealed; and a mounting substrate that houses an IC chip having at least an integrated oscillating circuit that uses the crystal unit. External terminals are formed as protrusions at four corners of the outer bottom surface of the container body, and depressions corresponding to the external terminals are formed at four corners of the top surface of the mounting substrate. Bonding terminals are formed at the inner bottom surface of the depressions. The mounting substrate is electrically and mechanically bonded to the outer bottom surface of the crystal unit by fitting the external terminals into the depressions and bonding the external terminals to the corresponding bonding terminals by soldering.

Abstract: A light source unit includes an emission surface and a plurality of point light sources arranged on the emission surface. An optical system focuses a plurality of light beams emitted from the point light sources into a single light beam and irradiates a target object to be irradiated with the single light beam. The single light beam is obtained with a desired light intensity profile according to a combination of positions where the point light sources are arranged and intensity distributions of the light beams emitted from the point light sources.

Abstract: A resin composition for a harness part, which composition comprises (A) from 50 to 70% by weight polyamide composition comprising (A1) an unmodified polyamide 66 and (A2) a modified polyamide 6 having a terminal amino group content of 7.times.10.sup.-5 to 12.times.10.sup.-5 eq/g, with the weight ratio of the unmodified polyamide 66 (A1) to the modified polyamide 6(A2) being from 80/20 to 50/50 by weight, and (B) from 30 to 50% by weight polypropylene graft-polymerized with 0.3 to 0.6% by weight of maleic anhydride.