Abstract: A visual inspection apparatus includes a stage on which a FCBGA type semiconductor package having a lid is placed, a camera located above the stage, a coaxial illumination device located between the camera and the stage, an oblique illumination device located between the camera and the stage, and a control device. The control device is configured to irradiate the FCBGA type semiconductor package with illumination lights by the coaxial illumination device and the oblique illumination device, capture the FCBGA type semiconductor package by the camera to obtain the captured image, integrate a number of pixels of a predetermined pixel value by a binarization process of the captured image to obtain a determination value, and compare the determination value with a predetermined value to determine a non-defective product or a defective product.

Abstract: In accordance with the present invention, there is provided a method for depositing a lead-free tin alloy on a substrate. The substrate includes an external lead portion of a semiconductor device. The substrate is contacted with an electrolyte composition for depositing the lead-free tin alloy. Current is cyclically passed in a first direction through the electrolyte composition during ON-duty cycle portions to deposit the lead-free tin alloy on the substrate. The passing of current in the first direction through the electrolyte composition is cyclically prevented during OFF-duty cycle portions.