Abstract: A floor mat arranged in a working machine includes a floor portion, a wall portion arranged on a circumferential portion of the floor portion, and an opening portion arranged on a part of a connecting portion of the wall portion, the connecting portion connecting to the floor portion. The floor mat includes a mat main body arranged on the floor portion, a covering portion configured to cover the opening portion, and an connecting portion configured to connect the covering portion flexibly to a circumferential portion of the mat main body.

Abstract: The present invention provides a vapor deposition device including a novel alignment mechanism applicable to a large substrate, a vapor deposition method, and a method for manufacturing an organic electroluminescence element. The vapor deposition device of the present invention is a vapor deposition device for performing vapor deposition while transporting a substrate in a first direction, and includes: a mask; a substrate tray including a substrate-holding portion and a guide portion protruding from the substrate-holding portion to the mask side and disposed along the first direction; at least one distance meter disposed on a first end which is one end of the mask or the guide portion; and at least one driver coupled with a second end which is the other end of the mask. The at least one distance meter is configured to measure a distance between the at least one distance meter and the guide portion or the first end when the guide portion faces the first end.

Abstract: The present invention provides a vapor deposition device including a novel alignment mechanism applicable to a large substrate, a vapor deposition method, and a method for manufacturing an organic electroluminescence element. The vapor deposition device of the present invention is a vapor deposition device for performing vapor deposition while transporting a substrate in a first direction, and includes: a mask; a substrate tray including a substrate-holding portion and a guide portion protruding from the substrate-holding portion to the mask side and disposed along the first direction; at least one distance meter disposed on a first end which is one end of the mask or the guide portion; and at least one driver coupled with a second end which is the other end of the mask. The at least one distance meter is configured to measure a distance between the at least one distance meter and the guide portion or the first end when the guide portion faces the first end.

Abstract: A vapor deposition unit (1) includes a vapor deposition mask (50), a vapor deposition source (10), and a limiting plate unit (20). The limiting plate unit (20) includes (i) a plurality of first limiting plates (32) separated from each other in an X axis direction and (ii) a plurality of second limiting plates (42) disposed directly above the first limiting plates (32) in a plan view and separated from each other in the X axis direction. At least two second limiting plates (42) are arranged in the X axis direction for each first limiting plate (32).

Abstract: In an organic EL element including a positive electrode, a negative electrode, and a light emitting layer (recombination layer) provided between the positive electrode and the negative electrode, an electron transport layer and an electron injection layer are provided between the light emitting layer and the negative electrode, and are sequentially arranged in the direction from the light emitting layer to the negative electrode. A hole injection layer and a hole transport layer are provided between the light emitting layer and the positive electrode, and are sequentially arranged in the direction from the positive electrode to the light emitting layer. A buffer layer for suppressing the electron trapping properties is provided between the light emitting layer and the hole transport layer.

Abstract: Limit nozzles configured to restrict directivity of first, second and third vapor deposition particles discharged from first, second and third vapor deposition source openings toward a substrate in an in-plane direction are installed in the first, second and third vapor deposition source openings.

Abstract: The present invention relates to a vapor deposition device for forming a film on a substrate, including: a vapor deposition chamber; a vapor deposition unit including a vapor deposition mask provided with an opening for pattern formation; and a transport mechanism that is configured to transfer at least one of the substrate and the vapor deposition unit relative to the other in a first direction perpendicular to the normal direction of the vapor deposition mask and that is configured to cause the substrate to rest temporarily at a resting position relative to the vapor deposition unit. The substrate includes a vapor-deposition-target region, and the region does not overlap the opening of the vapor deposition mask when the substrate is at the resting position. The vapor deposition chamber is provided with a first vent and a second vent.

Abstract: A mask for a vapor deposition apparatus includes an outer frame; a first bar disposed on an inner side of the outer frame and fixed to the outer frame; and a pattern forming portion disposed on the outer frame and the first bar and fixed to the outer frame. The pattern forming portion includes a plurality of mask openings for pattern formation. Each of the plurality of mask openings is disposed along a first direction. The plurality of mask openings are disposed in a second direction orthogonal to the first direction. The first bar is positioned between adjacent two mask openings among the plurality of mask openings when viewed along a third direction orthogonal to the first direction and the second direction, and is in contact with the pattern forming portion.

Abstract: A vapor deposition device is provided with first and second vapor deposition sources, a common pipe that is connected to the first and second vapor deposition sources, a vapor deposition particle emission source that is connected to the common pipe and emits vapor deposition particles from each of the first and second vapor deposition sources, an exhaust valve that is connected to the vapor deposition particle emission source, and an exhaust pump that is connected to the exhaust valve.

Abstract: An organic EL display substrate includes a light-emitting region containing a plurality of pixels and a getter member. The getter member is disposed in at least part of the area around the light-emitting region.

Abstract: The present invention provides a mask for production of an organic EL element, an apparatus for producing an organic EL element, and a method for producing an organic EL element which can give reduced luminance unevenness and eased restrictions in the production apparatus. The mask of the present invention includes first to fourth opening regions arranged in a staggered pattern, the first, second, third, and fourth opening regions arranged in the given order in a first direction, the first, second, third, and fourth opening regions respectively including first, second, third, and fourth mask openings in a second direction perpendicular to the first direction, the mask including no mask openings on the side of the first opening region opposite to the third opening region, the first and second mask openings each having a shorter length in the first direction than each of the third and fourth mask openings.

Abstract: In an organic EL element including a positive electrode, a negative electrode, and a light emitting layer (recombination layer) provided between the positive electrode and the negative electrode, an electron transport layer and an electron injection layer are provided between the light emitting layer and the negative electrode, and are sequentially arranged in the direction from the light emitting layer to the negative electrode. A hole injection layer and a hole transport layer are provided between the light emitting layer and the positive electrode, and are sequentially arranged in the direction from the positive electrode to the light emitting layer. A buffer layer for suppressing the electron trapping properties is provided between the light emitting layer and the hole transport layer.

Abstract: The vapor deposition apparatus employs scanning vapor deposition, and includes a limiting component including a first plate portion; a second plate portion provided with a space from the first plate portion; and a joint portion combining the first plate portion with the second plate portion, the first plate portion being provided with an first opening, the second plate portion being provided with an second opening that faces the first opening, the vapor deposition apparatus including a first space between the first opening and the second opening, the vapor deposition apparatus including a second space between the first plate portion and the second plate portion, the first space being connected to the second space, the vapor deposition apparatus including a third space that is in the outside of the limiting component, the second space being connected to the third space.

Abstract: A mask for a vapor deposition apparatus includes an outer frame; a first bar disposed on an inner side of the outer frame and fixed to the outer frame; and a pattern forming portion disposed on the outer frame and the first bar and fixed to the outer frame. The pattern forming portion includes a plurality of mask openings for pattern formation. Each of the plurality of mask openings is disposed along a first direction. The plurality of mask openings are disposed in a second direction orthogonal to the first direction. The first bar is positioned between adjacent two mask openings among the plurality of mask openings when viewed along a third direction orthogonal to the first direction and the second direction, and is in contact with the pattern forming portion.

Abstract: The present invention provides a vapor deposition apparatus, a vapor deposition method, and a method for producing an organic electroluminescent element which can control the vapor deposition rate on the substrate in the entire vapor deposition region with excellent precision. The vapor deposition apparatus of the present invention that forms a film on a substrate includes a first thickness monitor; and a vapor deposition unit including a vapor deposition source, the apparatus being configured to perform vapor deposition while controlling the distance between a portion of the vapor deposition source designed to eject a vaporized material and a surface of the substrate on which the vapor deposition is performed, based on a measurement result from the first thickness monitor.

Abstract: The present invention provides a method for producing an organic EL element capable of shortening the film formation time while suppressing an increase in the blur width; and an organic EL display device. The method is for producing an organic EL element by scanning vapor deposition, in which one or more vapor deposition sources each are provided with ejection orifices that face the respective openings of a limiting plate, and the ejection orifices facing the same opening are spaced from each other to give a sum of distributions.

Abstract: The present invention provides a vapor deposition apparatus capable of preventing abnormal film formation due to scattering in vapor deposition streams; and a method for producing an organic electroluminescent element which includes forming a patterned thin film with the vapor deposition apparatus. The present invention relates to a vapor deposition apparatus that includes a vapor deposition source equipped with a nozzle that ejects vapor deposition particles; an integrated limiting plate equipped with a first limiting plate including an opening that is in front of the nozzle, and with second limiting plates placed in the opening in the first limiting plate; and a mask including slits. The present invention also relates to a method for producing electroluminescent elements that includes a vapor deposition step of forming a patterned thin film with the vapor deposition apparatus.

Abstract: The present invention relates to a vapor deposition device for forming a film on a substrate, including: a vapor deposition chamber; a vapor deposition unit including a vapor deposition mask provided with an opening for pattern formation; and a transport mechanism that is configured to transfer at least one of the substrate and the vapor deposition unit relative to the other in a first direction perpendicular to the normal direction of the vapor deposition mask and that is configured to cause the substrate to rest temporarily at a resting position relative to the vapor deposition unit. The substrate includes a vapor-deposition-target region, and the region does not overlap the opening of the vapor deposition mask when the substrate is at the resting position. The vapor deposition chamber is provided with a first vent and a second vent.

Abstract: The present invention provides a vapor deposition apparatus capable of preventing abnormal film formation due to scattering in vapor deposition streams; and a method for producing an organic electroluminescent element which includes forming a patterned thin film with the vapor deposition apparatus. The present invention relates to a vapor deposition apparatus that includes a vapor deposition source equipped with a nozzle that ejects vapor deposition particles; an integrated limiting plate equipped with a first limiting plate including an opening that is in front of the nozzle, and with second limiting plates placed in the opening in the first limiting plate; and a mask including slits. The present invention also relates to a method for producing electroluminescent elements that includes a vapor deposition step of forming a patterned thin film with the vapor deposition apparatus.

Abstract: The present invention provides a display device which inhibits deterioration in display quality caused by color mixture of luminescent layers. In a case where vapor deposition particles are deposited onto a substrate, P+2Lc?{(Ts×M+0.96×G×Wn)/(Ts?G)}+2Dm and 3 ?m?Dm ?5 ?m are satisfied, where “M” is a width of a mask opening, “Wn” is a width of an injection hole, “G” is a distance between the TFT substrate and a vapor deposition mask, “Ts” is a distance between the TFT substrate and a vapor deposition source, “P” is a width of a first pixel opening, and “Lc” is a width of a non-display region.