Patents by Inventor Masahiro Gooda

Masahiro Gooda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a number of solder layers on a semiconductor wafer
    Patent number: 4503597
    Abstract: A method of forming a number of discrete solder layers on a semiconductor wafer of a large area. A number of regions which are easy to be wetted with solder are formed on one of the major surfaces of the wafer. A solder foil is positioned on the one major surface and a plate-like jig including a plate and projections formed on one surface thereof is disposed on the solder foil with the projections facing the latter. By heating the stacked assembly at a sufficiently high temperature for the solder foil to be molten, a number of the discrete solder layers having a uniform thickness are formed on the semiconductor wafer.
    Type: Grant
    Filed: February 7, 1983
    Date of Patent: March 12, 1985
    Assignee: Hitachi, Ltd.
    Inventors: Tadao Kushima, Masahiro Gooda, Tasao Soga, Toshitaka Yamamoto
  • Thermal fatigue resistant low-melting point solder alloys
    Patent number: 4491562
    Abstract: This invention provides a thermal fatigue resistant, low-melting point solder alloy consisting of 13 to 20% by weight Bi, 42 to 50% by weight, Pb, the balance being Sn. This solder alloy is suited for lap joints of electronic parts into or onto a printed substrate or a hybrid substrate.
    Type: Grant
    Filed: June 7, 1983
    Date of Patent: January 1, 1985
    Assignee: Hitachi, Ltd.
    Inventors: Tasao Soga, Takaya Suzuki, Masahiro Okamura, Masahiro Gooda, Fumiyuki Kobayashi