Abstract: A protection circuit module for a secondary battery including a wiring substrate including two battery-side external connection terminals provided on a top surface thereof, multiple load-side external connection terminals provided on a back surface opposite the top surface, and at least one cutout or through-hole in the wiring substrate; one or more electronic components provided on the wiring substrate; and two metal plates provided respectively on the two battery-side external connection terminals. The at least one cutout or through-hole is provided at a portion of the wiring substrate in which one of the two metal plates is provided, so that a part of the one of the two metal plates is exposed through the cutout or the through-hole when viewed from the back surface of the wiring substrate.

Abstract: To realize reduction in the size and cost of a protection circuit module for a secondary battery. A protection circuit module 1 for a secondary battery has at least a wiring board 2 having multiple battery-side external terminals 4a and multiple load-side external terminals 20a, and semiconductor components 12 and 14 mounted on the wiring board 2. On the wiring board 2, the battery-side external terminals 4a are disposed on a surface 2a, and the load-side external terminals 20a are disposed on a surface 2b on the opposite side. The semiconductor components 12 and 14 have multiple external connection terminals 12a and 14a arranged on a single plane surface, and are mounted face-down in a bare-chip state on the surface 2a of the wiring board 2.

Abstract: A protection circuit module for a secondary battery including a wiring substrate including two battery-side external connection terminals provided on a top surface thereof, multiple load-side external connection terminals provided on a back surface opposite the top surface, and at least one cutout or through-hole in the wiring substrate; one or more electronic components provided on the wiring substrate; and two metal plates provided respectively on the two battery-side external connection terminals. The at least one cutout or through-hole is provided at a portion of the wiring substrate in which one of the two metal plates is provided, so that a part of the one of the two metal plates is exposed through the cutout or the through-hole when viewed from the back surface of the wiring substrate.

Abstract: A printed-circuit board and a circuit unit incorporating the circuit board. The printed-circuit board capable of achieving a suitable contact area of sealing resin includes a metal circuit pattern formed on a substrate, a plurality of mounting electrodes formed on the substrate for electrically connecting at least one electronic component, a resist layer of electrically insulating material disposed over the surface of the substrate having openings in the regions corresponding to the plurality of mounting electrodes, and plurality of external connecting terminals provided on edge portions of the substrate for connecting external devices. The resist layer is preferably formed only on the area surrounding the plurality of mounting electrodes inside a sealing region, the sealing region being resin sealed over the surface of the substrate. A circuit unit is also disclosed, including an electronic device and the above-mentioned printed-circuit board.

Abstract: A printed circuit board comprises a base substrate and an external interconnection terminal provided on the base substrate, wherein external interconnection terminal comprises a land formed on a front surface of the base substrate and a metal plate soldered upon the land via a solder layer, a through-hole being formed in the base substrate such that the through-hole penetrates through the land and through the base substrate, the through-hole being filled with a solder such that the solder in the through-hole extends in continuation to the solder layer connecting the metal plate to the land.

Abstract: A printed circuit board is disclosed that is able to prevent outflow of a potting resin out of a sealing region. The printed circuit board includes a conductive pattern formed on an insulating substrate, an electrode for connecting an electronic part to the conductive pattern, and a stripe-like resin-outflow-prevention dam arranged in a periphery of a resin-sealing region covering the electronic part. An outer side surface and an upper surface of the resin-outflow-prevention dam subtend an acute angle.

Abstract: A printed circuit board comprises a base substrate and an external interconnection terminal provided on the base substrate, wherein external interconnection terminal comprises a land formed on a front surface of the base substrate and a metal plate soldered upon the land via a solder layer, a through-hole being formed in the base substrate such that the through-hole penetrates through the land and through the base substrate, the through-hole being filled with a solder such that the solder in the through-hole extends in continuation to the solder layer connecting the metal plate to the land.

Abstract: To realize reduction in the size and cost of a protection circuit module for a secondary battery. A protection circuit module 1 for a secondary battery has at least a wiring board 2 having multiple battery-side external terminals 4a and multiple load-side external terminals 20a, and semiconductor components 12 and 14 mounted on the wiring board 2. On the wiring board 2, the battery-side external terminals 4a are disposed on a surface 2a, and the load-side external terminals 20a are disposed on a surface 2b on the opposite side. The semiconductor components 12 and 14 have multiple external connection terminals 12a and 14a arranged on a single plane surface, and are mounted face-down in a bare-chip state on the surface 2a of the wiring board 2.

Abstract: A printed-circuit board and a circuit unit incorporating the circuit board. The printed-circuit board capable of achieving a suitable contact area of sealing resin includes a metal circuit pattern formed on a substrate, a plurality of mounting electrodes formed on the substrate for electrically connecting at least one electronic component, a resist layer of electrically insulating material disposed over the surface of the substrate having openings in the regions corresponding to the plurality of mounting electrodes, and plurality of external connecting terminals provided on edge portions of the substrate for connecting external devices. The resist layer is preferably formed only on the area surrounding the plurality of mounting electrodes inside a sealing region, the sealing region being resin sealed over the surface of the substrate. A circuit unit is also disclosed, including an electronic device and the above-mentioned printed-circuit board.

Abstract: A semiconductor chip mounting board which improves reliability of electrical connection between a semiconductor chip mounted thereupon and a wiring pattern on a printed circuit board on which the semiconductor chip mounting board is mounted at low cost and in an easy manner. The semiconductor chip mounting board mounts a semiconductor chip on one surface of the board and forms a connecting pad electrically connecting with a wiring pattern of a printed circuit board on the other surface of the board. The semiconductor chip mounting board further forms on the other surface of the board a connection reinforcing pad, which is thicker than the connecting pad electrically connecting with the wiring pattern on the printed circuit board.

Abstract: A connection structure for producing both an electrical and a mechanical connection between an electrode pad on a semiconductor device and a printed circuit pattern on a printed circuit board includes a metal bump or a plating layer formed on the printed circuit pattern on the printed circuit board and/or on the electrode pad on the semiconductor device. The semiconductor device is connected to the printed circuit board using cold welding, compression bonding, or a combination of both in conjunction with sandwich materials. The semiconductor device can be separated from the printed circuit board without destroying the semiconductor device or the printed circuit board by releasing the pressure applied to the sandwich materials. Therefore, the semiconductor device can be removed from the printed circuit board to make necessary repairs and/or exchange parts, and then reconnected to the printed circuit board.